I-6 Layer HDI Flexible PCB ye-Industrial Control Sensors

Case Analysis

I-Capel yinkampani yokuvelisa ekhethekileyo kwiibhodi zeesekethe eziprintiweyo (PCBs).Banikezela ngoluhlu lweenkonzo ezibandakanya ukwenziwa kwe-PCB, ukwenziwa kwe-PCB kunye nendibano, i-HDI

I-PCB prototyping, i-PCB eguquka ngokukhawuleza eguquguqukayo, indibano yePCB ye-turnkey kunye nokuveliswa kwesekethe eguqukayo.Kule meko, iCapel igxile kwimveliso ye-6-layer HDI flexible PCBs

kwizicelo zolawulo lwamashishini, ngakumbi ukusetyenziswa kunye nezixhobo zoluvo.

Amanqaku obuchule obutsha kwipharamitha yemveliso nganye ami ngolu hlobo lulandelayo:

Ububanzi bomgca kunye nesithuba somgca:
Ububanzi bomgca kunye nezithuba zomgca we-PCB zichazwe njenge-0.05/0.05mm.Oku kubonisa inguqulelo enkulu kwishishini njengoko livumela ukwenziwa kweminiaturization yeesekethe ezinoxinzelelo oluphezulu kunye nezixhobo zombane.Yenza ii-PCBs zikwazi ukwamkela uyilo lwesekethe entsonkothileyo kwaye iphucule ukusebenza ngokubanzi.
Ubukhulu bebhodi:
Ubukhulu bepleyiti buchazwe njenge-0.2mm.Le iprofayili ephantsi ibonelela bhetyebhetye olufunekayo kwi-PCBs bhetyebhetye, iyenza ilungele izicelo ezifuna ukuba i-PCBs igobe okanye isongwe.Ukubhitya kukwanegalelo kuyilo lonke olukhaphukhaphu lwemveliso.Ubukhulu bobhedu: Ubukhulu bobhedu buchazwa njenge-12um.Lo maleko obhedu obhityileyo luphawu olutsha oluvumela ukutshatyalaliswa kobushushu obungcono kunye nokuchasana okuphantsi, ukuphucula ingqibelelo yesignali kunye nokusebenza.
Ubuncinci bokungena:
Owona mngxunya usezantsi uchazwe njenge-0.1mm.Lo bukhulu buncinci bokuvula buvumela ukuyilwa koyilo lwepitch entle kwaye iququzelele ukunyuswa kwamacandelo amancinci kwiiPCB.Ivumela ukupakishwa okuphezulu koxinano kunye nokusebenza okuphuculweyo.
Ukubuyiswa komlilo:
Ireyithingi ye-PCB ye-flame retardant yi-94V0, ekumgangatho ophezulu woshishino.Oku kuqinisekisa ukhuseleko kunye nokuthembeka kwePCB, ngakumbi kwizicelo apho iingozi zomlilo zinokubakho.
Unyango olungaphezulu:
I-PCB intywiliselwe kwigolide, ibonelela ngetyabeka elicekethekileyo kunye negolide kumphezulu wobhedu ovelileyo.Oku kugqitywa komphezulu kubonelela ngokuthengiseka okugqwesileyo, ukuxhathisa umhlwa, kunye nokuqinisekisa indawo ethe tyaba ye-solder.
Umbala Wemaski yeSolder:
I-Capel inikeza inketho yombala we-yellow solder imaski enganikezeli kuphela ukugqiba okubonakalayo kodwa iphucula ukuchasana, ukubonelela ukubonakala okungcono ngexesha lenkqubo yendibano okanye ukuhlolwa okulandelayo.
Ukuqina:
I-PCB yenzelwe ipleyiti yensimbi kunye ne-FR4 impahla yokudibanisa okuqinileyo.Oku kuvumela ukuguquguquka kwiindawo eziguquguqukayo zePCB kodwa ukuqina kwiindawo ezifuna inkxaso eyongezelelweyo.Olu luyilo luqinisekisa ukuba iPCB inokumelana nokugoba nokusonga ngaphandle kokuchaphazela ukusebenza kwayo

Ngokumalunga nokusombulula iingxaki zobugcisa kushishino kunye nokuphuculwa kwezixhobo, iCapel iqwalasela la manqaku alandelayo:

Ulawulo Lobushushu Olongeziweyo:
Njengoko izixhobo ze-elektroniki ziqhubeka nokwandisa ubunzima kunye ne-miniaturization, ukuphuculwa kokulawulwa kwe-thermal kubalulekile.I-Capel inokugxila ekuphuhliseni izisombululo ezitsha zokutshatyalaliswa ngokufanelekileyo kobushushu obuveliswa yi-PCB, njengokusebenzisa i-heat sinks okanye ukusebenzisa izinto eziphambili kunye ne-thermal conductivity engcono.
Ukwandiswa Kwembonakaliso yoMqondiso:
Njengoko iimfuno zezicelo zesantya esiphezulu kunye ne-high-frequency applications zikhula, kukho imfuneko yokuphucula imfezeko yomqondiso.I-Capel inokutyala imali kuphando kunye nophuhliso ukunciphisa ilahleko yesignali kunye nengxolo, njengokusebenzisa izixhobo zokulinganisa intembeko yomgangatho ophezulu kunye nobuchule.
Itekhnoloji yokwenziwa kwe-PCB eguquguqukayo ephucukileyo:
I-PCB eguquguqukayo ineenzuzo ezizodwa ekuguquguqukeni kunye nokuqina.I-Capel inokuphonononga itekhnoloji yokuvelisa ephucukileyo efana nokusetyenzwa kwelaser ukuvelisa uyilo oluntsonkothileyo noluchanekileyo lwePCB.Oku kunokukhokelela ekuqhubeleni phambili kwi-miniaturization, ukunyuka koxinzelelo lwesekethe, kunye nokuphucula ukuthembeka.
Itekhnoloji yokwenziwa kweHDI ekwinqanaba eliphezulu:
Itekhnoloji yokuvelisa i-high-density interconnect (HDI) yenza ukuba i-miniaturization yezixhobo zombane ziculwe ngelixa iqinisekisa ukusebenza okuthembekileyo.I-Capel inotyalo-mali kubuchwephesha bokuvelisa i-HDI obuphambili obunje ngokugrumba i-laser kunye nokwakheka okulandelelanayo ukuphucula ngakumbi ukuxinana kwe-PCB, ukuthembeka kunye nokusebenza ngokubanzi.