Amanyathelo inkqubo yokwenziwa kwebhodi yesekethe yekeramic

Kodwa ngaba ukhe wazibuza ukuba zenziwe njani ezi bhodi zesekethe zeceramic? Ngawaphi amanyathelo abandakanyekayo kwinkqubo yabo yokuvelisa? Kule post yebhlog, siza kuntywila nzulu kwihlabathi elintsonkothileyo lokwenziwa kwebhodi yesekethe yeceramic, sijonga onke amanyathelo abandakanyekayo ekudalweni kwayo.

Ihlabathi le-electronics lihlala liguquka, kunye nezinto ezisetyenziselwa ukwenza izixhobo zombane. Iibhodi zeesekethe zeCeramic, ezikwabizwa ngokuba yi-ceramic PCBs, ziye zafumana ukuthandwa kwiminyaka yakutshanje ngenxa ye-thermal conductivity egqwesileyo kunye neempawu zokufakelwa kombane. Ezi bhodi zibonelela ngeenzuzo ezininzi ngaphezu kweebhodi zesekethe eziprintiweyo zemveli (PCBs), zizenza zilungele usetyenziso olwahlukeneyo apho ukuchithwa kwe-thermal kunye nokuthembeka kubaluleke kakhulu.

Inyathelo 1: Yila kunye nePrototype

Isinyathelo sokuqala kwinkqubo yokuvelisa ibhodi yesekethe ye-ceramic iqala ngokuyila kunye neprototyping yebhodi yesekethe. Oku kubandakanya ukusebenzisa isoftware eyodwa ukwenza iskimu kunye nokumisela uyilo kunye nokubekwa kwamacandelo. Nje ukuba uyilo lokuqala lugqityiwe, iiprototypes ziphuhliswa ukuvavanya ukusebenza kwebhodi kunye nokusebenza ngaphambi kokungena kwisigaba sokuvelisa umthamo.

Inyathelo 2: Ukulungiselela izinto eziphathekayo

Emva kokuba iprototype ivunyiwe, izinto ze-ceramic kufuneka zilungiswe. Iibhodi zeesekethe zeCeramic zihlala zenziwe nge-aluminium oxide (i-aluminium oxide) okanye i-aluminium nitride (AlN). Izinto ezikhethiweyo ziphantsi kwaye zixutywe kunye nezongezo zokuphucula iimpawu zabo, ezifana ne-thermal conductivity kunye namandla omatshini. Lo mxube ucinezelwe kumaphepha okanye iiteyiphu eziluhlaza, zilungele ukuqhutyelwa phambili.

Inyathelo lesi-3: Ukwenziwa kweSubstrate

Ngethuba le nyathelo, i-tape eluhlaza okanye iphepha lihamba kwinkqubo ebizwa ngokuba yi-substrate formation. Oku kubandakanya ukomisa izinto ze-ceramic ukususa umswakama kwaye emva koko usike kwisimo esifunwayo kunye nobukhulu. I-CNC (ulawulo lwamanani ekhompyutheni) okanye ii-laser cutters zihlala zisetyenziselwa ukufikelela kwimilinganiselo echanekileyo.

Inyathelo lesi-4: Ipateni yeSekethe

Emva kokuba i-substrate ye-ceramic yenziwe, inyathelo elilandelayo yipateni yesekethe. Kulapho umaleko obhityileyo wezinto zokuqhuba, ezifana nobhedu, ufakwa kumphezulu we-substrate usebenzisa iindlela ezahlukeneyo. Eyona ndlela ixhaphakileyo kukuprintwa kwesikrini, apho ithemplate enephethini yesekethe efunwayo ibekwe kwi-substrate kunye ne-inki eqhubayo inyanzeliswa ngetemplate phezu komhlaba.

Inyathelo lesi-5: Ukucula

Emva kokuba iphethini yesekethe yenziwe, ibhodi yesekethe ye-ceramic ithatha inkqubo ebalulekileyo ebizwa ngokuba yi-sintering. I-Sintering ibandakanya ukufudumeza iipleyiti ukuya kumaqondo obushushu aphezulu kwindawo elawulwayo, ngokuqhelekileyo kwi-oven. Le nkqubo idibanisa imathiriyeli ye-ceramic kunye nemikhondo eqhubayo kunye ukwenza ibhodi yesekethe eyomeleleyo kwaye ehlala ixesha elide.

Inyathelo lesi-6: Ukwenziwa kwesinyithi kunye nokuPlakwa

Emva kokuba ibhodi ifakwe i-sintered, inyathelo elilandelayo yi-metallization. Oku kubandakanya ukubeka umaleko obhityileyo wesinyithi, njenge-nickel okanye igolide, phezu kwemikhondo yobhedu evelileyo. I-Metallization isebenza ngeenjongo ezimbini - ikhusela ubhedu kwi-oxidation kwaye inika indawo engcono yokuthengiswa.

Emva kwe-metallization, ibhodi inokuthi iqhube iinkqubo ezongezelelweyo ze-plating. I-Electroplating inokuphucula iipropati okanye imisebenzi ethile, njengokubonelela ngokugqitywa kwendawo ethengiswayo okanye ukongeza isambatho sokukhusela.

Inyathelo lesi-7: Hlola kwaye uvavanye

Ulawulo lomgangatho luyinkalo ebalulekileyo kuyo nayiphi na inkqubo yokuvelisa, kunye nokuveliswa kwebhodi yesekethe ye-ceramic akukho nto. Emva kokuba ibhodi yesekethe yenziwe, kufuneka ihlolwe ngokungqongqo kunye novavanyo. Oku kuqinisekisa ukuba ibhodi nganye ihlangabezana neenkcukacha ezifunekayo kunye nemigangatho, kubandakanywa ukukhangela ukuqhubeka, ukuxhathisa ukugquma kunye nazo naziphi na iziphene ezinokuthi zibe khona.

Inyathelo 8: INdibano kunye nokuPakisha

Nje ukuba ibhodi iphumelele izigaba zokuhlola kunye nokuvavanya, ilungele ukudibanisa. Sebenzisa izixhobo ezizenzekelayo kumacandelo e-solder afana ne-resistors, i-capacitors, kunye neesekethe ezidibeneyo kwiibhodi zesekethe. Emva kwendibano, iibhodi zesekethe zidla ngokupakishwa kwiingxowa ezichasene nestatic okanye iipalethi, zilungele ukuthunyelwa kwindawo eziya kuyo.

Isishwankathelo

Inkqubo yokwenziwa kwebhodi yesekethe ye-ceramic ibandakanya amanyathelo abalulekileyo aliqela, ukusuka kuyilo kunye neprototyping ukuya kwi-substrate ukwakheka, ipateni yesekethe, i-sintering, i-metallization, kunye novavanyo. Inyathelo ngalinye lifuna ukuchaneka, ubuchule kunye nengqalelo kwiinkcukacha zokuqinisekisa ukuba imveliso yokugqibela ihlangabezana neenkcukacha ezifunekayo. Iimpawu ezikhethekileyo zeebhodi zeesekethe ze-ceramic zenza ukhetho lokuqala kwiindidi ezahlukeneyo zamashishini, kubandakanywa i-aerospace, i-automotive kunye ne-telecommunications, apho ukuthembeka kunye nokulawulwa kwe-thermal kubaluleke kakhulu.