I-SMT solder bridging ngumngeni oqhelekileyo ojongene nabavelisi be-electronics ngexesha lenkqubo yokuhlanganisa. Esi siganeko senzeka xa i-solder idibanisa ngokungahambi kakuhle amacandelo amabini akufutshane okanye iindawo eziqhubayo, okubangela isiphaluka esifutshane okanye ukusebenza okuphazamisekileyo.Kweli nqaku, siza kugocagoca kubugocigoci beebhulorho zokuthengisa ze-SMT, kuquka oonobangela bazo, amanyathelo othintelo, kunye nezisombululo ezisebenzayo.
1.Yintoni iSMT PCB Solder Bridging:
I-SMT solder bridging ekwabizwa ngokuba “yi-solder short” okanye “solder bridge,” yenzeka ngexesha lokudityaniswa kwezixhobo ze-surface Mount technology (SMT) kwibhodi yesekethe eprintiweyo (PCB). Kwi-SMT, amacandelo axhonywe ngqo kumphezulu we-PCB, kwaye i-solder paste isetyenziselwa ukudala uqhagamshelwano lombane kunye noomatshini phakathi kwecandelo kunye ne-PCB. Ngethuba lenkqubo ye-soldering, i-solder paste isetyenziswe kwi-PCB pads kunye neenkokheli zamacandelo e-SMT. I-PCB iye yafudunyezwa, ibangela ukuba intlama ye-solder inyibilike kwaye ihambe, idala iqhina phakathi kwecandelo kunye ne-PCB.
2.Izizathu ze-SMT PCB Solder Bridging:
I-SMT solder bridging kwenzeka xa udibaniso obelungalindelekanga lwenziwa phakathi kweepadi ezikufutshane okanye iinkokeli kwibhodi yesekethe eprintiweyo (PCB) ngexesha lendibano. Le nto inokukhokelela kwiisekethe ezimfutshane, uqhagamshelo olungachanekanga kunye nokungaphumeleli ngokubanzi kwezixhobo ze-elektroniki.
Iibhulorho ze-solder ze-SMT zinokuthi zenzeke ngenxa yezizathu ezahlukeneyo, kubandakanywa umthamo onganeleyo wokunamathisela i-solder, i-stencil engalunganga okanye i-design engafanelekanga, i-solder joint reflow engafanelekanga, ukungcoliswa kwe-PCB, kunye ne-residue ye-flux engaphezulu.Isixa esinganelanga se-solder paste yenye yezinto ezibangela iibhulorho ze-solder. Ngexesha lenkqubo yoshicilelo lwe-stencil, i-solder paste isetyenziswa kwi-PCB pads kunye necandelo elikhokelela. Ukuba awufaki i-solder paste eyaneleyo, unokuphela ngokuphakama okuphantsi, oku kuthetha ukuba akuyi kubakho indawo eyaneleyo ye-solder paste ukudibanisa ngokufanelekileyo icandelo kwi-pad. Oku kunokukhokelela ekuhlukaneni kwecandelo elingafanelekanga kunye nokwakhiwa kweebhulorho ze-solder phakathi kwamacandelo akufutshane. Uyilo lwestencil olungachanekanga okanye ulungelelwaniso olungalunganga lunokubangela ukudityaniswa kwe-solder.
Iistencils eziyilwe ngendlela engafanelekanga zinokubangela ukufakwa kwe-solder paste engalinganiyo ngexesha lesicelo se-solder paste. Oku kuthetha ukuba kunokubakho intlama ye-solder eninzi kakhulu kwezinye iindawo kwaye incinci kakhulu kwezinye iindawo.Ukubekwa kwe-solder paste engalungelelananga kunokubangela ibhulorho ye-solder phakathi kwamacandelo akufutshane okanye iindawo zokuqhuba kwi-PCB. Ngokufanayo, ukuba i-stencil ayihambelani ngokufanelekileyo ngexesha lesicelo sokunamathisela i-solder, inokubangela ukuba idiphozithi ye-solder ingahambi kakuhle kwaye yenze iibhulorho ze-solder.
Ukungonelanga kwe-solder joint reflow ngomnye unobangela wokudityaniswa kwe-solder. Ngexesha lenkqubo ye-soldering, i-PCB ene-solder paste ifudunyezwa kwiqondo lobushushu elithile ukuze i-solder paste inyibilike kwaye ihambe ukuze yenze i-solder joints.Ukuba iprofayile yeqondo lokushisa okanye isethingi yokubuyisela kwakhona ayimiselwanga ngokuchanekileyo, i-solder paste ayinakunyibilika ngokupheleleyo okanye ihambe kakuhle. Oku kunokubangela ukunyibilika okungaphelelanga kunye nokwahlulwa okwaneleyo phakathi kweepadi ezikufutshane okanye iintambo, okukhokelela ekudibaneni kwe-solder.
Ungcoliseko lwe-PCB ngunobangela oqhelekileyo wokudityaniswa kwe-solder. Ngaphambi kwenkqubo ye-soldering, ukungcola okunjengothuli, ukufuma, ioli, okanye i-flux residue ingaba khona kwi-PCB surface.Ezi ngcoliseko zinokuphazamisana nokumanzisa okufanelekileyo kunye nokuhamba kwe-solder, okwenza kube lula ukuba i-solder yenze uxhulumaniso olungenanjongo phakathi kweepads ezikufutshane okanye ezikhokelela.
Intsalela ye-flux egqithisileyo inokubangela ukuba iibhulorho ze-solder zenziwe. I-Flux yikhemikhali esetyenziselwa ukususa i-oksidi kwiindawo zentsimbi kunye nokukhuthaza ukumanzisa kwe-solder ngexesha le-soldering.Nangona kunjalo, ukuba i-flux ayicocwanga ngokwaneleyo emva kwe-soldering, inokushiya intsalela. Ezi ntsalela zinokusebenza njenge-conductive medium, evumela i-solder ukuba yenze uqhagamshelo olungalindelekanga kunye neebhulorho ze-solder phakathi kweepads ezikufutshane okanye ezikhokelela kwi-PCB.
3. Amanyathelo othintelo kwi-SMT PCB iibhulorho zokuthengisa:
A. Lungiselela uyilo lwe-stencil kunye nokulungelelaniswa: Enye yezinto eziphambili ekuthinteleni iibhulorho ze-solder kukuphucula uyilo lwe-stencil kunye nokuqinisekisa ukulungelelaniswa okufanelekileyo ngexesha lesicelo sokunamathisela i-solder.Oku kubandakanya ukunciphisa ubungakanani bokuvula ukulawula inani le-solder paste efakwe kwi-PCB pads. Iisayizi ezincinci zepore zinceda ukunciphisa ukubakho kokugqithiswa kwe-solder intlama kunye nokwenza ibhulorho. Ukongeza, ukujikeleza imiphetho yemingxuma ye-stencil kunokukhuthaza ukukhululwa kwe-solder paste kunye nokunciphisa ukutyekela kwe-solder kwibhulorho phakathi kweepads ezikufutshane. Ukusebenzisa iindlela zokulwa nokuvalwa kweebhulorho, ezinjengokufaka iibhulorho ezincinci okanye izikhewu kuyilo lwestensile, nako kunokunceda ukuthintela ukudityaniswa kwe-solder. Ezi mpawu zokuthintela ibhulorho zenza umqobo womzimba othintela ukuhamba kwe-solder phakathi kweepads ezikufutshane, ngaloo ndlela ukunciphisa ithuba lokuqulunqwa kwebhulorho ye-solder. Ukulungelelaniswa okufanelekileyo kwethemplethi ngexesha lenkqubo yokuncamathisela kubalulekile ekugcineni isithuba esifunekayo phakathi kwamacandelo. Ukungalungelelanisi kukhokelela ekubekweni kwe-solder paste engalinganiyo, okwandisa umngcipheko weebhulorho ze-solder. Ukusebenzisa inkqubo yokulungelelanisa njengenkqubo yombono okanye ukulungelelaniswa kwelaser kunokuqinisekisa ukubekwa kwe-stencil echanekileyo kunye nokunciphisa ukwenzeka kwe-solder bridging.
B. Lawula inani le-solder paste: Ukulawula ubungakanani be-solder paste kubalulekile ukuthintela ukubekwa ngaphezulu, okunokukhokelela kwibhulorho ye-solder.Izinto ezininzi kufuneka ziqwalaselwe xa kumiselwa inani elilona lifanelekileyo le-solder paste. Oku kubandakanya i-pitch yecandelo, ubukhulu bestencil, kunye nobukhulu bepadi. Izithuba zamacandelo zidlala indima ebalulekileyo ekumiseleni inani elaneleyo le-solder paste efunekayo. Okuya kusondelelana ngamacandelo, ukuncamathisela kwe-solder encinci kuyafuneka ukuphepha ukubopha ibhulorho. Ubungqingqwa bestencil bukwachaphazela isixa se-solder paste efakiweyo. Iistencil ezityebileyo zikholisa ukufaka i-solder paste eninzi, ngelixa iistensile ezibhityileyo zikholisa ukufaka i-solder paste encinci. Ukulungelelanisa ubukhulu be-stencil ngokweemfuno ezithile zendibano ye-PCB kunokunceda ukulawula inani le-solder paste esetyenziswayo. Ubungakanani beepads kwi-PCB kufuneka kwakhona kuqwalaselwe xa kumiselwa isixa esifanelekileyo sokuncamathisela kwe-solder. Iipads ezinkulu zinokufuna umthamo ongaphezulu we-solder paste, ngelixa iipads ezincinci zinokufuna umthamo omncinci wokuncamathisela. Ukuhlalutya ngokuchanekileyo oku kuguquguquka kunye nokulungelelanisa umthamo we-solder paste ngokufanelekileyo kunokunceda ukuthintela ukubekwa kwe-solder ngokugqithisileyo kunye nokunciphisa umngcipheko we-solder bridging.
C. Qinisekisa ngokufanelekileyo i-solder joint reflow: Ukufezekisa i-solder joint reflow ibalulekile ekukhuseleni iibhulorho ze-solder.Oku kubandakanya ukuphumeza iiprofayili ezifanelekileyo zobushushu, amaxesha okuhlala, kunye nokusetwa kwakhona ngexesha lenkqubo yokuthengisela. Iprofayile yobushushu ibhekisa kwimijikelo yokufudumeza kunye nokupholisa i-PCB ehamba ngayo ngexesha lokuhamba kwakhona. Iprofayile yeqondo lokushisa ekhuthazwayo kwi-solder paste esetyenzisiweyo kufuneka ilandelwe. Oku kuqinisekisa ukunyibilika okupheleleyo kunye nokuhamba kwe-solder paste, okuvumela ukumanzisa okufanelekileyo kwecandelo elikhokelela kunye neepads ze-PCB ngelixa ukhusela ukugeleza okunganeleyo okanye okungaphelelanga. Ixesha lokuhlala, elibhekisa kwixesha i-PCB evezwe kubushushu obuphezulu bobushushu, kufuneka nalo liqwalaselwe ngononophelo. Ixesha elaneleyo lokuhlala livumela i-solder paste ukuba idibanise ngokupheleleyo kwaye yenze i-intermetallic compounds efunekayo, ngaloo ndlela iphucula umgangatho we-solder joint. Ukungonelanga kwexesha lokuhlala kubangela ukunyibilika okunganelanga, okukhokelela ekudibaneni kwe-solder engaphelelanga kunye nomngcipheko okhulayo weebhulorho ze-solder. Izicwangciso zokubuyela kwakhona, ezifana nesantya sokuhambisa kunye nobushushu obuphezulu, kufuneka ziphuculwe ukuze kuqinisekiswe ukunyibilika okupheleleyo kunye nokuqina kwe-solder paste. Kubalulekile ukulawula isantya sokuhambisa ukuhambisa ukushisa okwaneleyo kunye nexesha elaneleyo lokuba i-solder paste ihambe kwaye iqiniswe. Iqondo lobushushu eliphakamileyo kufuneka libekwe kwinqanaba elilelona lilona lokuncamatheliswa kwe-solder ethile, kuqinisekiswe ukuqukuqela kwakhona okupheleleyo ngaphandle kokubangela ukubekwa kwe-solder ngokugqithisileyo okanye ibhulorho.
D. Lawula ukucoceka kwePCB: Ulawulo olululo lococeko lwe-PCB lubalulekile ekuthinteleni ibhulorho ye-solder.Ukungcoliseka kumphezulu we-PCB kunokuphazamisa ukumanzisa kwe-solder kwaye kwandise amathuba okubunjwa kwebhulorho ye-solder. Ukuphelisa ukungcola ngaphambi kokuba inkqubo ye-welding ibaluleke kakhulu. Ukucoca ngokucokisekileyo ii-PCBs usebenzisa ii-arhente zokucoca ezifanelekileyo kunye nobuchule kuya kunceda ukususa uthuli, ukufuma, ioli, kunye nezinye izinto ezingcolileyo. Oku kuqinisekisa ukuba i-solder paste imanzisa ngokufanelekileyo i-pads ye-PCB kunye necandelo elikhokelela, ukunciphisa ukuba nokwenzeka kweebhulorho ze-solder. Ukongezelela, ukugcinwa ngokufanelekileyo kunye nokuphathwa kwe-PCBs, kunye nokunciphisa ukudibanisa kwabantu, kunokunceda ukunciphisa ukungcola kunye nokugcina inkqubo yonke yendibano icocekile.
E. Ukuhlolwa kwe-Post-Soldering kunye nokuSetyenziswa kwakhona: Ukwenza uhlolo olucokisekileyo olubonakalayo kunye nokuhlolwa kwe-automated optical inspection (AOI) emva kwenkqubo yokuthengisela kubalulekile ukuchonga nayiphi na imiba ye-solder bridging.Ukufunyanwa ngokukhawuleza kweebhulorho ze-solder kuvumela ukulungiswa kwakhona kwangexesha kunye nokulungiswa ukulungisa ingxaki ngaphambi kokubangela ezinye iingxaki okanye ukungaphumeleli. Ukuhlolwa okubonakalayo kubandakanya ukuhlolwa ngokucokisekileyo kwee-solder joints ukuchonga naziphi na iimpawu ze-solder bridging. Izixhobo zokukhulisa, ezifana ne-microscope okanye i-loupe, zinokunceda ngokuchanekileyo ubukho bebhuloho yamazinyo. Iisistim ze-AOI zisebenzisa itekhnoloji yokuhlola esekwe kumfanekiso ukubona ngokuzenzekelayo kunye nokuchonga iziphene zebhulorho ye-solder. Ezi nkqubo zinokuskena ngokukhawuleza ii-PCBs kwaye zinike uhlalutyo oluneenkcukacha zomgangatho odibeneyo we-solder, kubandakanya ubukho bebhuloho. Iinkqubo ze-AOI ziluncedo kakhulu ekukhangeleni iibhulorho ze-solder ezincinci, ekunzima ukuzifumana ezinokuphoswa ngexesha lokuhlolwa okubonakalayo. Emva kokuba ibhulorho ye-solder ifunyenwe, kufuneka ihlaziywe kwaye ilungiswe ngokukhawuleza. Oku kubandakanya ukusebenzisa izixhobo ezifanelekileyo kunye nobuchule bokususa i-solder engaphezulu kunye nokwahlula ukudibanisa kwebhulorho. Ukuthatha amanyathelo ayimfuneko ukulungisa iibhulorho ze-solder kubalulekile ekunqandeni iingxaki ezingaphezulu kunye nokuqinisekisa ukuthembeka kwemveliso egqityiweyo.
4. Izisombululo ezisebenzayo zeSMT PCB Solder Bridging:
A. I-Manual desoldering: Kwiibhulorho ezincinci ze-solder, ukususwa kwe-solder ye-manual sisisombululo esisebenzayo, usebenzisa i-coal-tip soldering iron phantsi kweglasi yokukhulisa ukufikelela kunye nokususa ibhulorho ye-solder.Le teknoloji idinga ukuphathwa ngokucophelela ukuphepha umonakalo kumacandelo ajikelezileyo okanye iindawo zokuqhuba. Ukususa amabhuloho e-solder, ukutshisa i-tip yentsimbi ye-solder kwaye uyifake ngokucophelela kwi-solder engaphezulu, uyinyibilikise kwaye uyisuse endleleni. Kubalulekile ukuqinisekisa ukuba i-tip ye-soldering iron ayidibanisi namanye amacandelo okanye iindawo ukuphepha ukwenza umonakalo. Le ndlela isebenza kakuhle apho ibhuloho ye-solder ibonakala kwaye ifikeleleke, kwaye kufuneka kuthathelwe ingqalelo ukwenza ukunyakaza okuchanekileyo nokulawulwayo.
B. Sebenzisa i-soldering iron kunye ne-solder wire ukuze usebenze kwakhona: Ukuphinda usebenze usebenzisa i-soldering iron kunye ne-solder wire (eyaziwa ngokuba yi-desoldering braid) sesinye isisombululo esisebenzayo sokususa iibhulorho ze-solder.Intambo ye-solder yenziwe ngocingo olucekethekileyo lobhedu olugqunywe nge-flux ukunceda kwinkqubo yokuchithwa. Ukusebenzisa le ndlela, i-wick ye-solder ibekwe phezu kwe-solder engaphezulu kunye nokushisa kwentsimbi ye-solder kusetyenziswa kwi-wick ye-solder. Ubushushu bunyibilikisa i-solder kwaye umsonto ufunxa i-solder etyhidiweyo, ngaloo ndlela uyisuse. Le ndlela ifuna ubuchule kunye nokuchaneka ukuphepha ukonakalisa amacandelo acekethekileyo, kwaye umntu kufuneka aqinisekise ukuba i-solder core coverage efanelekileyo kwibhulorho ye-solder. Le nkqubo ingadinga ukuphindaphinda amaxesha amaninzi ukususa ngokupheleleyo i-solder.
C. Ukufunyanwa kwebhulorho ye-solder ngokuzenzekelayo kunye nokususwa: Iinkqubo zokuhlola eziphezulu ezixhotyiswe ngeteknoloji yombono womatshini unokubona ngokukhawuleza iibhulorho ze-solder kwaye ziququzelele ukususwa kwazo ngokufudumeza kwe-laser yendawo okanye iteknoloji yejethi yomoya.Ezi zisombululo ezizenzekelayo zibonelela ngokuchaneka okuphezulu kunye nokusebenza kakuhle ekufumaneni nasekususeni iibhulorho ze-solder. Iinkqubo zombono womatshini zisebenzisa iikhamera kunye ne-algorithms yokucubungula imifanekiso ukuhlalutya umgangatho odibeneyo we-solder kunye nokufumanisa nayiphi na i-anomalies, kuquka iibhulorho ze-solder. Yakuba ichongiwe, inkqubo inokuvusa iindlela ezahlukeneyo zongenelelo. Enye indlela enjalo kukufudumeza kwelaser yendawo, apho i-laser isetyenziselwa ukufudumala okukhethiweyo kunye nokunyibilikisa ibhulorho ye-solder ukuze isuswe ngokulula. Enye indlela ibandakanya ukusebenzisa ijethi yomoya egxininisiweyo efaka ukuhamba komoya okulawulwayo ukuvuthela i-solder engaphezulu ngaphandle kokuchaphazela izinto ezingqongileyo. Ezi nkqubo zizenzekelayo zonga ixesha kunye nomgudu ngelixa ziqinisekisa iziphumo ezihambelanayo nezithembekileyo.
D. Sebenzisa i-wave soldering ekhethiweyo: I-selective wave soldering yindlela yokukhusela enciphisa umngcipheko weebhulorho ze-solder ngexesha lokubethelwa.Ngokungafaniyo nokuthengiswa kwamaza esintu, okuntywilisela i-PCB yonke kumaza e-solder etyhidiweyo, i-solder ekhethiweyo yamaza isebenza kuphela kwi-solder etyhidiweyo kwiindawo ezithile, ukudlula ngokulula amacandelo okanye iindawo zokuqhuba. Le teknoloji iphunyezwa ngokusebenzisa i-nozzle elawulwa ngokuchanekileyo okanye i-welding wave ye-welding ejolise kwindawo efunwayo ye-welding. Ngokukhetha ngokukhetha i-solder, umngcipheko wokusasazeka kwe-solder ngokugqithisileyo kunye ne-bridging inokunciphisa kakhulu. Ukuthengiswa kwamaza okukhethiweyo kusebenza ngokukodwa kwii-PCB ezinoyilo oluntsonkothileyo okanye amacandelo anoxinano oluphezulu apho umngcipheko we-solder bridging uphezulu. Inika ulawulo olukhulu kunye nokuchaneka ngexesha lenkqubo ye-welding, ukunciphisa ithuba lokuvela kweebhulorho ze-solder.
Isishwankathelo, I-SMT solder bridging ngumngeni obalulekileyo onokuchaphazela inkqubo yokuvelisa kunye nomgangatho wemveliso kwimveliso yombane. Nangona kunjalo, ngokuqonda izizathu kunye nokuthatha amanyathelo okukhusela, abavelisi banokunciphisa kakhulu ukwenzeka kwe-solder bridging. Ukuphucula uyilo lwe-stencil lubalulekile njengoko luqinisekisa ukubekwa kwe-solder ngokufanelekileyo kunye nokunciphisa ithuba lokuncamathisela kwe-solder ebangela ukubopha. Ukongeza, ukulawula umthamo we-solder paste kunye neeparamitha zokuphinda uqukunjelwe njengeqondo lobushushu kunye nexesha kunokunceda ukufezekisa ukwakheka ngokudibeneyo kwe-solder kunye nokuthintela ibhuloho. Ukugcina umphezulu we-PCB ucocekile kubalulekile ekuthinteleni ibhulorho ye-solder, ngoko ke kubalulekile ukuqinisekisa ukucocwa okufanelekileyo kunye nokususwa kwazo naziphi na izinto ezingcolisayo okanye intsalela ebhodini. Iinkqubo zokuhlolwa kwe-post-weld, ezifana nokuhlola okubonakalayo okanye iinkqubo ezizenzekelayo, ziyakwazi ukubona ubukho bamabhuloho e-solder kwaye ziququzelele ukuvuselela ngexesha elifanelekileyo ukusombulula le miba. Ngokuphumeza la manyathelo okuthintela kunye nokuphuhlisa izisombululo ezisebenzayo, abavelisi bezinto zombane banokunciphisa umngcipheko we-SMT solder bridging kwaye baqinisekise ukuveliswa kwezixhobo ezithembekileyo, ezikumgangatho ophezulu we-elektroniki. Inkqubo eyomeleleyo yolawulo lomgangatho kunye neenzame eziqhubekayo zokuphucula nazo zibalulekile ekubekeni iliso kunye nokusombulula nayiphi na imiba ephindaphindiweyo yokuhlanganisa i-solder. Ngokuthatha amanyathelo afanelekileyo, abavelisi banokwandisa ukusebenza kakuhle kwemveliso, ukunciphisa iindleko ezinxulumene nokusebenza kwakhona kunye nokulungiswa, kwaye ekugqibeleni bahambise iimveliso ezihlangabezana okanye ezidlula ukulindela kwabathengi.
Ixesha lokuposa: Sep-11-2023
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