Ekuqhutyweni kweebhodi zesekethe eziguquguqukayo, ubunzima obuphambili yindlela yokufezekisa ucinezelo olusebenzayo kwiindawo ezidibeneyo zeebhodi. Okwangoku, oku kuseyinkalo yokuba abavelisi bePCB kufuneka banikele ingqalelo ekhethekileyo kuyo. Ngezantsi, uCapel uya kukunika intshayelelo eneenkcukacha kwiingongoma ezininzi ezifuna ingqalelo.
I-Rigid Flexible PCB Substrate kunye ne-Prepreg Lamination: Iingqwalasela eziphambili zokuNcitshiswa kweWarpage kunye noNcedo loxinzelelo lweThermal
Nokuba wenza i-substrate lamination okanye i-prepreg lamination elula, ingqalelo kwi-warp kunye ne-weft yelaphu leglasi ibalulekile. Ukungahoyi ezi zinto kunokubangela uxinzelelo lwe-thermal kunye ne-warpage. Ukuqinisekisa ezona ziphumo ziphezulu zomgangatho wenkqubo yokulambisa, kufuneka kuqwalaselwe le miba. Makhe sihlolisise intsingiselo ye-warp kunye ne-weft directions, kwaye siphonononge iindlela ezisebenzayo zokunciphisa uxinzelelo lobushushu kunye nokunciphisa i-warpage.
I-Substrate lamination kunye ne-prepreg lamination ziindlela eziqhelekileyo zokuvelisa, ngokukodwa kwimveliso yeebhodi zeesekethe eziprintiweyo (PCBs), amacandelo e-elektroniki kunye nezixhobo ezidibeneyo. Ezi ndlela ziquka ukudibanisa iileya zemathiriyeli kunye ukwenza imveliso eyomeleleyo nesebenzayo. Phakathi kwezinto ezininzi zokuqwalaselwa kwe-lamination ephumelelayo, ukuqhelaniswa kwelaphu leglasi kwi-warp kunye ne-weft idlala indima ebalulekileyo.
I-Warp kunye ne-weft zibhekisa kumacala amabini aphambili eentsinga kwizinto ezilukiweyo ezifana nelaphu leglasi. Isalathiso se-warp ngokuqhelekileyo sihamba ngokunxuseneyo nobude bomqulu, ngelixa i-weft direction ihamba ngokuthe ngqo kwi-warp. Olu lungelelwaniso lubalulekile kuba lumisela iimpawu zomatshini wemathiriyeli, njengamandla okuqina kunye nokuzinza komda.
Xa kuziwa kwi-substrate lamination okanye i-prepreg lamination, i-warp efanelekileyo kunye nokulungelelaniswa kwe-weft yelaphu leglasi kubalulekile ekugcineni iimpawu zomatshini ezifunwayo zemveliso yokugqibela. Ukungaphumeleli ukulungelelaniswa kakuhle kwezi zikhokelo kunokubangela ukuthotywa kwemfezeko yesakhiwo kunye nomngcipheko owandisiweyo we-warpage.
Uxinzelelo lwe-thermal yenye into ebalulekileyo ekufuneka iqwalaselwe ngexesha le-lamination. Uxinzelelo lwe-thermal luxinzelelo okanye ukuguqulwa okwenzekayo xa izinto ziphantsi kokutshintsha kweqondo lokushisa. Inokukhokelela kwiingxaki ezahlukeneyo ezibandakanya ukulwa, i-delamination, kunye nokungaphumeleli koomatshini bezakhiwo ezilayitiweyo.
Ukuze kuncitshiswe uxinzelelo lwe-thermal kunye nokuqinisekisa inkqubo ye-lamination ephumelelayo, kubalulekile ukulandela izikhokelo ezithile. Okokuqala nokuphambili, qinisekisa ukuba ilaphu leglasi ligcinwa kwaye liphathwe kwindawo elawulwayo yobushushu ukuze kuncitshiswe umahluko wobushushu phakathi kwezinto kunye nenkqubo yokuthambisa. Eli nyathelo linceda ukunciphisa umngcipheko we-warping ngenxa yokwandiswa kwe-thermal ngokukhawuleza okanye ukucutha.
Ukongeza, ukufudumeza okulawulwayo kunye nokupholisa amazinga ngexesha le-lamination kunokunciphisa ngakumbi uxinzelelo lwe-thermal. Itekhnoloji yenza ukuba izinto eziphathekayo zihambelane ngokuthe ngcembe nokutshintsha kweqondo lokushisa, ukunciphisa umngcipheko wokulwa okanye utshintsho oluphezulu.
Kwezinye iimeko, kunokuba luncedo ukusebenzisa inkqubo yokunciphisa uxinzelelo lwe-thermal olufana nokunyanga kwe-post-lamination. Inkqubo ibandakanya ukuthobela ulwakhiwo olulaminethiweyo kutshintsho olulawulwayo nolucothayo lobushushu ukuze kuthomalaliswe nakuphi na ukucinezeleka kwe-thermal okushiyekileyo. Inceda ukunciphisa i-warpage, iphucula uzinzo lwe-dimensional kwaye yandisa ubomi beemveliso ze-laminated.
Ukongeza kwezi ngqwalasela, kukwabalulekile ukusebenzisa izixhobo ezisemgangathweni kunye nokubambelela kubuchule obufanelekileyo bokuvelisa ngexesha lenkqubo yokuthambisa. Ukukhethwa kwelaphu leglasi ekumgangatho ophezulu kunye nezixhobo ezihambelanayo zokudibanisa kuqinisekisa ukusebenza kakuhle kwaye kunciphisa umngcipheko wokulwa kunye noxinzelelo lobushushu.
Ukongezelela, ukusebenzisa iindlela ezichanekileyo nezithembekileyo zokulinganisa, ezifana ne-laser profilometry okanye i-strain gauges, inokubonelela ngengqiqo ebalulekileyo kwi-warpage kunye namanqanaba oxinzelelo lwezakhiwo ezilayiweyo. Ukubeka iliso rhoqo kwezi parameters kuvumela ukulungiswa kwangexesha kunye nezilungiso apho kuyimfuneko ukugcina imigangatho yomgangatho ofunekayo.
Into ebalulekileyo ekufuneka iqwalaselwe xa ukhetha izinto ezifanelekileyo kwizicelo ezahlukeneyo bubunzima kunye nobunzima bezinto.
Oku kuyinyani ngokukodwa kwiibhodi eziqinileyo ezifuna ukuba nobukhulu obuthile kunye nokuqina ukuze kuqinisekiswe umsebenzi ofanelekileyo kunye nokuqina.
Inxalenye eguquguqukayo yebhodi eqinile idla ngokuba yincinci kakhulu kwaye ayinayo ilaphu leglasi. Oku kuyenza ichaphazeleke kukothuka kokusingqongileyo kunye nobushushu. Kwelinye icala, inxalenye engqongqo yebhodi kulindeleke ukuba ihlale izinzile kwizinto ezinjalo zangaphandle.
Ukuba inxalenye engqongqo yebhodi ayinabo ubungqingqwa okanye ukuqina okuthile, umahluko kwindlela otshintsha ngayo xa kuthelekiswa nenxalenye eguquguqukayo unokuphawuleka. Oku kunokubangela ukulwa okukhulu ngexesha lokusetyenziswa, oku kunokuchaphazela kakubi inkqubo ye-soldering kunye nokusebenza ngokubanzi kwebhodi.
Nangona kunjalo, lo mahluko unokubonakala ungabalulekanga ukuba inxalenye eqinile yebhodi inomlinganiselo othile wobunzima okanye ukuqina. Nokuba inxalenye eguquguqukayo iyatshintsha, i-flatness iyonke yebhodi ayiyi kuchaphazeleka. Oku kuqinisekisa ukuba ibhodi ihlala izinzile kwaye ithembekile ngexesha le-soldering kunye nokusetyenziswa.
Kubalulekile ukuqaphela ukuba ngelixa ubukhulu kunye nobunzima bubalulekile, kukho imida yobukhulu obufanelekileyo. Ukuba iinxalenye ziba zikhulu kakhulu, kungekhona nje ukuba ibhodi iya kuba nzima, kodwa iya kuba yi-uconomical. Ukufumana ibhalansi elungileyo phakathi kobukhulu, ukuqina kunye nobunzima kubalulekile ekuqinisekiseni ukusebenza kakuhle kunye nokusebenza kakuhle kweendleko.
Uvavanyo olubanzi lwenziwe ukufumanisa ubukhulu obufanelekileyo beebhodi eziqinileyo. Ezi zilingo zibonisa ukuba ubukhulu be-0.8 mm ukuya kwi-1.0 mm bufaneleke ngakumbi. Ngaphakathi kolu luhlu, ibhodi ifikelela kwinqanaba elifunekayo lobunzima kunye nokuqina ngelixa ligcina ubunzima obamkelekileyo.
Ngokukhetha ibhodi eqinileyo enobunzima obufanelekileyo kunye nokuqina, abavelisi kunye nabasebenzisi banokuqinisekisa ukuba ibhodi iya kuhlala ithe tyaba kwaye izinzile naphantsi kweemeko ezahlukeneyo. Oku kuphucula kakhulu umgangatho jikelele kunye nokuthembeka kwenkqubo ye-soldering kunye nokufumaneka kwebhodi.
Imiba ekufuneka ithathelwe ingqalelo xa kusetyenzwa kwaye kufanelekile:
iibhodi zesekethe eziguquguqukayo eziqinileyo ziyindibaniselwano ye-substrates eguquguqukayo kunye neebhodi eziqinileyo. Olu luhlu ludibanisa iingenelo ezimbini, ezinokumbini ukuguquguquka kwezinto eziqinileyo kunye nokuqina. Esi sithako esikhethekileyo sidinga itekhnoloji yokucubungula ethile ukuqinisekisa ukusebenza kakuhle.
Xa uthetha malunga nokunyangwa kweefestile eziguquguqukayo kula mabhodi, ukugaya enye yeendlela eziqhelekileyo. Ngokubanzi, kukho iindlela ezimbini zokusila: nokuba yi-milling kuqala, kwaye emva koko i-flexibly milling, okanye emva kokugqiba zonke iinkqubo zangaphambili kunye nokubumba kokugqibela, sebenzisa ukusika kwe-laser ukususa inkunkuma. Ukukhethwa kweendlela ezimbini kuxhomekeke kwisakhiwo kunye nobukhulu bebhodi edibeneyo ethambileyo kwaye enzima ngokwayo.
Ukuba ifestile eguquguqukayo iqala ukugaywa ukuqinisekisa ukuchaneka kokugaya kubaluleke kakhulu. Ukugaya kufuneka kuchanekile, kodwa kuncinci kakhulu kuba akufanele kuchaphazele inkqubo ye-welding. Ukuza kuthi ga ngoku, iinjineli zinokulungisa idatha yokugaya kwaye zinokugaya kwangaphambili kwifestile eguquguqukayo ngokufanelekileyo. Ngale nto, i-deformation inokulawulwa, kwaye inkqubo ye-welding ayichaphazeleki.
Kwelinye icala, ukuba ukhetha ukungagayi ifestile eguquguqukayo, ukusika kwe-laser kuya kudlala indima. Ukusika iLaser yindlela esebenzayo yokususa inkunkuma yefestile eguquguqukayo. Nangona kunjalo, nikela ingqalelo kubunzulu be-laser cutting FR4. Kufuneka kunyuswe iiparamitha zocinezelo ngokufanelekileyo ukuqinisekisa ukusika okuyimpumelelo kweefestile eziguquguqukayo.
Ukuze kulungiswe iiparitha zoxinzelelo, iiparamitha ezisetyenziswa ngokubhekiselele kwii-substrates eziguquguqukayo kunye neebhodi eziqinileyo ziluncedo. Olu lungelelaniso lubanzi lunokuqinisekisa ukuba uxinzelelo olufanelekileyo luyasetyenziswa ngexesha loxinzelelo lwe-layer, ngaloo ndlela lwenza ibhodi edibeneyo enzima kunye nenzima.
Oku kungasentla yimiba emithathu efuna ingqwalasela ekhethekileyo xa kusetyenzwa kwaye ucinezela iibhodi zesekethe eziguquguqukayo. Ukuba uneminye imibuzo malunga neebhodi zeesekethe, nceda uzive ukhululekile ukudibana nathi. UCapel uqokelele iminyaka eyi-15 yamava atyebileyo kwishishini lebhodi yesekethe, kwaye itekhnoloji yethu kwibala leebhodi eziqinileyo zivuthiwe.
Ixesha lokuposa: Aug-21-2023
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