Bandakanya amacandelo aphezu komhlaba kwibhodi ye-PCB yokuyila iprototyping

Yazisa:

Wamkelekile kwesinye isithuba seblogi esinolwazi esivela kuCapel, umdlali obalaseleyo kwishishini lebhodi yesekethe kwiminyaka eyi-15 edlulileyo.Kweli nqaku, siza kuxoxa ukuba nokwenzeka kunye noncedo lokusebenzisa izixhobo zokunyusela umphezulu kwiiprojekthi zebhodi yePCB yokuchwetheza.Njengomvelisi ohamba phambili, sijonge ukubonelela ngokukhawuleza kwemveliso ye-PCB yeprototyping, iinkonzo zendibano yebhodi yesiphaluka kunye nesisombululo esibanzi sokumisa kuzo zonke iimfuno zakho zebhodi yesekethe.

Icandelo loku-1: Ukuqonda iSiseko seNqanaba leMount

Izixhobo zokubeka umphezulu, ezikwabizwa ngokuba yi-SMD (isixhobo sokubeka umphezulu), ziya zithandwa kakhulu kumzi mveliso we-elektroniki ngenxa yobukhulu bazo obuncinci, ukudibanisa okuzenzekelayo kunye neendleko eziphantsi.Ngokungafaniyo nezinto zemveli zokutyhubela umngxuma, amacandelo e-SMD axhonywe ngokuthe ngqo kumphezulu we-PCB, ukunciphisa iimfuno zendawo kunye nokwenza kube lula ukwenza izixhobo zombane.

Icandelo lesi-2: Izinto eziluncedo zokusebenzisa izixhobo zokubeka umphezulu kwiprototyping yebhodi yePCB

2.1 Ukusetyenziswa ngokufanelekileyo kwendawo: Ubungakanani obudibeneyo bamacandelo e-SMD buvumela ukuxinana kwamacandelo aphezulu, okuvumela abaqulunqi ukuba benze iisekethe ezincinci, ezilula ngaphandle kokuphazamisa ukusebenza.

2.2 Ukuphuculwa kokusebenza kombane: Itekhnoloji ye-Surface Mount ibonelela ngeendlela ezimfutshane zangoku, ukunciphisa i-parasitic inductance, ukumelana kunye ne-capacitance.Ngenxa yoko, oku kuphucula ingqibelelo yesignali, kunciphisa ingxolo, kwaye kwandisa ukusebenza kombane ngokubanzi.

2.3 Iindleko-zokusebenza: Amacandelo e-SMD ayakwazi ukuzenzekelayo ngokuzenzekelayo ngexesha lendibano, ngaloo ndlela ukunciphisa ixesha lokuvelisa kunye neendleko.Ukongezelela, ubungakanani babo buncinci bunciphisa iindleko zokuthumela kunye nokugcinwa.

2.4 Ukomelezwa kwamandla omatshini: Ngenxa yokuba iinqununu ze-surface mount ibambelele ngokuthe ngqo kwi-PCB surface, zibonelela ngozinzo olukhulu lomatshini, okwenza isekethe ixhathise ngakumbi uxinzelelo lwendalo kunye nokungcangcazela.

Icandelo lesi-3: Iingqwalaselo kunye noCelomngeni lokwazisa aMalungu oMphezulu weNtaba kwiProtoyipu yeBhodi yePCB

3.1 Izikhokelo zoYilo: Xa kubandakanywa amacandelo e-SMD, abaqulunqi kufuneka bahambelane nezikhokelo ezithile zokuqinisekisa ukucwangciswa okufanelekileyo, ukulungelelaniswa kwecandelo, kunye nokunyaniseka kwe-solder ngexesha lokudibanisa.

3.2 Itekhnoloji ye-Soldering: Amacandelo e-surface mount ngokuqhelekileyo asebenzisa iteknoloji ye-reflow soldering, efuna izixhobo ezikhethekileyo kunye neprofayili yokushisa elawulwayo.Ukunyamekela okongeziweyo kufuneka kuthathwe ukuphepha ukufudumala okanye ukungaphelelanga kwee-solder joints.

3.3 Ubukho beCandelo kunye noKhetho: Ngelixa iikhomponenti zokunyuka komphezulu zifumaneka ngokubanzi, kubalulekile ukuqwalasela izinto ezinjengokufumaneka, ixesha lokukhokela, kunye nokuhambelana xa ukhetha amacandelo eprototyping yebhodi yePCB.

Isigaba 4: Inokukunceda njani iCapel ukuba udibanise izinto eziphezu komhlaba

E-Capel, siyakuqonda ukubaluleka kokuhlala sisazi malunga nenkqubela phambili yetekhnoloji yamva nje.Ngamava ethu abanzi kwiprototyping yebhodi yePCB kunye nendibano, sibonelela ngenkxaso ebanzi kunye nezisombululo zesiko ukudibanisa izinto eziphezu komhlaba kuyilo lwakho.

4.1 I-Advanced Manufacturing Facility: I-Capel inendawo yokuvelisa yale mihla exhotyiswe ngoomatshini bokusika okusenza sikwazi ukujongana neenkqubo ezintsonkothileyo zokuhlanganisa i-mountain surface ngokuchanekileyo nangempumelelo.

4.2 Ukuthengwa kweCandelo: Siye saseka ubuhlakani obucwangcisiweyo kunye nabanikezeli becandelo abathembekileyo ukuqinisekisa ukuba sibonelela ngezinto ezikumgangatho ophezulu weprojekthi yebhodi yakho yePCB.

4.3 IQela leZakhono: I-Capel ineqela lamagcisa anezakhono eziphezulu kunye neenjineli ezinobuchwephesha bokujongana nemingeni enxulumene nokudibanisa amacandelo aphezu komhlaba.Qiniseka ukuba iprojekthi yakho iya kusingathwa ngononophelo olukhulu nangobuchule.

Ukuququmbela:

Ukusebenzisa amacandelo okunyuka komphezulu kwiprototyping yebhodi yePCB kunokuzisa iingenelo ezininzi, ezinjengozinzo olukhulu lomatshini, ukuphuculwa kokusebenza kombane, ukonyuka kobuchule kunye nokusebenza kakuhle kweendleko. Ngokubambisana noCapel, umenzi ohamba phambili kwishishini lebhodi yesekethe, unokusebenzisa ubuchule bethu, izixhobo zokuvelisa eziphucukileyo kunye nezisombululo ezibanzi zokujika ukwenza lula uhambo lwakho ukuya ekudibaneni kwentaba eyimpumelelo.Qhagamshelana nathi namhlanje ukuze ufunde ukuba sinokukunceda njani ngemizamo yakho yokulinganisa ibhodi yePCB.