Ukusetyenziswa kwemveliso: Izithuthi
Ibhodi lebhodi: I-16 layer
Izinto ezisisiseko: FR4
Ubukhulu be-Cu yangaphakathi: 18
Ubukhulu be-Cu yangaphandle: 35um
Umbala wemaski yeSolder: Buhlaza
Umbala we-Silkscreen: Mhlophe
Unyango lomphezulu: LF HASL
PCB ubukhulu: 2.0mm +/-10%
Min Ububanzi bomgca/isithuba: 0.2/0.15m
Umngxuma omncinci: 0.35mm
Umngxuma oyimfama: Ewe
Umngxuma ongcwatywe: Ewe
Ukunyamezela umngxuma(nu): PTH: 土0.076, NTPH: 0.05
Ukuhlasela:/
