Umzekelo: Iibhodi zeSekethe eziprintiweyo zeFR4
Isicelo semveliso: I-Smartphone
Izintlu zeBhodi: Izixhobo ezininzi
Izinto ezisisiseko: Polyimide(PI)
Ngaphakathi Cu ubukhulu: 18um
Ubukhulu beQuter Cu: 35um
Umbala wefilimu yekhava: Mthubi
Umbala wemaski yeSolder: Mthubi
Silkscreen: Mhlophe
Unyango lomphezulu: ENIG
Ubukhulu be-FPC: 0.26 +/-0.03mm
Uhlobo lwe-Stiffener: FR4, PI
Min Ububanzi bomgca/isithuba: 0.1/0.1mm
Umngxuma omncinci: 0.15mm
Umngxuma oyimfama:/
Umngxuma ongcwatywe:/
Ukunyamezela umngxuma (nm): PTH: 士 imathiriyeli: 士0.05
lAmaleyi ebhodi:/
