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smart wearable flex pcb ibhodi yesekethe | I-Smart Rigid Flex PCB

Inkcazelo emfutshane:

Uhlobo lweMveliso: I-2 layer Flex PCB
Izicelo: Ring
Material: PI, ubhedu, incamathelisa
Ububanzi bomgca kunye nesithuba somgca: 0.2mm/0.2mm
Ubukhulu bebhodi: 0.17mm +/- 0.03mm
Ubuncinci umngxuma: 0.1mm
Unyango loMphezulu: ENIG 2-3uin

Ukuphazamiseka:/

Ukunyamezela ukunyamezela: ± 0.1MM

Inkonzo yaseCapel:

Inkxaso yeSiko le-1-30 ye-FPC eguquguqukayo i-PCB, i-2-32 yeeBhodi zeSekethe eziGuqu-Flex, i-1-60 i-Layer Rigid PCB, i-HDI PCB, i-Reliable Quick Turn PCB Prototyping, i-Fast Turn SMT PCB Assembly

Inkonzo Yeshishini:

Isixhobo sezoNyango, i-IOT, iTUT, i-UAV, i-Aviation, i-Automotive, iTelecommunications, Consumer Electronics, i-Military, i-Aerospace, i-Industrial Control, i-Artificial Intelligence, i-EV, njl.


Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimeko eziphumeleleyo zeebhodi zesekethe eziguquguqukayo kumakhonkco ahlakaniphile:

-UCapel uneminyaka eyi-15 yamava obugcisa obuchwephesha-

Uphuhliso kwiinkalo ze-elektroniki eziguquguqukayo kunye nezixhobo ezinxitywayo ziye zakhokelela kwizinto ezininzi ezinyanzelisayo. Phakathi kwazo, ukusetyenziswa kweebhodi zePCB ezinxibekayo kutsale umdla kakhulu. Le teknoloji ayenzi nje ukuba i-smart rings ibe bhetyebhetye kwaye ikhululeke kodwa ibonelela ngeemveliso ngenkululeko yoyilo ngakumbi. Ngezantsi siza kwazisa imveliso ring smart esekelwe kwiibhodi zesekethe bhetyebhetye kwaye iveze iimeko zayo impumelelo kunye neempembelelo.

Ingcaciso yeMveliso
Itekhnoloji yebhodi ye-FPC ye-smart ring inokuqonda uqhagamshelo olungenazingcingo kunye nee-smartphones okanye ezinye izixhobo kwaye inemisebenzi efana nokujonga izinga lentliziyo, ukulandelela umthambo, kunye nezikhumbuzo zesaziso. Uyilo lwenkangeleko yalo lusefashonini, lubhityile, lukhululekile, kwaye lufanelekile ukunxitywa kwemihla ngemihla. Ibhodi yesekethe eguquguqukayo esetyenzisiweyo ayiqinisekisi kuphela ukuguquguquka kunye nokuthuthuzela kwemveliso kodwa inika ukusebenza kakuhle kombane kunye nokuthembeka.

Utshintsho lweTekhnoloji kunye nezinto eziluncedo eziphambili
Ukuguquguquka okunamandla kunye neplastiki: Ngokusekelwe kuyilo lweebhodi zeesekethe eziguquguqukayo, ikhonkco inokugoba ngokukhululekileyo ngaphandle kokuchaphazela ukusebenza okuqhelekileyo kwamacandelo e-elektroniki, iphucula kakhulu induduzo kunye namava okugqoka imveliso.

Iimeko eziphumeleleyo zeebhodi zeesekethe eziguquguqukayo kumakhonkco ahlakaniphile

Ukusetyenziswa kwendawo ephezulu: Ibhodi yesekethe eguquguqukayo inokugotywa kwaye isongwe ngokwendlela yoyilo lomphezulu ogobileyo weringi, enokusebenzisa ngokufanelekileyo indawo yangaphakathi yeringi kwaye yandise ukuguquguquka koyilo lwamacandelo asebenzayo.
Uyilo oluKhala: Xa kuthelekiswa neebhodi zesekethe eziqinileyo, uyilo lweebhodi zesekethe eziguquguqukayo azinakunciphisa kuphela ubunzima bemveliso kodwa zilungelelanise neemfuno zabasebenzisi zokukhanya kunye nentuthuzelo.
Ukusebenza okuzinzileyo: Izinto eziphathekayo kunye neenkqubo zokuvelisa iibhodi zeesekethe eziguquguqukayo zinokunciphisa ngokufanelekileyo ukuthotywa kwentsebenzo yeebhodi zesekethe eziprintiweyo ezihlakaniphile phantsi kweemeko zokuguqulwa ezifana nokugoba, ukunweba, okanye ukukhupha, ukuqinisekisa ukuzinza nokuthembeka kwemveliso.
impumelelo ityala
I-Capel inamava atyebileyo kunye nokuqokelela okunzulu ekusebenziseni iteknoloji yebhodi yesekethe eguquguqukayo. Baye baphumelela impumelelo kwiingxaki ezininzi zobugcisa kwaye basebenzise ngempumelelo iibhodi zesekethe eziguquguqukayo kwiimveliso zeringi ezihlakaniphile, zibe yinkokeli kushishino.

impumelelo yetekhnoloji
I-Capel yoyisile imingeni emininzi yobugcisa kuphando kunye nophuhliso lwe-PCB ye-smart wearable ring, kubandakanywa nokukhethwa kwezinto, ukuveliswa kwenkqubo, kunye ne-hardware edibeneyo kunye noyilo lwesoftware. Baphuhlise ii-substrates eziguquguqukayo kakhulu ezilungele ukusetyenziswa komphezulu ogobileyo, ukuphucula ngokufanelekileyo ukugoba kunye neplastiki yeebhodi zeesekethe. Ngelo xesha, iCapel iphinde yaphucula inkqubo yokuvelisa ukuphumeza ukuveliswa okuphezulu kwemveliso egqityiweyo, ukuqinisekisa ukuzinza nokuthembeka kwamacandelo asebenzayo emveliso. Ukongezelela, kwi-design edibeneyo ye-software kunye ne-hardware, baqulunqa ngokucophelela uxhulumaniso phakathi kwe-chip ebhodini (i-SoC) kunye nebhodi yesekethe eguquguqukayo, ukwenzela ukuba ukusebenza ngokubanzi kwemveliso kunokwenziwa ngokufanelekileyo.

impendulo yemarike
Le mveliso yeringi smart yamkelwe ngokufudumeleyo yimarike kunye nobuchwepheshe bayo bendibano yePCB ephucukileyo yomsesane kunye neempawu ezityebileyo ezisebenzayo. Abasebenzisi baphawula kakuhle ngokuthuthuzela kunye nokusebenza kwemveliso, kunye nokuthengisa kunye nempumelelo yegama lomlomo. Kwangaxeshanye, le mveliso iye yaqatshelwa kwaye yanconywa ngamaziko amaninzi ovavanyo lobuchwephesha, yaba yinkokeli phakathi kweemveliso ezifanayo. Enkosi kwisicelo esiyimpumelelo setekhnoloji yebhodi yesekethe eguquguqukayo, abathengi bethu bazuze iingenelo ezibalulekileyo zokukhuphisana kwimarike yesixhobo esinxitywayo.

Impembelelo kushishino kunye namathemba
Ngale meko, sinokubona impembelelo enzulu yokusetyenziswa kweteknoloji yebhodi yesekethe eguquguqukayo kwintsimi yeendandatho ezihlakaniphile. Okokuqala, ukusungulwa kweteknoloji kukhuthaza inkqubela phambili yemisebenzi yemveliso kunye noyilo lwembonakalo, ukuphucula amava omsebenzisi kunye nokukhuphisana kwemveliso. Okwesibini, usetyenziso oluyimpumelelo lweebhodi zesekethe eziguquguqukayo lusete imodeli yobuvulindlela bobuchwephesha kulo lonke ishishini lesixhobo esinxitywayo, ukuphucula inqanaba lobugcisa kunye nomgangatho wemveliso yekhonkco leshishini lonke. Kwangaxeshanye, ngokuphuculwa okuqhubekayo kweenkqubo zokwenziwa kwebhodi yesekethe eguquguqukayo kunye nokuncitshiswa kweendleko, itekhnoloji ye-elektroniki eguquguqukayo iya kuzisa indawo ebanzi yokwenziwa kwezinto ezintsha kunye nophuhliso lweemveliso zombane zabathengi abaninzi.

Ukujonga kwikamva, kunye nenkqubela phambili eqhubekayo ye-smart ring rigid-flex technology PCB kunye nethekhinoloji yesixhobo esinxitywayo, sikholelwa ukuba iimveliso zeringi ezivelisa izinto ezintsha nezisebenzayo ziya kuvela kwaye zinike abasebenzisi amava angcono omsebenzisi. Kwangaxeshanye, iimeko eziyimpumelelo zetekhnoloji yebhodi yesekethe eguquguqukayo nazo ziya kukhuthaza iinkampani ezininzi zetekhnoloji kunye namaqela amatsha ukuba baphonononge ngokudibeneyo amathuba angenasiphelo kwinkalo yezixhobo ezinxitywayo.

I-Capel Flexible PCB kunye neRigid-Flex PCB yeNkqubo yokukwazi

Udidi Inkqubo Yamandla Udidi Inkqubo Yamandla
Uhlobo lweMveliso Umaleko omnye FPC / Umaleko kabini FPC
Ii-Multi-layer FPC / Aluminium PCBs
I-Rigid-Flex PCB
ILayers Number 1-30FPC
2-32umaleko Rigid-FlexPCB1-60iileya ezingqongqo PCB
HDIIibhodi
Ubungakanani obukhulu bokuVeliswa Umaleko omnye FPC 4000mm
Imigangatho ephindwe kabini FPC 1200mm
Imigangatho emininzi yeFPC 750mm
I-Rigid-Flex PCB 750mm
I-Insulating Layer
Ukutyeba
27.5um / 37.5/ 50um / 65/ 75um / 100um /
125um/150um
Ukutyeba kweBhodi I-FPC 0.06mm - 0.4mm
I-Rigid-Flex PCB 0.25 - 6.0mm
Ukunyamezela kwe-PTH
Ubungakanani
±0.075mm
Umphezulu Gqiba Ukuntywiliselwa kweGolide / ukuntywiliselwa
ISilivere/uKutyalwa ngeGolide/uKutyathwa kweTin/OSP
Stiffener FR4 / PI / PET / SUS / PSA / Alu
Ubungakanani beSemicircle Orifice Ubuncinci 0.4mm Min Line Isithuba/ ububanzi 0.045mm/0.045mm
Ukutyeba Ukunyamezela ±0.03mm Impedance 50Ω-120Ω
Ukutyeba kweFoil yobhedu 9um/12um/18um/35um/70um/100um Impedance
Iyalawulwa
Ukunyamezelana
±10%
Ukunyamezela kwe-NPTH
Ubungakanani
±0.05mm Ububanzi beMin Flush 0.80mm
Min Via Hole 0.1mm Phumeza
Umgangatho
GB / IPC-650 / IPC-6012 / IPC-6013II /
IPC-6013III

I-Capel yenza ibhodi yeSekethe echanekileyo echanekileyo echanekileyo / eFlexible PCB / HDI PCB kunye neminyaka eyi-15 yamava ngobungcali bethu.

Iileyiti ezi-2 ezinamacala amabini eFpc Pcb + Icwecwe leNickel elicocekileyo elifakwe kwibhetri yaMandla amatsha

2 Layer Flexible PCB Boards Stackup

Ukutshintsha ngokukhawuleza i-4 ye-Layer Rigid-Flex PCB Boards Ukwenziwa koNcedo lokuva ngeBluetooth kwi-Intanethi

4 Layer Rigid-Flex PCB Stackup

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8 umaleko HDI PCBs

Uvavanyo kunye nezixhobo zokuHlola

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Uvavanyo lweMicroscope

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Ukuhlolwa kwe-AOI

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Uvavanyo lwe-2D

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Uvavanyo lwe-Impedans

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Uvavanyo lweRoHS

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Flying Probe

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Umvavanyi othe tye

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Ukugoba iTeste

I-Capel ibonelela abathengi ngeNkonzo ye-PCB elungiselelwe iminyaka eyi-15 yamava

  • Ukuba ngabanini 3iifektri zeFlexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
  • 300+Iinjineli zibonelela ngenkxaso yobugcisa kwiintengiso zangaphambili kunye nasemva kokuthengisa kwi-Intanethi;
  • 1-30FPC,2-32iileya eziRigid-FlexPCB,1-60iileya ezingqongqo PCB
  • HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCB, Single-sided PCB, Iibhodi zeSekethe ezinamacala amabini, iibhodi eziHollow, Rogers PCB, rf PCB, Metal Core PCB, Iibhodi zeNkqubo eziZodwa, iCeramic PCB, iAluminium PCB , I-SMT & PTH Assembly, PCB Prototype Service.
  • NikaIiyure ezingama-24Inkonzo ye-PCB yePrototyping, iiBatshi ezincinci zeebhodi zesekethe ziya kusiwa ngaphakathi5-7 iintsuku, Ukuveliswa kweMisa yeebhodi zePCB ziya kuhanjiswaIiveki ezi-2-3;
  • Imizi-mveliso esiyinika inkonzo:Izixhobo zonyango, i-IOT, iTUT, i-UAV, i-Aviation, i-Automotive, i-Telecommunications, i-Electronics yabathengi, i-Military, i-Aerospace, i-Industrial Control, i-Artificial Intelligence, i-EV, njl.
  • Isakhono sethu seMveliso:
    I-FPC kunye neRigid-Flex PCBs umthamo wokuvelisa unokufikelela ngaphezu150000sqmngenyanga,
    Umthamo wemveliso we-PCB unokufikelela80000sqmngenyanga,
    PCB Ukuhlanganisa umthamo kwi150,000,000amacandelo ngenyanga.
  • Amaqela ethu eenjineli kunye nabaphandi bazinikele ekufezekiseni iimfuno zakho ngokuchanekileyo nangobuchule.
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Indlela iCapel iqinisekisa ngayo ukusebenza okuphezulu kunye nokuthembeka kwe-PCBs eqinile-flex

  • Ngaphambili:
  • Okulandelayo:

  • Bhala umyalezo wakho apha kwaye uwuthumele kuthi