Phucula ulwakhiwo lwakho lwePCB: khetha ukugqiba okugqibeleleyo kwibhodi yakho ene-12-layer

Kule bhlog, siza kuxoxa ngonyango oluphezulu oludumileyo kunye nezibonelelo zalo zokukunceda uphucule inkqubo yakho yokwenziwa kwe-PCB ene-12.

Kwinkalo yeesekethe ze-elektroniki, iibhodi zeesekethe eziprintiweyo (PCBs) zidlala indima ebalulekileyo ekudibaniseni nasekunikeni amandla amacandelo e-elektroniki ahlukeneyo. Njengoko itekhnoloji ihambela phambili, imfuno yee-PCBs eziphambili nezintsonkothileyo zonyuka kakhulu. Ke ngoko, ukwenziwa kwePCB kuye kwaba linyathelo elibalulekileyo ekuveliseni izixhobo zombane ezikumgangatho ophezulu.

Umba obalulekileyo omawuqwalaselwe ngexesha lokwenziwa kwePCB kukulungiswa komphezulu.Unyango lomphezulu lubhekiselele ekugqumeni okanye ekugqityweni okufakwe kwi-PCB ukuyikhusela kwizinto zokusingqongileyo kunye nokuphucula ukusebenza kwayo. Kukho iindlela ezahlukeneyo zonyango olukhoyo, kwaye ukukhetha unyango olufanelekileyo lwebhodi yakho ye-12-layer inokuchaphazela kakhulu ukusebenza kwayo kunye nokuthembeka.

I-1.HASL (i-solder yomoya oshushu):
I-HASL yindlela yonyango esetyenziswa ngokubanzi emphezulu ebandakanya ukudipha i-PCB kwi-solder etyhidiweyo kwaye emva koko usebenzisa imela yomoya oshushu ukususa i-solder engaphezulu. Le ndlela ibonelela ngesisombululo esinendleko kunye ne-solderability egqwesileyo. Nangona kunjalo, inemida ethile. I-solder ayinakwabiwa ngokulinganayo phezu komhlaba, okukhokelela ekugqityweni kokungalingani. Ukongeza, ukuvezwa kobushushu obuphezulu ngexesha lenkqubo kunokubangela uxinzelelo lwe-thermal kwi-PCB, echaphazela ukuthembeka kwayo.

2. ENIG (igolide yokuntywiliselwa nickel engenambane):
I-ENIG lukhetho oludumileyo lonyango lomphezulu ngenxa yokuqina kwayo okubalaseleyo kunye nokuthambileyo. Kwinkqubo ye-ENIG, i-nickel encinci ifakwe kwindawo yobhedu, ilandelwa ngumaleko omncinci wegolide. Olu nyango luqinisekisa ukuxhathisa okulungileyo kwe-oxidation kunye nokuthintela ukuwohloka komphezulu wobhedu. Ukongezelela, ukuhanjiswa okufanayo kwegolide kumphezulu kunika indawo ethe tyaba kunye negudileyo, okwenza ukuba ifaneleke kumacandelo afanelekileyo. Nangona kunjalo, i-ENIG ayikhuthazwa kwizicelo zefrikhwensi ephezulu ngenxa yokulahleka komqondiso okunokwenzeka okubangelwa ngumaleko wesithintelo se-nickel.

3. OSP (organic solderability preservative):
I-OSP yindlela yonyango yomphezulu ebandakanya ukusebenzisa umaleko obhityileyo we-organic ngqo kumphezulu wobhedu ngokusabela kweekhemikhali. I-OSP ibonelela ngesisombululo esingabizi kakhulu kwaye sinobuhlobo nokusingqongileyo njengoko ayifuni naziphi na iintsimbi ezinzima. Ibonelela ngomphezulu othe tyaba nogudileyo oqinisekisa ukuthengiseka okugqwesileyo. Nangona kunjalo, iingubo ze-OSP zinovelwano kumswakama kwaye zifuna iimeko ezifanelekileyo zokugcina ukugcina ingqibelelo yazo. Iibhodi ezinyangwa nge-OSP zikwachanabeka ngakumbi kwimikrwelo nokuphatha umonakalo kunolunye unyango olungaphezulu.

4. Isilivere yokuntywiliselwa:
Isilivere yokuntywiliselwa, ekwabizwa ngokuba yisilivere yokuntywiliselwa, lukhetho oludumileyo lweePCBs ezikwi-frequency ephezulu ngenxa yokuqhuba kwayo okugqwesileyo kunye nelahleko yokufaka ephantsi. Ibonelela ngomphezulu othe tyaba, ogudileyo oqinisekisa ukuthengiseka okuthembekileyo. Isilivere yokuntywiliselwa iluncedo ngokukhethekileyo kwiiPCB ezinamacandelo omgangatho ocolekileyo kunye nezicelo ezinesantya esiphezulu. Nangona kunjalo, imiphezulu yesilivere ithanda ukonakala kwindawo efumileyo kwaye ifuna ukuphathwa ngokufanelekileyo kunye nokugcinwa kwayo ukugcina ingqibelelo.

5. Ukufakwa kwegolide elukhuni:
Ukucwenga kwegolide eqinileyo kubandakanya ukubeka umaleko oshinyeneyo wegolide kumphezulu wobhedu ngokusebenzisa inkqubo yokufakwa kwe-electroplating. Olu nyango lomphezulu luqinisekisa ukuhanjiswa kombane okugqwesileyo kunye nokuxhathisa ukubola, okwenza kube yinto efanelekileyo kwizicelo ezifuna ukufakwa ngokuphindaphindiweyo kunye nokususwa kwamacandelo. I-hard gold plating idla ngokusetyenziswa kwizihlanganisi zomphetho kunye nokutshintsha. Nangona kunjalo, iindleko zolu nyango ziphezulu xa kuthelekiswa nolunye unyango olungaphezulu.

Isishwankathelo, ukukhetha umphezulu ogqibeleleyo ukugqiba kwi-12-layer PCB kubalulekile ekusebenzeni kwayo kunye nokuthembeka.Inketho nganye yonyango lomphezulu ineenzuzo kunye nemida, kwaye ukhetho luxhomekeke kwiimfuno zakho zesicelo kunye nohlahlo lwabiwo-mali. Nokuba ukhetha itoti yokutshiza enexabiso eliphantsi, igolide yokuntywiliselwa ethembekileyo, i-OSP ehambelana nokusingqongileyo, isilivere yokuntywiliselwa rhoqo, okanye ukucakwa kwegolide eqinileyo, ukuqonda iingenelo kunye nokuqwalaselwa kunyango ngalunye kuya kukunceda uphucule inkqubo yokwenziwa kwePCB yakho kwaye uqinisekise impumelelo izixhobo zakho zombane.