Iibhodi zeSekethe eziShicileleyo eziLayibhile iFR4
Ubuchule beNkqubo yePCB
| Hayi. | Iprojekthi | Iimpawu zobugcisa |
| 1 | Umaleko | 1-60(umaleko) |
| 2 | Eyona ndawo yokusetyenzwa | 545 x 622 mm |
| 3 | Ubuncinci bokutyeba | 4(umaleko)0.40mm |
| 6(umaleko) 0.60mm | ||
| 8(umaleko) 0.8mm | ||
| 10(umaleko)1.0mm | ||
| 4 | Ubuncinci bobubanzi bomgca | 0.0762mm |
| 5 | Ubuncinci bezithuba | 0.0762mm |
| 6 | Ubuncinci bokungena koomatshini | 0.15mm |
| 7 | Umngxuma udonga lobhedu ubukhulu | 0.015mm |
| 8 | Metallized aperture tolerance | ±0.05mm |
| 9 | Unyamezelo lwembobo engenametali | ±0.025mm |
| 10 | Ukunyamezela komngxuma | ±0.05mm |
| 11 | Ukunyamezela komgangatho | ±0.076mm |
| 12 | Ubuncinci ibhulorho ye-solder | 0.08mm |
| 13 | Ukumelana ne-insulation | 1E+12Ω(eqhelekileyo) |
| 14 | Umlinganiselo wokutyeba kwepleyiti | 1:10 |
| 15 | Umothuko wobushushu | 288 ℃ (amaxesha ama-4 kwimizuzwana eyi-10) |
| 16 | Igqwethiwe kwaye igobile | ≤0.7% |
| 17 | Amandla okuchasana nombane | ＞1.3KV/mm |
| 18 | Amandla okuchasa ukuhluba | 1.4N/mm |
| 19 | I-Solder imelana nobunzima | ≥6H |
| 20 | Ukusilela komlilo | 94V-0 |
| 21 | Ulawulo lwe-impedance | ±5% |
Senza iiBhodi zeSekethe eziShicileleyo ngamava angama-15 eminyaka ngobungcali bethu
Iibhodi ezi-4 zeFlex-Rigid
8 umaleko Rigid-Flex PCBs
8 layer HDI Iibhodi zeSekethe eziprintiweyo
Uvavanyo kunye nezixhobo zokuHlola
Uvavanyo lweMicroscope
Ukuhlolwa kwe-AOI
Uvavanyo lwe-2D
Uvavanyo lwe-Impedans
Uvavanyo lweRoHS
Flying Probe
Umvavanyi othe tye
Ukugoba iTeste
Inkonzo yethu yeeBhodi zeSekethe eziprintiweyo
.Ukubonelela ngenkxaso yobugcisa Ukuthengiswa kwangaphambili kunye nasemva kokuthengisa;
.Ngokwesiko ukuya kuthi ga kwi-40 imigangatho, i-1-2days Ukujika ngokukhawuleza iprototyping ethembekileyo, ukuthengwa kwecandelo, iNdibano ye-SMT;
.Ibonelela kuzo zombini izixhobo zoNyango, uLawulo lwezoShishino, iZithuthi, iAviation, i-Consumer Electronics, i-IOT, i-UAV, uNxibelelwano njl.
.Amaqela ethu eenjineli kunye nabaphandi bazinikele ekufezekiseni iimfuno zakho ngokuchanekileyo nangobuchule.
Iibhodi zeSekethe eziprintiweyo eziphindwe kabini zeFR4 ezifakwe kwiitafile
1. Ukuhanjiswa kwamandla: Ukuhanjiswa kwamandla kwi-tablet PC ithatha i-double-layer FR4 PCB.Ezi PCB zenza umzila osebenzayo weentambo zamandla ukuqinisekisa amanqanaba ombane afanelekileyo kunye nokuhanjiswa kumacandelo ahlukeneyo ethebhulethi, kubandakanywa umboniso, iprosesa, imemori kunye neemodyuli zokudibanisa.
2. Umzila weSignali: I-double-layer FR4 PCB inikeza i-wiring efunekayo kunye nomzila wokuhambisa umqondiso phakathi kwamacandelo ahlukeneyo kunye neemodyuli kwikhompyutheni yethebhulethi.Badibanisa iisekethe ezahlukahlukeneyo ezidibeneyo (i-ICs), izixhumi, i-sensor, kunye namanye amacandelo, ukuqinisekisa unxibelelwano olufanelekileyo kunye nokudluliselwa kwedatha ngaphakathi kwezixhobo.
3. Ukunyuswa kweCandelo: I-double-layer FR4 PCB yenzelwe ukulungiselela ukunyuswa kwamacandelo e-Surface Mount Technology (SMT) kwithebhulethi.Ezi ziquka i-microprocessors, iimodyuli zememori, i-capacitors, i-resistors, iisekethe ezidibeneyo kunye nezixhumi.Uyilo lwePCB kunye noyilo luqinisekisa isithuba esifanelekileyo kunye nolungiselelo lwamacandelo ukwandisa ukusebenza kunye nokunciphisa ukuphazamiseka komqondiso.
4. Ubungakanani kunye nokuqina: Ii-PCB ze-FR4 ziyaziwa ngokuhlala kwazo kunye neprofayili encinci, ezenza zilungele ukusetyenziswa kwizixhobo ezidibeneyo ezifana neetafile.I-FR4 PCBs ezinomaleko-mbini zivumela ukuxinana kwamacandelo amakhulu kwindawo enyiniweyo, okwenza abavelisi bayile iipilisi ezibhityileyo nezikhaphukhaphu ngaphandle kokubeka esichengeni ukusebenza.
5. Ukusebenza kweendleko: Xa kuthelekiswa ne-PCB substrates eziphambili, i-FR4 yinto efikelelekayo.Ii-PCBs ze-FR4 ezinemigangatho ephindwe kabini zibonelela ngesisombululo esinexabiso eliphezulu kubenzi beethebhulethi abafuna ukugcina iindleko zemveliso ziphantsi ngelixa begcina umgangatho kunye nokuthembeka.
Iibhodi zeSekethe eziShicileleyo ze-FR4 zomaleko kabini ziwuphucula njani umsebenzi kunye nokusebenza kweetafile?
1. Iinqwelomoya eziphantsi komhlaba kunye nombane: Ii-PCB ze-FR4 ezinemigangatho emibini zihlala zineenqwelomoya ezinikezelweyo zomhlaba kunye namandla okunceda ukunciphisa ingxolo kunye nokwandisa ukuhanjiswa kwamandla.Ezi nqwelomoya zisebenza njengereferensi ezinzileyo yokuthembeka komqondiso kunye nokunciphisa ukuphazamiseka phakathi kweesekethe ezahlukeneyo kunye namacandelo.
2. Ukulawulwa kwe-impedance routing: Ukuze kuqinisekiswe ukuhanjiswa komqondiso okuthembekileyo kunye nokunciphisa ukuthotywa komqondiso, ukulawulwa kwe-impedance routing kusetyenziswa kuyilo lwe-double-layer FR4 PCB.Le mizila yenzelwe ngononophelo kunye nobubanzi obuthile kunye nesithuba ukuhlangabezana neemfuno ze-impedance yeempawu zesantya esiphezulu kunye ne-interfaces ezifana ne-USB, i-HDMI okanye i-WiFi.
3. Ukukhusela i-EMI / EMC: I-Double-layer FR4 PCB ingasebenzisa iteknoloji yokukhusela ukunciphisa ukuphazamiseka kwe-electromagnetic (EMI) kunye nokuqinisekisa ukuhambelana kwe-electromagnetic (EMC).Iileya zeCopper okanye izikhuselo zingongezwa kuyilo lwePCB ukwahlula iisekethe ezibuthathaka kwimithombo yangaphandle ye-EMI kunye nokuthintela ukukhutshwa okunokuphazamisana nezinye izixhobo okanye iinkqubo.
4. Iingqwalasela zoyilo lwe-high-frequency: Iipilisi eziqukethe amacandelo aphezulu-frequency okanye iimodyuli ezifana nokuxhunywa kweselula (LTE / 5G), i-GPS okanye i-Bluetooth, ukuyila kwe-double-layer FR4 PCB kufuneka kuthathelwe ingqalelo ukusebenza okuphezulu-frequency.Oku kuquka ukungqamanisa ungqamaniso, i-crosstalk elawulwayo kunye neendlela ezifanelekileyo ze-RF zokuhambisa iindlela zokuqinisekisa imfezeko yophawu oluphezulu kunye nelahleko encinci yothumelo.
