I-Rigid-Flex PCB Delamination: Iimbangela, uThintelo kunye noNciphiso

I-Delamination ngumba obalulekileyo kwintsimi yeebhodi zesekethe eziqinileyo-flex (PCBs). Ibhekisa kukwahlulwa okanye ukwahlulwa kwamaleya ngaphakathi kwePCB, enokuchaphazela kakubi ukusebenza kwayo kunye nokuthembeka. I-Delamination inokubangelwa zizinto ezahlukeneyo, ezibandakanya iingxaki ngexesha lokwenziwa kwe-PCB, iindlela ezingafanelekanga zokuhlanganisa, kunye nokuphathwa kakubi kwe-PCB.
Kweli nqaku, injongo yethu kukuphonononga nzulu kwizizathu ezingemva kwe-delamination yeebhodi eziqinileyo kunye nokuphonononga iindlela ezisebenzayo zokuthintela le ngxaki. Ngokuqonda unobangela kunye nokuthatha amanyathelo afanelekileyo okuthintela, abavelisi kunye nabasebenzisi banokwandisa ukusebenza kwe-PCB kunye nokunciphisa umngcipheko wokuphazamiseka. Ukongeza, siza kuxoxa ngezicwangciso zokunciphisa ukujongana nokuncipha (ukuba kuyenzeka) kwaye siqinisekise ukuba iPCB iyaqhubeka nokusebenza ngokufanelekileyo. Ngolwazi oluchanekileyo kunye nendlela, i-delamination inokuncitshiswa, ikhulise ukusebenza kunye nobomi bokuphilaeqinile-flex PCBs.

1. Qonda izizathu zokwahlulahlulwa:

I-Delamination ingabalelwa kwizinto ezahlukeneyo, kubandakanywa ukukhethwa kwezinto eziphathekayo, inkqubo yokuvelisa, indalo

iimeko, kunye noxinzelelo lomatshini. Ukuchonga nokuqonda ezi zizathu kubalulekile ekuphunyezweni ngokufanelekileyo

amanyathelo okuthintela. Ezinye izizathu eziqhelekileyo ze-delamination kwiibhodi eziguquguqukayo zibandakanya:

Ukungonelanga kwonyango lomhlaba yenye yezona zizathu eziphambili ze-delamination yeebhodi eziqinileyo-flex. Ukucocwa okungonelanga kunye nokususwa okungcolileyo kunokuthintela ukudibanisa okufanelekileyo phakathi kweengqimba, okukhokelela kwiibhondi ezibuthathaka kunye nokuhlukana okunokwenzeka. Ngoko ke, ukulungiswa ngokucokisekileyo kwendawo, kubandakanywa nokucocwa kunye nokususwa kwezinto ezingcolileyo, kubalulekile ukuqinisekisa ukudibanisa okufanelekileyo kunye nokukhusela i-delamination.

Ukukhethwa kwezinto ezingafanelekanga yenye into ebalulekileyo ekhokelela kwi-delamination. Ukukhetha izinto ezingahambelaniyo okanye ezikumgangatho ophantsi kunokubangela ukungafani kwi-coefficients yokwandisa i-thermal phakathi kweengqimba kunye nokungahambelani kwezinto eziphathekayo. Lo mahluko wepropathi uvelisa uxinzelelo kunye noxinzelelo ngexesha lokuhamba ngebhayisikile eshushu, okubangela ukuba iileya zihlukane. Ukuqwalaselwa ngononophelo kwezixhobo kunye neempawu zazo ngexesha lesigaba soyilo kubalulekile ekunciphiseni umngcipheko we-delamination.

Ukongeza, ukunyanga okungonelanga okanye ukudibanisa ngexesha lokuvelisa kunokukhokelela kwi-delamination. Oku kunokwenzeka xa i-adhesives esetyenziswe kwinkqubo yokuqhawula i-lamination ayinyangeki ngokwaneleyo okanye iindlela zokubopha ezingalunganga zisetyenziswa. Ukunyangwa okungaphelelanga okanye ubuthathaka be-interlayer adhesion kunokukhokelela kunxibelelwano olungazinzanga, olunokukhokelela kwi-delamination. Ngoko ke, ukulawulwa ngokuchanekileyo kweqondo lokushisa, uxinzelelo kunye nexesha ngexesha le-lamination kubalulekile ukuqinisekisa ukuba ibhondi eyomeleleyo kunye nezinzileyo.

Ubushushu kunye nokutshintsha kokufuma ngexesha lokwenziwa, ukudibanisa, kunye nokusebenza nako kunokuba negalelo elibalulekileyo kwi-delamination. Ukuguquguquka okukhulu kobushushu kunye nokufuma kunokubangela ukuba iPCB yande okanye ifunxe ukufuma, nto leyo eyenza uxinzelelo kwaye inokukhokelela kwi-delamination. Ukunciphisa oku, iimeko zokusingqongileyo kufuneka zilawulwe kwaye ziphuculwe ukunciphisa iziphumo zobushushu kunye nokutshintsha kokufuma.

Okokugqibela, uxinzelelo lomatshini ngexesha lokuphatha okanye indibano lunokwenza buthathaka unxibelelwano phakathi kweeleya kwaye lukhokelela kwi-delamination. Ukuphathwa ngendlela engafanelekanga, ukugoba, okanye ukugqithwa kwemida yoyilo yePCB inokuthi ibeke iPCB kuxinzelelo lomatshini olugqitha amandla ebhondi ye-interlayer. Ukuthintela i-delamination, iindlela ezifanelekileyo zokuphatha kufuneka zilandelwe kwaye i-PCB akufuneki ibekwe phantsi kokugoba okugqithisileyo okanye uxinzelelo olungaphaya kwemida ebijoliswe kuyo.

ukuqonda izizathu ze-delamination okanye i-delamination ye-rigid-flex board kubalulekile ukuphumeza amanyathelo afanelekileyo okuthintela. Ukulungiswa komphezulu okungonelanga, ukukhethwa kwezinto ezingalunganga, ukunyanga okunganelanga okanye ukubopha, utshintsho lweqondo lokushisa kunye nokufuma, kunye noxinzelelo lomatshini ngexesha lokuphatha okanye ukudibanisa ezinye izizathu eziqhelekileyo ze-delamination. Ngokujongana nezi zizathu kunye nokusebenzisa ubuchule obufanelekileyo ngexesha lokwenziwa, ukudibanisa kunye nezigaba zokuphatha, umngcipheko wokunciphisa unokuncitshiswa, ngaloo ndlela uphucula ukusebenza kunye nokuthembeka kwee-PCB eziguquguqukayo.

2.Iindlela zokuthintela ezilayiweyo:

Ukuthintela i-delamination yeebhodi ze-rigid-flex zifuna indlela eninzi, kubandakanywa ukuqwalaselwa koyilo, izinto eziphathekayo

ukhetho,iinkqubo zokuvelisa, nokuphathwa ngendlela eyiyo. Ezinye iindlela zokuthintela ezisebenzayo ziquka

Iingqwalasela zoyilo zidlala indima ebalulekileyo ekuthinteleni i-delamination. Uyilo lwePCB oluyilwe kakuhle lunciphisa uxinzelelo kwiindawo ezinovakalelo kwaye luxhasa i-bend radii eyiyo, inciphisa ukuba nokwenzeka kwe-delamination. Kubalulekile ukuqwalasela oomatshini kunye noxinzelelo lwe-thermal i-PCB enokuthi ibe nayo ngexesha lokuphila kwayo. Ukusebenzisa i-vias edibeneyo okanye edibeneyo phakathi kwemigangatho emeleneyo kunokubonelela ngozinzo olongezelelweyo lomatshini kunye nokunciphisa iindawo zoxinzelelo. Obu buchule busasaza uxinzelelo ngakumbi ngokulinganayo kwi-PCB yonke, ukunciphisa umngcipheko wokudambisa. Ukongeza, ukusebenzisa iinqwelomoya zobhedu kuyilo kunokuncedisa ukomeleza ukuncamathela kunye nokutshatyalaliswa kobushushu, ukunciphisa ngokufanelekileyo ithuba lokuqhawuka.

Ukukhetha izinto eziphathekayo ngomnye umba ophambili ekuthinteleni i-delamination. Kubalulekile ukukhetha izixhobo ezinee-coefficients ezifanayo zokwandiswa kwe-thermal (CTE) kwi-core and flex layers. Izinto eziphathekayo ezine-CTE ezingahambelaniyo zinokufumana uxinzelelo olubalulekileyo ngexesha lokutshintsha kweqondo lokushisa, okukhokelela kwi-delamination. Ke ngoko, ukukhetha izixhobo ezibonisa ukuhambelana ngokweempawu zokwandiswa kwe-thermal kunokunceda ukunciphisa uxinzelelo kunye nokunciphisa umngcipheko we-delamination. Ukongeza, ukukhetha i-adhesives ephezulu kunye ne-laminates eyenzelwe ngokukodwa iibhodi eziqinileyo-flex iqinisekisa ibhondi eyomeleleyo kunye nokuzinza okuthintela i-delamination ngokuhamba kwexesha.

Inkqubo yokwenziwa kwemveliso idlala indima ebalulekileyo ekuthinteleni i-delamination. Ukugcina ubushushu obuchanekileyo kunye nolawulo loxinzelelo ngexesha lokutshisa kubalulekile ekufezekiseni ukudibanisa okwaneleyo phakathi kweengqimba. Ukutenxa ukusuka kumaxesha acetyiswayo zonyango kunye neemeko zinokubeka esichengeni ukomelela kwebhondi ye-PCB kunye nemfezeko, okonyusa ukubakho kokusilela. Ngoko ke, ukuthotyelwa okungqongqo kwinkqubo yonyango ekhuthazwayo kubalulekile. Ukuvelisa i-automation kunceda ekuphuculeni ukuhambelana nokunciphisa umngcipheko wephutha lomntu, ukuqinisekisa ukuba inkqubo ye-lamination yenziwa ngokuchanekileyo.

Ulawulo lokusingqongileyo ngomnye umba obalulekileyo ekuthinteleni ukudodobala. Ukudala indawo elawulwayo ngexesha lokwenziwa kwe-rigid-flex, ukugcinwa kunye nokuphatha kunokunciphisa ubushushu kunye nokutshintsha komswakama okunokukhokelela kwi-delamination. IiPCB zinovakalelo kwiimeko zokusingqongileyo, kwaye ukuguquguquka kobushushu kunye nokufuma kudala uxinzelelo kunye noxinzelelo olunokukhokelela kwi-delamination. Ukugcina indawo elawulwayo kunye nezinzile ngexesha lemveliso ye-PCB kunye nokugcinwa kunciphisa umngcipheko we-delamination. Iimeko ezifanelekileyo zokugcina, ezifana nokulawula amazinga okushisa kunye nokufuma, nazo zibalulekile ekugcineni ingqibelelo ye-PCB.

Ukuphathwa ngokufanelekileyo kunye nokulawulwa koxinzelelo kubalulekile ukukhusela i-delamination. Abasebenzi ababandakanyekayo ekuphatheni i-PCB kufuneka bafumane uqeqesho olululo kwaye balandele iinkqubo ezifanelekileyo zokunciphisa umngcipheko we-delamination ngenxa yoxinzelelo lomatshini. Gwema ukugoba ngokugqithiseleyo okanye ukugoba ngexesha lokuhlanganisa, ukufakela okanye ukulungiswa. Uxinzelelo lweMechanical ngaphaya kwemida yoyilo lwePCB lunokwenza buthathaka ikhonkco phakathi kweeleya, okukhokelela kwi-delamination. Ukuphumeza amanyathelo okukhusela, njengokusebenzisa iingxowa ezichasene ne-static okanye iipallets ezifakwe kwi-padded ngexesha lokugcinwa kunye nokuthutha, kunokunciphisa ngakumbi umngcipheko womonakalo kunye ne-delamination.

Ukuthintela i-delamination yeebhodi eziqinileyo-flex kufuna indlela ebanzi ebandakanya ukuqwalaselwa koyilo, ukukhetha izinto eziphathekayo, iinkqubo zokuvelisa, kunye nokuphathwa ngokufanelekileyo. Ukuyila i-PCB layout ukunciphisa uxinzelelo, ukukhetha izinto ezihambelanayo kunye nee-CTE ezifanayo, ukugcina ubushushu obuchanekileyo kunye nolawulo loxinzelelo ngexesha lokuvelisa, ukudala indawo elawulwayo, kunye nokuphumeza ukuphatha ngokufanelekileyo kunye neendlela zokulawula uxinzelelo zizo zonke iindlela zokuthintela ezisebenzayo. Ngokusebenzisa obu buchule, umngcipheko we-delamination unokuncitshiswa kakhulu, uqinisekisa ukuthembeka kunye nokusebenza kwexesha elide kwee-PCB eziguquguqukayo.

3.Isicwangciso-qhinga sokuNciphisa ngokweLayered:

Ngaphandle kwamanyathelo okhuseleko, ii-PCB ngamanye amaxesha ziye zibe noxinzelelo. Nangona kunjalo, kukho izicwangciso ezininzi zokunciphisa

enokuthi iphunyezwe ukusombulula umba kunye nokunciphisa impembelelo yawo. Ezi zicwangciso zibandakanya ukuchongwa kunye nokuhlolwa,

ubuchule bokulungisa i-delamination, ukuguqulwa koyilo, kunye nentsebenziswano nabavelisi bePCB.

Ukuchongwa kunye nokuhlola kudlala indima ebalulekileyo ekudambiseni ukudodobala. Ukuhlolwa rhoqo kunye novavanyo lunokunceda ukufumanisa i-delamination kwangethuba ukuze kuthathwe amanyathelo ngexesha elifanelekileyo. Iindlela zovavanyo ezingonakaliyo ezifana ne-x-reyi okanye i-thermography zinokunika uhlalutyo oluneenkcukacha lweendawo ezinokubakho i-delamination, zenza kube lula ukulungisa iingxaki ngaphambi kokuba zibe yingxaki. Ngokubona i-delamination kwangethuba, amanyathelo anokuthathwa ukunqanda umonakalo ongaphaya kunye nokuqinisekisa ingqibelelo yePCB.

Ngokuxhomekeke kwiqondo le-delamination, iindlela zokulungisa i-delamination zingasetyenziswa. Ezi ndlela zenzelwe ukuqinisa iindawo ezibuthathaka kunye nokubuyisela ingqibelelo yePCB. Ukuphinda kusetyenzwe kwakhona okukhethiweyo kubandakanya ukususwa ngononophelo kunye nokutshintshwa kwezahlulo ezonakeleyo zePCB ukuphelisa idelamination. Inaliti yokuncamathelisa yenye indlela apho izinto zokuncamathelisa ezikhethekileyo zitofwa kwiindawo ezinyibilikileyo ukuze kuphuculwe iqhina nokubuyisela imfezeko yesakhiwo. Ukuthengiswa komphezulu kungasetyenziselwa ukuncamathisela kwakhona ukuqhawuka, ngoko komeleza iPCB. Ezi ndlela zokulungisa zisebenza kakuhle ekujonganeni ne-delamination kunye nokuthintela umonakalo ongakumbi.

Ukuba i-delamination iba yingxaki eqhubekayo, uhlengahlengiso loyilo lunokwenziwa ukuthomalalisa ingxaki. Ukuguqula uyilo lwePCB yindlela esebenzayo yokuthintela ukwenzeka kwe-delamination kwasekuqaleni. Oku kunokubandakanya ukuguqula ubume bestaki ngokusebenzisa imathiriyeli eyahlukeneyo okanye ukwakheka, uhlengahlengiso lobunzima bomaleko ukunciphisa uxinzelelo kunye noxinzelelo, okanye ukudibanisa izixhobo ezongezelelweyo zokuqinisa kwiindawo ezibaluleke kakhulu ezithambekele kwi-delamination. Uhlengahlengiso loyilo kufuneka lwenziwe ngentsebenziswano kunye neengcali zokuqinisekisa esona sisombululo silungileyo sokuthintela i-delamination.

Ukusebenzisana nomvelisi we-PCB kubalulekile ukuthomalalisa ukusilela. Ukuseka unxibelelwano oluvulekileyo kunye neenkcukacha zokwabelana malunga nezicelo ezithile, iimeko ezingqongileyo kunye neemfuno zokusebenza kunokunceda abavelisi baphucule iinkqubo zabo kunye nezixhobo ngokufanelekileyo. Ukusebenza nabavelisi abanolwazi olunzulu kunye nobuchule kwimveliso ye-PCB, imiba ye-delamination inokulungiswa ngokufanelekileyo. Banokubonelela ngemibono exabisekileyo, bacebise uhlengahlengiso, bacebise ngezinto ezifanelekileyo, kwaye basebenzise ubuchule obukhethekileyo bokwenza ukuthintela ukuchithwa.

Amaqhinga okunciphisa i-Delamination anokunceda ukujongana nemiba ye-delamination kwii-PCBs. Ukuchongwa kunye nokuhlolwa ngovavanyo oluqhelekileyo kunye neendlela ezingonakalisi zibalulekile ekubhaqweni kwangaphambili. Iindlela zokulungisa i-Delamination ezifana nokusebenza ngokutsha okukhethiweyo, inaliti yokuncamathelisa, kunye ne-solder yomgangatho zingasetyenziselwa ukomeleza iindawo ezibuthathaka kunye nokubuyisela ingqibelelo yePCB. Uhlengahlengiso loyilo lunokwenziwa ngentsebenziswano neengcali ukunqanda ukwenzeka kwe-delamination. Okokugqibela, ukusebenza nomenzi we-PCB kunokubonelela ngegalelo elixabisekileyo kunye nokwandisa iinkqubo kunye nezixhobo zokujongana ngokufanelekileyo nemiba ye-delamination. Ngokuphumeza ezi zicwangciso, iziphumo ze-delamination zingancitshiswa, ziqinisekise ukuthembeka kunye nokusebenza kwe-PCB.

I-Delamination yeebhodi ezilukhuni-flex inokuba nemiphumo emibi yokusebenza kunye nokuthembeka kwezixhobo zombane. Ukuqonda unobangela kunye nokuphumeza iindlela ezisebenzayo zothintelo zibalulekile ekugcineni ingqibelelo yePCB.Imiba efana nokukhethwa kwemathiriyeli, iinkqubo zokwenziwa kwemveliso, ulawulo lokusingqongileyo kunye nokuphathwa ngendlela eyiyo zonke zidlala indima ebalulekileyo ekuthomalaliseni imingcipheko eyayanyaniswa ne-delamination. Umngcipheko we-delamination unokuncitshiswa kakhulu ngokuqwalasela izikhokelo zoyilo, ukukhetha izinto ezifanelekileyo, kunye nokuphumeza inkqubo yokuvelisa elawulwayo. Ukongeza, ukuhlolwa okusebenzayo, ukulungiswa ngexesha elifanelekileyo, kunye nentsebenziswano kunye neengcali kunokunceda ukusombulula imiba ye-delamination kunye nokuqinisekisa ukusebenza okuthembekileyo kwee-PCB eziguquguqukayo kwiinkqubo ezahlukeneyo ze-elektroniki.