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Multilayer PCBs Prototyping abavelisi Iibhodi zePCB zokuJika ngokukhawuleza

Inkcazelo emfutshane:

Ukusetyenziswa kwemveliso: Izithuthi

Ibhodi lebhodi: I-16 layer

Izinto ezisisiseko: FR4

Ubukhulu be-Cu yangaphakathi: 18

Ubukhulu be-Cu yangaphandle: 35um

Umbala wemaski yeSolder: Buhlaza

Umbala we-Silkscreen: Mhlophe

Unyango lomphezulu: LF HASL

PCB ubukhulu: 2.0mm +/-10%

Min Ububanzi bomgca/isithuba: 0.2/0.15m

Umngxuma omncinci: 0.35mm

Umngxuma oyimfama: Ewe

Umngxuma ongcwatywe: Ewe

Ukunyamezela umngxuma(nu): PTH: 土0.076, NTPH: 0.05

Ukuhlasela:/


Iinkcukacha zeMveliso

Iithegi zeMveliso

Ubuchule beNkqubo yePCB

Hayi. Iprojekthi Iimpawu zobugcisa
1 Umaleko 1-60(umaleko)
2 Eyona ndawo yokusetyenzwa 545 x 622 mm
3 Ubuncinci bokutyeba 4(umaleko)0.40mm
6(umaleko) 0.60mm
8(umaleko) 0.8mm
10(umaleko)1.0mm
4 Ubuncinci bobubanzi bomgca 0.0762mm
5 Ubuncinci bezithuba 0.0762mm
6 Ubuncinci bokungena koomatshini 0.15mm
7 Umngxuma udonga lobhedu ubukhulu 0.015mm
8 Metallized aperture tolerance ±0.05mm
9 Unyamezelo lwembobo engenametali ±0.025mm
10 Ukunyamezela komngxuma ±0.05mm
11 Ukunyamezela komgangatho ±0.076mm
12 Ubuncinci ibhulorho ye-solder 0.08mm
13 Ukumelana ne-insulation 1E+12Ω(eqhelekileyo)
14 Umlinganiselo wokutyeba kwepleyiti 1:10
15 Umothuko wobushushu 288 ℃ (amaxesha ama-4 kwimizuzwana eyi-10)
16 Igqwethiwe kwaye igobile ≤0.7%
17 Amandla okuchasana nombane >1.3KV/mm
18 Amandla okuchasa ukuhluba 1.4N/mm
19 I-Solder imelana nobunzima ≥6H
20 Ukusilela komlilo 94V-0
21 Ulawulo lwe-impedance ±5%

Senza i-Multilayer PCBs prototyping enamava eminyaka eli-15 ngobungcali bethu

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Iibhodi ezi-4 zeFlex-Rigid

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8 umaleko Rigid-Flex PCBs

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8 umaleko HDI PCBs

Uvavanyo kunye nezixhobo zokuHlola

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Uvavanyo lweMicroscope

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Ukuhlolwa kwe-AOI

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Uvavanyo lwe-2D

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Uvavanyo lwe-Impedans

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Uvavanyo lweRoHS

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Flying Probe

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Umvavanyi othe tye

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Ukugoba iTeste

Inkonzo yethu yokuchwetheza yee-PCB ezininzi ze-PCB

.Ukubonelela ngenkxaso yobugcisa Ukuthengiswa kwangaphambili kunye nasemva kokuthengisa;
.Ngokwesiko ukuya kuthi ga kwi-40 imigangatho, i-1-2days Ukujika ngokukhawuleza iprototyping ethembekileyo, ukuthengwa kwecandelo, iNdibano ye-SMT;
.Ibonelela kuzo zombini izixhobo zoNyango, uLawulo lwezoShishino, iZithuthi, iAviation, i-Consumer Electronics, i-IOT, i-UAV, uNxibelelwano njl.
.Amaqela ethu eenjineli kunye nabaphandi bazinikele ekufezekiseni iimfuno zakho ngokuchanekileyo nangobuchule.

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I-PCB ye-Multilayer ibonelela ngenkxaso yobugcisa obuphambili kwintsimi yeemoto

1. Inkqubo yokuzonwabisa yemoto: i-PCB enemigangatho emininzi inokuxhasa imisebenzi engaphezulu ye-audio, ividiyo kunye ne-wireless yonxibelelwano, ngaloo ndlela ibonelela ngamava okuzonwabisa okuzonwabisa emoto.Iyakwazi ukwamkela iileya ezininzi zeesekethe, ihlangabezane neemfuno ezahlukeneyo zokusetyenzwa kweaudio kunye nevidiyo, kunye nokuxhasa ukuhanjiswa kwesantya esiphezulu kunye nemisebenzi yoqhagamshelo lwamacingo, njengeBluetooth, iWi-Fi, iGPS, njl.

2. Inkqubo yoKhuseleko: I-PCB ene-multi-layer inokubonelela ngokusebenza okuphezulu kokhuseleko kunye nokuthembeka, kwaye isetyenziswe kwiinkqubo zokhuseleko ezisebenzayo kunye ne-passive.Inokudibanisa abenzi boluvo abahlukeneyo, iiyunithi zolawulo kunye neemodyuli zonxibelelwano ukuqonda imisebenzi efana nesilumkiso sokungqubana, ukunyathela ngokuzenzekelayo, ukuqhuba ngobukrelekrele, kunye nokuchasana nobusela.Uyilo lwe-PCB enemigangatho emininzi iqinisekisa unxibelelwano olukhawulezayo, oluchanekileyo noluthembekileyo kunye nolungelelwaniso phakathi kweemodyuli zenkqubo yokhuseleko ezahlukeneyo.

3. Inkqubo yokuncedisa ukuqhubela phambili: i-PCB ye-multi-layer inokubonelela ngokuchaneka okuphezulu kwesignali kunye nokuhanjiswa kwedatha ngokukhawuleza kwiinkqubo zokuncedisa ukuqhuba, ezifana nokupaka ngokuzenzekelayo, ukufumanisa indawo eyimfama, ulawulo lwe-cruise oluguquguqukayo kunye neenkqubo zokuncedisa ukugcina umzila, njl.
Ezi nkqubo zifuna inkqubo yophawu oluchanekileyo kunye nokudluliselwa kwedatha ngokukhawuleza.Kwaye ukuqonda kwangexesha kunye namandla okugweba, kunye nenkxaso yobugcisa ye-PCB enamaleko amaninzi inokuhlangabezana nezi mfuno.

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4. Inkqubo yolawulo lwe-injini: Inkqubo yolawulo lwe-injini inokusebenzisa i-PCB enemigangatho emininzi ukuqonda ulawulo oluchanekileyo kunye nokubeka iliso kwi-injini.
Iyakwazi ukudibanisa i-sensor ezahlukeneyo, ii-activators kunye neeyunithi zokulawula ukubeka iliso kunye nokulungelelanisa iiparameters ezifana nokunikezelwa kwamafutha, ixesha lokutshisa kunye nokulawula ukukhutshwa kwe-injini ukuphucula ukusebenza kakuhle kwamafutha kunye nokunciphisa ukukhutshwa kwe-exhaust.

5. Inkqubo yokuqhuba umbane: i-PCB ene-multi-layer inikezela ngenkxaso yobugcisa obuphezulu bolawulo lwamandla ombane kunye nokuhanjiswa kwamandla ezithuthi zombane kunye neenqwelo ze-hybrid.Inokuxhasa ukuhanjiswa kwamandla aphezulu kunye nokulawulwa kwe-oscillation, ukuphucula ukusebenza kakuhle kunye nokuthembeka kwenkqubo yokulawula ibhetri, kunye nokuqinisekisa umsebenzi olungelelanisiweyo weemodyuli ezahlukeneyo kwinkqubo yokuqhuba umbane.

Iibhodi zeesekethe ezininzi kwintsimi yeemoto ze-FAQ

1. Ubungakanani kunye nobunzima: Isithuba emotweni silinganiselwe, ngoko ke ubukhulu kunye nobunzima bebhodi yesekethe ye-multilayer nazo zizinto ekufuneka ziqwalaselwe.Iibhodi ezinkulu kakhulu okanye ezinzima zinokukhawulelana noyilo kunye nokusebenza kwemoto, ngoko kukho imfuneko yokunciphisa ubungakanani bebhodi kunye nobunzima kuyilo ngelixa ugcina ukusebenza kunye neemfuno zokusebenza.

2. I-Anti-vibration kunye nokuchasana kwempembelelo: Imoto iya kuba phantsi kwee-vibrations ezahlukeneyo kunye neempembelelo ngexesha lokuqhuba, ngoko ke ibhodi yesekethe ye-multilayer kufuneka ibe ne-anti-vibration efanelekileyo kunye nokuchasana kwempembelelo.Oku kufuna ukucwangciswa okufanelekileyo kwesakhiwo esixhasayo sebhodi yesekethe kunye nokukhethwa kwezinto ezifanelekileyo zokuqinisekisa ukuba ibhodi yesekethe isenokusebenza ngokuzinzileyo phantsi kweemeko zendlela ezinzima.

3. Ukuguquguquka kokusingqongileyo: Indawo yokusebenza yeemoto inzima kwaye iyaguquka, kwaye iibhodi zeesekethe ezinamanqwanqwa amaninzi kufuneka zikwazi ukulungelelanisa iimeko ezahlukeneyo zokusingqongileyo, ezifana nobushushu obuphezulu, ubushushu obuphantsi, ukufuma, njl. khetha izinto ezinokumelana nobushushu obuphezulu, ukumelana nobushushu obuphantsi kunye nokuxhathisa ukufuma, kwaye Thatha amanyathelo okukhusela ahambelanayo ukuqinisekisa ukuba ibhodi yesekethe inokusebenza ngokuthembekileyo kwiindawo ezahlukeneyo.

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4. Ukuhambelana kunye noyilo lwe-interface: Iibhodi zeesekethe ezininzi kufuneka zihambelane kwaye zidibaniswe nezinye izixhobo zombane kunye neenkqubo, ngoko ke i-interface ehambelanayo yoyilo kunye novavanyo lwe-interface luyafuneka.Oku kubandakanya ukukhethwa kweziqhagamshelo, ukuthotyelwa kwemigangatho ye-interface, kunye nokuqinisekiswa kokuzinza kwesignali ye-interface kunye nokuthembeka.

6. Ukupakishwa kwe-chip kunye neprogram: ukupakishwa kwe-chip kunye neprogram kunokubandakanyeka kwiibhodi zeesekethe ezininzi.Xa uyila, kuyimfuneko ukuqwalasela ifom yephakheji kunye nobukhulu be-chip, kunye ne-interface kunye nendlela yokutshisa kunye neprogram.Oku kuqinisekisa ukuba i-chip iya kucwangciswa kwaye iqhutywe ngokuchanekileyo nangokuthembekileyo.


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