Imodeli: Ii-PCBs ze-Multi-layer Rigid-Flex
Ukusetyenziswa kwemveliso:
Ibhodi lebhodi: I-4 layer
Izinto ezisisiseko: PI, FR4
Ngaphakathi Cu ubukhulu: 18um
Ubukhulu be-Cu yangaphandle: 35um
Umbala wefilimu yekhava: Mthubi
Umbala wemaski yeSolder: Mnyama
Silkscreen: Mhlophe
Unyango lomphezulu: ENIG
Flex ubukhulu: 0.19mm +/-0.03mm
Ubunzima obuqinileyo: 1.0mm +/-10%
Uhlobo lwe-Stiffener: PI
Min Ububanzi bomgca/isithuba: 0.1/0.1mm
Umngxuma omncinci: 0.lmm
Inkqubo ekhethekileyo: HDI abangaboniyo umngxuma engcwatywe
Umngxuma ongcwatywe: Ewe
Ukunyamezela umngxuma(mm): PTH: 土0.076, NTPH: 土0.05
Impedance: Ewe
Isicelo: IOT