ICAPEL FPC & Flex-Rigid PCB Production Capability
| Imveliso | Ukuxinana okuphezulu | |||
| Uqhagamshelwano (HDI) | ||||
| Iisekethe ezisemgangathweni zeFlex | Iisekethe eziFlethi eziguquguqukayo | I-Rigid Flex Circuit | Ukutshintsha kweMembrane | |
| Ubungakanani bePhaneli yoMgangatho | 250mm X 400mm | Roll ifomathi | 250mmX400mm | 250mmX400mm |
| ububanzi bomgca kunye neSithuba | 0.035mm 0.035mm | 0 .010"(0.24mm) | 0.003"(0.076mm) | 0.10"(.254mm) |
| Ukutyeba kobhedu | 9um/12um/18um/35um/70um/100um/140um | 0.028mm-.01mm | 1/2 oz.nangaphezulu | 0.005"-.0010" |
| Ukubala koMaleko | 1-32 | 1-2 | 2-32 | 1-2 |
| VIA / DILL UBUKHULU | ||||
| Ubuncinci boMgobo (oomatshini) boMngxuma weDamitha | 0.0004" ( 0.1 mm ) 0.006" ( 0.15 mm ) | N / A | 0.006" ( 0.15 mm) | 10 mill (0.25 mm) |
| Ubuncinci nge (Laser) Ubungakanani | 4 mil (0.1mm) 1 mil (0.025 mm) | N / A | 6 mil (0.15 mm) | N / A |
| Ubuncinci beMicro Via (Laser) Ubungakanani | 3 mil (0.076 mm) 1 mil ( 0.025 mm) | N / A | 3 mil (0.076 mm) | N / A |
| Izinto eziStiffener | Polyimide / FR4 / Metal / SUS / Alu | I-PET | FR-4 / Poyimide | I-PET / isinyithi / i-FR-4 |
| Izinto Zokukhusela | Ubhedu / isilivere Lnk / Tatsuta / Carbon | I-Silver Foil/iTatsuta | Ubhedu / iSilver Ink/Tadduta / Carbon | I-Silver Foil |
| Isixhobo sezixhobo | 2 mil ( 0.051 mm) 2 mil ( 0.051 mm) | 10 mill (0.25mm) | 2 mil (0.51 mm) | 5 mil (0.13 mm) |
| Zif Ukunyamezela | 2 mil ( .051 mm ) 1 mil ( 0.025 mm ) | 10 mill (0.25mm) | 2 mil (0.51 mm) | 5 mil (0.13 mm) |
| IMASIKI YASOLDER | ||||
| Ibhulorho yeMaski yeSolder phakathi kweDama | 5 mil ( .013 mm ) 4 mil (0 .01mm ) | N / A | 5 mil (0.13 mm) | 10 mill (0.25mm) |
| Ukunyamezela ukuBhaliswa kweMaski yeSolder | 4 mil ( .010 mm ) 4 mil( 0.01mm ) | N / A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| UKUKHUSELEKA | ||||
| Ubhaliso lwe-Coverlay | 8 mil 5 | I-10 yezigidi | 8 mil | I-10 yezigidi |
| Ukubhaliswa kwePIC | 7 mil 4 | N / A | 7 mil | N / A |
| Ukubhaliswa kweMaski yeSolder | 5 mil 4 | N / A | 5 mil | 5 mil |
| Umphezulu Gqiba | ENIG/Ukuntywiliselwa iSilver/Itoti yokuntywiliselwa/iGolide yoKutyabeka/iTin yokucwenga/iOSP/ ENEPIG | |||
| Intsomi | ||||
| Ubuncinci ubude | 35 mil 25 mil | 35 mil | 35 mil | Isakhelo soMzobo |
| Ubuncinci ububanzi | 8 mil 6 | 8 mil | 8 mil | |
| Ubuncinci besithuba | 8 mil 6 | 8 mil | 8 mil | |
| Ubhaliso | ±5mil ±5mil | ±5mil | ±5mil | |
| Impedance | ±10% ±10% | ±20% | ±10% | NA |
| SRD ( Steel Rule Die ) | ||||
| Ukunyamezelana | 5 mil ( 0.13 mm) 2 mil ( 0.051 mm) | N / A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| Ubuncinane berediyasi | 5 mil (0.13 mm) 4 mil ( 0.10 mm) | N / A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| Ngaphakathi kwiRadiyosi | 20 mil ( 0.51 mm) 10 mil ( 0.25 mm) | N / A | 31 mil | 20 mill (0.51 mm) |
| Ngenqindi ubuncinci bobungakanani bomngxuma | 40 mil ( 10.2 mm) 31.5 mil ( 0.80 mm) | N / A | N / A | 40 mil (1.02 mm) |
| Ukunyamezela kwePunch Hole Ubungakanani | ± 2mil ( 0.051 mm) ± 1 mil | N / A | N / A | ± 2 mil ( 0.051 mm) |
| Slot Ububanzi | 20 mil ( 0.51 mm) 15 mil ( 0.38 mm) | N / A | 31 mil | 20 mill (0.51 mm) |
| I-Toleranc yomngxuma wokuchaza | ± 3 mil ± 2 mil | N / A | ± 4 mill | I-10 yezigidi |
| Ukunyamezela komngxuma kumngxuma wokuchaza | ± 4 mil ± 3 mil | N / A | ±5 yezigidi | I-10 yezigidi |
| Ubuncinci bomkhondo ukuya kulwandlalo | 8 mil 5mil | N / A | I-10 yezigidi | I-10 yezigidi |
I-CAPEL PCB yeMveliso yeZakhono
| IiParameters zobuGcisa | ||
| Hayi. | Iprojekthi | Iimpawu zobugcisa |
| 1 | Umaleko | 1-60(umaleko) |
| 2 | Eyona ndawo yokusetyenzwa | 545 x 622 mm |
| 3 | Ubuncinci bokutyeba | 4(umaleko)0.40mm |
| 6(umaleko) 0.60mm | ||
| 8(umaleko) 0.8mm | ||
| 10(umaleko)1.0mm | ||
| 4 | Ubuncinci bobubanzi bomgca | 0.0762mm |
| 5 | Ubuncinci bezithuba | 0.0762mm |
| 6 | Ubuncinci bokungena koomatshini | 0.15mm |
| 7 | Umngxuma udonga lobhedu ubukhulu | 0.015mm |
| 8 | Metallized aperture tolerance | ±0.05mm |
| 9 | Unyamezelo lwembobo engenametali | ±0.025mm |
| 10 | Ukunyamezela komngxuma | ±0.05mm |
| 11 | Ukunyamezela komgangatho | ±0.076mm |
| 12 | Ubuncinci ibhulorho ye-solder | 0.08mm |
| 13 | Ukumelana ne-insulation | 1E+12Ω(eqhelekileyo) |
| 14 | Umlinganiselo wokutyeba kwepleyiti | 1:10 |
| 15 | Umothuko wobushushu | 288 ℃ (amaxesha ama-4 kwimizuzwana eyi-10) |
| 16 | Igqwethiwe kwaye igobile | ≤0.7% |
| 17 | Amandla okuchasana nombane | ＞1.3KV/mm |
| 18 | Amandla okuchasa ukuhluba | 1.4N/mm |
| 19 | I-Solder imelana nobunzima | ≥6H |
| 20 | Ukusilela komlilo | 94V-0 |
| 21 | Ulawulo lwe-impedance | ±5% |
ICAPEL PCBA Production Capability
| Udidi | Iinkcukacha | |
| Ixesha lokukhokhela | Iiyure ezingama-24 zePrototyping, ixesha lokuhanjiswa kwebhetshi encinci malunga neentsuku ezi-5. | |
| PCBA Umthamo | I-SMT patch 2 million points/day, THT 300,000 points/day, 30-80 orders/day. | |
| Inkonzo yamacandelo | Turnkey | Ngenkqubo yolawulo lwecandelo eliqolileyo nelisebenzayo, sisebenzela iiprojekthi zePCBA ezinomgangatho ophezulu wokusebenza.Iqela leenjineli zokuthengwa kweempahla eziziingcali kunye nabasebenzi abanamava bokuthenga banoxanduva lokuthenga nokulawula amacandelo kubathengi bethu. |
| Ikhithi okanye ithunyelwe | Ngeqela elinamandla lolawulo lokuthengwa kwempahla kunye nekhonkco lokubonelela ngecandelo, abaThengi babonelela ngamacandelo, senza umsebenzi wendibano. | |
| Combo | Yamkela amacandelo okanye amacandelo akhethekileyo anikezelwa ngabathengi.kunye nokubonelela ngezibonelelo kubathengi. | |
| Uhlobo lwe-PCBA Solder | Iinkonzo ze-SMT, THT, okanye ze-PCBA zokuthengisa zombini. | |
| I-Solder Cola / iTin Wire / Tin Bar | i-lead kunye ne-lead-free (i-RoHS ehambelanayo) neenkonzo zokusetyenzwa kwe-PCBA.Kwaye unikezele ngentlama yesolder eyenziwe ngokwezifiso. | |
| Istencil | laser ukusika stencil ukuqinisekisa ukuba amacandelo ezifana-pitch encinane ICs kunye BGA ukuhlangabezana IPC-2 Class okanye ngaphezulu. | |
| MOQ | 1, kodwa sicebisa abathengi bethu ukuba bavelise ubuncinci iisampulu ezi-5 zokuhlalutya kunye novavanyo lwabo. | |
| Ubungakanani becandelo | • Amacandelo angenakwenziwa: silungile ekufakeni i-intshi 01005 (0.4mm * 0.2mm), 0201 amacandelo amancinci. | |
| • I-ICs echanekileyo ephezulu njenge-BGA: Siyakwazi ukubona amacandelo e-BGA nge-Min 0.25mm isithuba nge-X-reyi. | ||
| Ipakethe yecandelo | ireli, iteyiphu yokusika, iityhubhu, kunye neepalethi zamacandelo e-SMT. | |
| Ubuninzi bokuchaneka kweNtaba yaMacandelo (100FP) | Ukuchaneka yi-0.0375mm. | |
| Uhlobo lwePCB ethengiswayo | I-PCB (i-FR-4, i-metal substrate), i-FPC, i-Rigid-flex PCB, i-Aluminium PCB, i-HDI PCB. | |
| Umaleko | 1－30(umaleko) | |
| Eyona ndawo yokusetyenzwa | 545 x 622 mm | |
| Ubuncinci bokutyeba | 4(umaleko)0.40mm | |
| 6(umaleko) 0.60mm | ||
| 8(umaleko) 0.8mm | ||
| 10(umaleko)1.0mm | ||
| Ubuncinci bobubanzi bomgca | 0.0762mm | |
| Ubuncinci bezithuba | 0.0762mm | |
| Ubuncinci bokungena koomatshini | 0.15mm | |
| Umngxuma udonga lobhedu ubukhulu | 0.015mm | |
| Metallized aperture tolerance | ±0.05mm | |
| Isimboli esingenantsimbi | ±0.025mm | |
| Ukunyamezela komngxuma | ±0.05mm | |
| Ukunyamezela komgangatho | ±0.076mm | |
| Ubuncinci ibhulorho ye-solder | 0.08mm | |
| Ukumelana ne-insulation | 1E+12Ω(eqhelekileyo) | |
| Umlinganiselo wokutyeba kwepleyiti | 1:10 | |
| Umothuko wobushushu | 288 ℃ (amaxesha ama-4 kwimizuzwana eyi-10) | |
| Igqwethiwe kwaye igobile | ≤0.7% | |
| Amandla okuchasana nombane | ＞1.3KV/mm | |
| Amandla okuchasa ukuhluba | 1.4N/mm | |
| I-Solder imelana nobunzima | ≥6H | |
| Ukusilela komlilo | 94V-0 | |
| Ulawulo lwe-impedance | ±5% | |
| Ifomathi Yefayile | BOM, PCB Gerber, Khetha kunye nendawo. | |
| Uvavanyo | Ngaphambi kokuziswa, siya kusebenzisa iindlela ezahlukeneyo zovavanyo kwi-PCBA ekwintaba okanye esele ikhwele: | |
| • I-IQC: uhlolo olungenayo; | ||
| • IPQC: ukuhlolwa kwemveliso, uvavanyo lwe-LCR kwisiqwenga sokuqala; | ||
| • I-QC ebonakalayo: ukujonga umgangatho wesiqhelo; | ||
| • I-AOI: isiphumo sokusoda samalungu epetshi, iinxalenye ezincinci okanye i-polarity yamalungu; | ||
| • I-X-Ray: khangela i-BGA, i-QFN kunye nokunye ukuchaneka okuphezulu kufihliweyo amacandelo e-PAD; | ||
| • Uvavanyo oluSebenzayo: Umsebenzi wovavanyo kunye nokusebenza ngokweenkqubo zovavanyo lwabathengi kunye neenkqubo zokuqinisekisa ukuthotyelwa. | ||
| Ukulungisa kunye nokusebenza kwakhona | Inkonzo yethu yokulungisa i-BGA inokususa ngokukhuselekileyo ilahlekileyo, ingekho-kwindawo, kunye ne-BGA yobuxoki kwaye iphinde idibanise kwi-PCB ngokugqibeleleyo. | |
