Isicelo semveliso: Unxibelelwano
Ibhodi lebhodi: I-2 layer
Izinto ezisisiseko: FR4
Ubukhulu be-Cu yangaphakathi:/
uter Cu ubukhulu: 35um
Umbala wemaski yeSolder: Buhlaza
Umbala we-Silkscreen: Mhlophe
Unyango lomphezulu: LF HASL
PCB ubukhulu: 1.6mm +/-10%
Min Ububanzi bomgca/isithuba: 0.15/0.15mm
Umngxuma omncinci: 0.3m
Umngxuma oyimfama:/
Umngxuma ongcwatywe:/
Ukunyamezela umngxuma(mm): PTH: 土0.076, NTPH: 0.05
Ukuphazamiseka:/
