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Ukusombulula iintsilelo eziqhelekileyo zeebhodi eziguquguqukayo eziqinileyo: Amaqhinga kunye nezenzo ezilungileyo

Ngaba ibhodi yakho engqongqo-flex ibangela iingxaki ezingalindelekanga ngezixhobo zakho zombane? subanexhala! Esi sithuba sebhlog sibonisa ezona ntsilelo zixhaphakileyo ezinokuthi zenzeke kwiibhodi eziqinileyo kwaye zibonelela ngezicwangciso ezisebenzayo kunye nezona ndlela zilungileyo zokusombulula le miba. Ukusuka ekuvuleni kunye neebhulukhwe ezimfutshane ukuya kwiziphene ze-soldering kunye nokusilela kwecandelo, siyigubungela yonke. Ngokusebenzisa iindlela ezifanelekileyo zokuhlalutya ukusilela kunye nokulandela iingcebiso zethu zengcali, uya kuba nako ukujongana nale miba ngokuthe ngqo kwaye ubuyisele ibhodi yakho eqinileyo.

Iibhodi zesekethe eziqinileyo zixhaphake kakhulu kwishishini le-elektroniki ngenxa yokukwazi ukubonelela ngamanqanaba aphezulu okuguquguquka, ukuthembeka kunye nokusebenza. Ezi bhodi zidibanisa ama-substrates aguquguqukayo kwaye aqinile ukuze enze uyilo olunzima kunye nokusetyenziswa kakuhle kwendawo. Nangona kunjalo,njengalo naliphi na icandelo le-elektroniki, iibhodi zesekethe eziqinileyo zinokusilela. Ukuqinisekisa ukuthembeka kunye nokusebenza kwezi bhodi, kubalulekile ukusebenzisa iindlela ezisebenzayo zokuhlalutya ukungaphumeleli. Kule post yebhlog, siza kuphonononga iindlela eziqhelekileyo zokuhlalutya ukusilela kwebhodi yesekethe.

eqinile flex pcb ukwenza inkqubo

1.Ukuhlolwa okubonwayo

Enye yeendlela zokuqala kunye nezona zisisiseko zokuhlalutya ukusilela kwiibhodi zesekethe eziqinileyo kukuhlola okubonakalayo. Ukuhlolwa okubonakalayo kubandakanya ukuhlolwa ngokucokisekileyo kwebhodi nayiphi na imiqondiso ebonakalayo yomonakalo, njengamanqaku aphukileyo, iipads eziphakanyisiweyo, okanye amacandelo awonakele. Obu buchule bunceda ukuchonga nayiphi na imiba ecacileyo enokubangela ukusilela kwaye ibonelela ngesiqalo sohlalutyo olongezelelweyo.

2. Ukuskena i-electron microscope (SEM)

Ukuskena i-electron microscopy (SEM) sisixhobo esinamandla esisetyenziselwa uhlalutyo lokungaphumeleli kumashishini ahlukeneyo, kuquka imboni yezombane. I-SEM inokwenza umfanekiso ophezulu we-high-resolution of the surface and cross-section of circuit boards, ukuveza ulwazi olucacileyo malunga nesakhiwo, ukubunjwa kunye naziphi na iziphene ezikhoyo. Ngokuhlalutya imifanekiso ye-SEM, iinjineli zinokumisela ingcambu yesizathu sokungaphumeleli, njengokuqhekeka, i-delamination okanye iingxaki ezidibeneyo ze-solder.

3. Ukuhlolwa kwe-X-ray

Ukuhlolwa kwe-X-ray yenye iteknoloji esetyenziswa ngokubanzi ukuhlalutya ukungaphumeleli kweebhodi zesekethe eziqinileyo. I-X-ray imaging ivumela iinjineli ukuba zihlalutye ubume bangaphakathi beebhodi zeesekethe, zichonge iziphene ezifihliweyo kunye nokugqiba umgangatho we-solder joints. Le ndlela yokuvavanya ingonakalisi inokubonelela ngengqiqo kwingcambu yesizathu sokungaphumeleli, njenge-voids, i-misalignment okanye i-welding eyaneleyo.

4. Imifanekiso eshushu

I-Thermal imaging, ekwabizwa ngokuba yi-infrared thermography, yitekhnoloji ebona kwaye ibone utshintsho kubushushu. Ngokubamba ukuhanjiswa kobushushu kwiibhodi zesekethe eziqinileyo, iinjineli zinokuchonga iindawo ezishushu ezinokuthi zibekho, izinto ezishushu kakhulu okanye ii-gradients ezingaqhelekanga zobushushu. I-Thermal imaging ibaluleke kakhulu ekuchongeni iingxaki ezibangelwa ukuhamba ngokugqithisileyo, ukuphathwa kakubi kwe-thermal, okanye amacandelo angahambelaniyo.

5. Uvavanyo lombane

Uvavanyo lombane ludlala indima ebalulekileyo ekuhlalutyeni ukungaphumeleli kweebhodi zesekethe eziqinileyo. Ubuchwephesha bubandakanya ukulinganisa iiparamitha zombane ezifana nokuchasana, amandla kunye nombane kwiindawo ezahlukeneyo kwibhodi yesekethe. Ngokuthelekisa imilinganiselo kunye neenkcukacha ezilindelekileyo, iinjineli ziyakwazi ukuchonga izinto ezingalunganga, iifutshane, ukuvula, okanye ezinye izinto ezingalunganga zombane.

6. Uhlalutyo lwamacandelo

Uhlalutyo olunqamlezayo lubandakanya ukusika kunye nokuvavanya iisampuli zeebhodi zesekethe eziqinileyo. Itekhnoloji yenza ukuba iinjineli zibe nombono wokwaleka kwangaphakathi, zichonge nakuphi na ukwahlukana okunokubakho okanye ukwahlula phakathi kweeleya, kunye nokuvavanya umgangatho wezinto zokwaleka kunye ne-substrate. Uhlalutyo olunqamlezayo lunika ukuqonda okunzulu kwesakhiwo sebhodi yesekethe kwaye kunceda ukuchonga imveliso okanye iziphene zoyilo.

7. Indlela yokusilela kunye noHlalutyo lweziphumo (FMEA)

Indlela yokungaphumeleli kunye noHlalutyo lweeMpembelelo (FMEA) yindlela ecwangcisiweyo yokuhlalutya kunye nokubeka phambili ukusilela okunokwenzeka ngaphakathi kwenkqubo. Ngokuqwalasela iindlela ezahlukeneyo zokungaphumeleli, izizathu zabo, kunye nefuthe ekusebenzeni kwebhodi, iinjineli zinokuphuhlisa izicwangciso zokunciphisa kunye nokuphucula uyilo, ukuvelisa, okanye iinkqubo zokuvavanya ukukhusela ukusilela kwixesha elizayo.

Isishwankathelo

Iindlela eziqhelekileyo zokuhlalutya ukusilela kuxoxwe kule post yebhlog zibonelela ngezimvo ezixabisekileyo ekuchongeni nasekusombululeni iingxaki zebhodi yesekethe engqongqo. Ingaba ngokuhlolwa okubonakalayo, ukuskena i-electron microscopy, ukuhlolwa kwe-X-ray, ukucinga nge-thermal, uvavanyo lombane, uhlalutyo lwamacandelwana, okanye imo yokungaphumeleli kunye nohlalutyo lwemiphumo; ubuchule ngalunye bunegalelo ekuqondeni ngokupheleleyo unobangela wokusilela. Ngokusebenzisa obu buchwepheshe, abavelisi kunye neenjineli banokwandisa ukuthembeka, ukusebenza kunye nokusebenza kweebhodi zesekethe eziguquguqukayo, ukuqinisekisa impumelelo yabo kwihlabathi eliguqukayo le-elektroniki.


Ixesha lokuposa: Oct-08-2023
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