6 Umaleko HDI PCB FR4 Iibhodi zeSekethe Pcb Gold Fingers
Ubuchule beNkqubo yePCB
| Hayi. | Iprojekthi | Iimpawu zobugcisa |
| 1 | Umaleko | 1-60(umaleko) |
| 2 | Eyona ndawo yokusetyenzwa | 545 x 622 mm |
| 3 | Ubuncinci bokutyeba | 4(umaleko)0.40mm |
| 6(umaleko) 0.60mm | ||
| 8(umaleko) 0.8mm | ||
| 10(umaleko)1.0mm | ||
| 4 | Ubuncinci bobubanzi bomgca | 0.0762mm |
| 5 | Ubuncinci bezithuba | 0.0762mm |
| 6 | Ubuncinci bokungena koomatshini | 0.15mm |
| 7 | Umngxuma udonga lobhedu ubukhulu | 0.015mm |
| 8 | Metallized aperture tolerance | ±0.05mm |
| 9 | Unyamezelo lwembobo engenametali | ±0.025mm |
| 10 | Ukunyamezela komngxuma | ±0.05mm |
| 11 | Ukunyamezela komgangatho | ±0.076mm |
| 12 | Ubuncinci ibhulorho ye-solder | 0.08mm |
| 13 | Ukumelana ne-insulation | 1E+12Ω(eqhelekileyo) |
| 14 | Umlinganiselo wokutyeba kwepleyiti | 1:10 |
| 15 | Umothuko wobushushu | 288 ℃ (amaxesha ama-4 kwimizuzwana eyi-10) |
| 16 | Igqwethiwe kwaye igobile | ≤0.7% |
| 17 | Amandla okuchasana nombane | ＞1.3KV/mm |
| 18 | Amandla okuchasa ukuhluba | 1.4N/mm |
| 19 | I-Solder imelana nobunzima | ≥6H |
| 20 | Ukusilela komlilo | 94V-0 |
| 21 | Ulawulo lwe-impedance | ±5% |
Senza 6 umaleko HDI PCB kunye 15 iminyaka 'ngamava ngobungcali bethu
Iibhodi ezi-4 zeFlex-Rigid
8 umaleko Rigid-Flex PCBs
8 layer HDI Iibhodi zeSekethe eziprintiweyo
Uvavanyo kunye nezixhobo zokuHlola
Uvavanyo lweMicroscope
Ukuhlolwa kwe-AOI
Uvavanyo lwe-2D
Uvavanyo lwe-Impedans
Uvavanyo lweRoHS
Flying Probe
Umvavanyi othe tye
Ukugoba iTeste
Inkonzo yethu ye-6 layer HDI PCB
. Ukubonelela ngenkxaso yobugcisa Ukuthengiswa kwangaphambili kunye nasemva kokuthengisa;
. Ngokwesiko ukuya kuthi ga kwi-40 imigangatho, i-1-2days Ukujika ngokukhawuleza iprototyping ethembekileyo, ukuthengwa kwecandelo, iNdibano ye-SMT;
. Ibonelela kuzo zombini izixhobo zoNyango, uLawulo lwezoShishino, iZithuthi, iAviation, i-Consumer Electronics, i-IOT, i-UAV, uNxibelelwano njl.
. Amaqela ethu eenjineli kunye nabaphandi bazinikele ekufezekiseni iimfuno zakho ngokuchanekileyo nangobuchule.
6 umaleko HDI PCB isicelo esithile kwi-Automotive
1. I-ADAS (iNkqubo yoNcedo loMqhubi oPhezulu): Iinkqubo ze-ADAS zithembele kwiinzwa ezininzi ezifana neekhamera, iiradars, kunye ne-lidars ukuncedisa abaqhubi ekuhambeni nasekuphepheni ukungqubana. I-6-layer HDI PCB isetyenziswe kwiimodyuli ze-ADAS ukulungiselela uxhulumaniso lwe-sensor ye-high-density sensor kunye nokuqinisekisa ukuhanjiswa kwesignali ethembekileyo yokufumanisa into echanekileyo kunye nokulumkisa umqhubi.
2. Infotainment system: Inkqubo ye-infotainment kwizithuthi zala maxesha idibanisa imisebenzi eyahlukeneyo efana ne-GPS navigation, i-multimedia playback, iinketho zokuqhagamshelwa kunye nojongano lonxibelelwano. I-6-layer HDI PCB yenza ukudityaniswa kwe-compact yamacandelo, izixhumi kunye ne-interfaces, ukuqinisekisa unxibelelwano olusebenzayo, ulawulo oluthembekileyo kunye namava omsebenzisi aphuculweyo.
3. Iyunithi yokulawula i-injini (ECU): Iyunithi yokulawula injini inoxanduva lokubeka iliso kunye nokulawula imisebenzi eyahlukeneyo ye-injini efana nenaliti yamafutha, ixesha lokutshisa, kunye nokulawula ukukhutshwa. I-6-layer HDI PCB inceda ukulungiselela ukujikeleza okunzima kunye nokunxibelelana ngesantya esiphezulu phakathi kwee-injini ezahlukeneyo ze-injini kunye ne-actuators, ukuqinisekisa ulawulo lwe-injini oluchanekileyo kunye nokusebenza kakuhle.
4. Ukulawulwa kozinzo lwe-Electronic (ESC): Inkqubo ye-ESC iphucula uzinzo kunye nokhuseleko lwesithuthi ngokubeka iliso ngokuqhubekayo kunye nokulungelelanisa i-braking yevili kunye ne-torque ye-injini. I-6-layer HDI PCB idlala indima ebalulekileyo kwimodyuli ye-ESC, iququzelela ukuhlanganiswa kwe-microcontrollers, i-sensor, kunye ne-actuators yokuhlalutya idatha yexesha langempela kunye nokulawula okuchanekileyo.
5. I-Powertrain: I-Powertrain Control Unit (i-PCU) ilawula ukusebenza kwe-injini, ukuhanjiswa kunye ne-drivetrain ukwenzela ukusebenza kakuhle kunye nokusebenza kakuhle. I-6-layer HDI PCB idibanisa amacandelo ahlukeneyo olawulo lwamandla, i-sensors yeqondo lokushisa kunye ne-interfaces yonxibelelwano, ukuqinisekisa ukuhanjiswa kwamandla okusebenzayo, ukutshintshiselana kwedatha ethembekileyo kunye nolawulo olusebenzayo lwe-thermal.
6. Inkqubo yoLawulo lweBattery (BMS): I-BMS inoxanduva lokubeka iliso nokulawula ukusebenza, ukutshaja nokukhusela ibhetri yesithuthi. I-6-layer HDI PCB yenza i-compact design kunye nokudibanisa amacandelo e-BMS, kubandakanywa ii-ICs zokubeka iliso zebhetri, ii-sensors zeqondo lokushisa, ii-sensors zangoku, kunye ne-interfaces zonxibelelwano, ukuqinisekisa ulawulo oluchanekileyo lwebhetri kunye nokwandisa ubomi bebhetri.
Indlela 6 umaleko HDI PCB ukuphucula iteknoloji kwi Automotive?
1. I-Miniaturization: I-6-layer HDI PCB ivumela ukubekwa kwecandelo loxinzelelo oluphezulu, ngaloo ndlela iqonda i-miniaturization yeenkqubo zombane. Oku kubalulekile kwishishini leemoto apho indawo ihlala incinci. Ngokunciphisa ubukhulu bePCB, abavelisi banokuyila iimoto ezincinci, ezikhaphukhaphu kunye nezixineneyo.
2. Ukuphucula ingqibelelo yesignali: Iteknoloji ye-HDI inciphisa ubude beempawu zomqondiso kwaye inikezela ngolawulo olungcono lwe-impedance.
Oku kuphucula umgangatho womqondiso, kunciphisa ingxolo kwaye kwandisa imfezeko yomqondiso. Ukuqinisekisa ukusebenza komqondiso othembekileyo kubalulekile kwizicelo zeemoto apho ukuhanjiswa kwedatha kunye nokunxibelelana kubalulekile.
3. Ukusebenza okuphuculweyo: Iileyile ezongezelelweyo kwi-6-layer HDI PCB zibonelela ngendawo yomzila kunye neendlela zokudibanisa, okwenza umsebenzi ophuculweyo. Iimoto ngoku zidibanisa imisebenzi eyahlukeneyo ye-elektroniki, efana neenkqubo zokuncedisa abaqhubi (ADAS), iinkqubo ze-infotainment kunye neeyunithi zokulawula injini. Ukusetyenziswa kwe-6-layer HDI PCB iququzelela ukuhlanganiswa kwale misebenzi enzima.
4. Ukuhanjiswa kwedatha yesantya esiphezulu: Iinkqubo ze-Automotive, ezifana neenkqubo eziphambili zokuhamba kunye nokunxibelelana phakathi kweenqwelo, zifuna ukuhanjiswa kwedatha ye-high-speed. I-6-layer HDI PCB ixhasa usetyenziso lwefrikhwensi ephezulu yokuhanjiswa kwedatha ngokukhawuleza nangempumelelo. Oku kubalulekile ekwenzeni izigqibo ngexesha lokwenyani, ukuphucula ukhuseleko nokusebenza.
5. Ukuthembeka okuphuculweyo: Itekhnoloji ye-HDI isebenzisa i-micro-vias ukubonelela uqhagamshelo lombane olungcono ngelixa uthatha indawo encinci.
Ezi vias zincinci zinceda ukuphucula ukuthembeka ngokunciphisa umngcipheko we-signal crosstalk kunye ne-impedance mismatch. Kwi-automotive electronics apho ukuthembeka kubaluleke kakhulu, ii-HDI PCBs ziqinisekisa unxibelelwano oluluqilima noluhlala ixesha elide.
6. Ulawulo lwe-Thermal: Ngokunyuka kobunzima kunye nokusetyenziswa kwamandla e-automotive electronics, ulawulo olufanelekileyo lwe-thermal lubalulekile. I-6-layer HDI PCB ixhasa ukuphunyezwa kwe-thermal vias ukunceda ukutshabalalisa ubushushu kunye nokulawula ubushushu.
Oku kuvumela iinkqubo zeemoto ukuba zisebenze ngokufanelekileyo, nakumaqondo obushushu aphezulu.
