Yintoni vias micro, vias imfama kwaye wangcwatywa vias HDI PCB Boards?

Iibhodi zesekethe eziprintiweyo eziphezulu (HDI) eziprintiweyo (PCBs) ziguqule ishishini lombane ngokwenza ukuba kuphuhliswe izixhobo zombane ezincinci, ezikhaphukhaphu kunye nezisebenzayo.Ngokuqhubeka kweminiaturization yamacandelo e-elektroniki, imingxunya yemveli ayisekho ngokwaneleyo ukuhlangabezana neemfuno zoyilo lwangoku. Oku kuye kwakhokelela ekusebenziseni i-microvias, iimfama kunye nokungcwatywa kwe-HDI kwiBhodi ye-PCB. Kule bhlog, uCapel uya kujonga nzulu kwezi ntlobo ze-vias kwaye axoxe ngokubaluleka kwazo kuyilo lwe-HDI PCB.

1. I-Micropore:

I-Microholes yimingxuma encinci kunye nobubanzi obuqhelekileyo be-0.006 ukuya kwi-0.15 intshi (0.15 ukuya ku-0.4 mm). Zidla ngokusetyenziswa ukwenza imidibaniso phakathi kweemaleko ze-HDI PCB. Ngokungafaniyo ne-vias, edlula kuyo yonke ibhodi, i-microvias idlula ngokuyinxenye kumaleko womphezulu. Oku kuvumela ukuxinana okuphezulu kwendlela kunye nokusetyenziswa ngokufanelekileyo kwendawo yebhodi, okuyenza ibaluleke kakhulu kuyilo lwezixhobo zombane ezihlangeneyo.

Ngenxa yobukhulu bawo buncinci, i-micropores ineenzuzo ezininzi. Okokuqala, zenza kube lula ukuthungwa kwezinto ezinomgangatho ococekileyo onje ngemicroprocessors kunye neechips zememori, ukunciphisa ubude bomkhondo kunye nokuphucula imfezeko yesiginali. Ukongeza, i-microvias inceda ukunciphisa ingxolo yesignali kunye nokuphucula iimpawu zokuhambisa umqondiso wesantya esiphezulu ngokubonelela ngeendlela ezimfutshane zesignali. Bakwafaka isandla kulawulo olungcono lwe-thermal, njengoko bevumela i-thermal vias ukuba ibekwe kufutshane namacandelo avelisa ubushushu.

2. Umngxuma oyimfama:

I-vias eyimfama ifana ne-microvias, kodwa isuka kumaleko angaphandle e-PCB ukuya kwelinye okanye ngaphezulu kwamaleko angaphakathi e-PCB, ukutsiba ezinye iileya eziphakathi. Ezi vias zibizwa ngokuba "zii-vias eziyimfama" kuba zibonakala kuphela kwicala elinye lebhodi. I-vias eziyimfama zisetyenziselwa ukudibanisa umaleko ongaphandle we-PCB kunye nomaleko wangaphakathi omeleneyo. Xa kuthelekiswa nemingxuma, inokuphucula ukuguquguquka kwe-wiring kunye nokunciphisa inani leeleya.

Ukusetyenziswa kwe-vias eyimfama kubaluleke kakhulu kuyilo oluxinana kakhulu apho imiqobo yendawo ibaluleke kakhulu. Ngokushenxisa imfuneko yokomba ngomngxuma, ukungaboni ngasonye ngomqondiso ohlukeneyo kunye neenqwelomoya zamandla, ukuphucula imfezeko yomqondiso kunye nokunciphisa uphazamiseko lwe-electromagnetic interference (EMI). Bakwadlala indima ebalulekileyo ekunciphiseni ubukhulu bubonke bee-HDI PCBs, ngaloo ndlela benegalelo kwiprofayile encinci yezixhobo zombane zanamhlanje.

3. Umngxuma ongcwatywe:

Wangcwatywa vias, njengoko igama libonisa, nge vias ezifihlwe ngokupheleleyo ngaphakathi maleko yangaphakathi PCB. Ezi vias musa ukwandisa nakweyiphi umaleko yangaphandle kwaye ngaloo ndlela "ingcwatywe". Zihlala zisetyenziswa kuyilo oluntsonkothileyo lwe-HDI PCB ebandakanya iileya ezininzi. Ngokungafaniyo ne-microvias kunye ne-vias eyimfama, ii-vias ezingcwatywayo azibonakali macala omabini ebhodi.

Olona ncedo luphambili lwe-vias engcwatyiweyo kukukwazi ukubonelela ngoqhagamshelo ngaphandle kokusebenzisa iileya zangaphandle, okwenza ingxinano ephezulu yeendlela. Ngokukhulula isithuba esixabisekileyo kumaleko angaphandle, ii-vias ezingcwatywayo zinokuthatha amacandelo ezongezelelweyo kunye nomkhondo, ukuphucula ukusebenza kwePCB. Bakwanceda ekuphuculeni ulawulo lwe-thermal, njengoko ubushushu bunokuchithwa ngokufanelekileyo ngokusebenzisa iileya zangaphakathi, kunokuba zithembele kuphela kwi-thermal vias kumaleko angaphandle.

Ukuququmbela,nge micro, vias imfama kunye vias wangcwatywa zizinto eziphambili HDI PCB uyilo ibhodi kwaye zinika uluhlu olubanzi iingenelo miniaturization kunye noxinaniso eliphezulu izixhobo zombane.I-Microvias yenza ukuba umzila oshinyeneyo kunye nokusetyenziswa ngokufanelekileyo kwendawo yebhodi, ngelixa ii-dias ezingaboniyo zibonelela ngokuguquguquka kunye nokunciphisa ubalo lomaleko. Ukungcwatywa ngendlela yokwandisa ngakumbi ingxinano yeendlela, ukukhulula iileya zangaphandle zokwandiswa kokubekwa kwecandelo kunye nolawulo olushushu oluphuculweyo.

Njengoko ishishini lombane liqhubeka nokutyhala imida ye-miniaturization, ukubaluleka kwezi vias kuyilo lweBhodi ye-HDI PCB kuya kukhula kuphela. Iinjineli kunye nabayili kufuneka baqonde izakhono zabo kunye nemida ukuze bayisebenzise ngokufanelekileyo kwaye benze izixhobo zombane eziphuma phambili ezihlangabezana neemfuno ezihlala zisanda zobugcisa bale mihla.I-Shenzhen Capel Technology Co., Ltd ngumvelisi othembekileyo nozinikeleyo weebhodi zesekethe eziprintiweyo ze-HDI. Ngeminyaka eyi-15 yamava eprojekthi kunye nobuchule obuqhubekayo bezobuchwepheshe, bayakwazi ukubonelela ngezisombululo ezikumgangatho ophezulu ezihlangabezana neemfuno zabathengi. Ukusebenzisa kwabo ulwazi lobuchwephesha lobuchwephesha, ubuchule benkqubo ephucukileyo, kunye nezixhobo zokuvelisa eziphambili kunye noomatshini bokuvavanya baqinisekisa iimveliso ezithembekileyo nezinexabiso eliphantsi. Nokuba iprototyping okanye imveliso yobuninzi, iqela labo elinamava leengcaphephe zebhodi yesekethe lizimisele ukuhambisa izisombululo zePCB zodidi lokuqala lwe-HDI kuyo nayiphi na iprojekthi.