IiSubstrates zeBhodi yeSekethe yeCeramic:Ezona ndlela zisetyenziswa kakhulu

Kule post yebhlog, siza kujonga iindlela eziqhelekileyo ezisetyenziselwa ukubumba ibhodi yesekethe ye-ceramic substrates.

Ukubunjwa kwee-substrates zebhodi yesekethe ye-ceramic yinkqubo ebalulekileyo ekwenzeni izixhobo zombane. I-Ceramic substrates inozinzo oluhle kakhulu lwe-thermal, amandla aphezulu omatshini kunye nokwandiswa kwe-thermal ephantsi, ezenza zibe zilungele izicelo ezifana nombane wamandla, iteknoloji ye-LED kunye ne-automotive electronics.

1. Ukubumba:

Ukubumba yenye yezona ndlela zisetyenziswa ngokubanzi ukwenza ii-substrates zebhodi yesekethe yeceramic. Kubandakanya ukusebenzisa i-hydraulic press ukucinezela umgubo we-ceramic kwimo emiselweyo. Umgubo kuqala uxutywe kunye nezibophelelo kunye nezinye izongezo zokuphucula ukuhamba kwayo kunye neplastiki. Umxube ugalelwe kwi-mold cavity kwaye uxinzelelo lufakwe kwi-compact powder. I-compact isiphumo ke sintered kumaqondo obushushu aphezulu ukususa i-binder kunye ne-fuse amasuntswana e-ceramic kunye ukwenza i-substrate eqinileyo.

2. Ukuphosa:

Ukwenziwa kweteyiphu yenye indlela edumileyo yokwenza i-substrate yebhodi yesekethe yeceramic, ngakumbi kwiisubstrates ezibhityileyo nezibhetyebhetye. Kule ndlela, i-slurry ye-ceramic powder kunye ne-solvent isasazwa kwindawo ethe tyaba, njengefilimu yeplastiki. I-blade kagqirha okanye i-roller isetyenziselwa ukulawula ubukhulu be-slurry. I-solvent iyaphuphuma, ishiya i-tape eluhlaza, enokuthi inqunywe kwisimo esifunwayo. Iteyiphu eluhlaza ke iye yafakwa i-sintered ukususa nasiphi na isinyibilikisi esiseleyo kunye nesibophelelo, okukhokelela kwi-substrate eshinyeneyo yeceramic.

3. Isitofu sokubumba:

Isitofu sokubumba siqhele ukusetyenziselwa ukubumba iinxalenye zeplastiki, kodwa inokusetyenziselwa iinxalenye zebhodi yesekethe yeceramic. Indlela ibandakanya ukutofa i-ceramic powder exutywe kunye ne-binder kwi-mold cavity phantsi koxinzelelo oluphezulu. Umngundo ke ufudunyezwe ukususa isibophelelo, kwaye isiphumo somzimba oluhlaza sintered ukufumana substrate yokugqibela ceramic. Isitofu sokubumba sibonelela ngeenzuzo zesantya semveliso ekhawulezayo, iijometri zenxalenye entsonkothileyo kunye nokuchaneka okubalaseleyo komgangatho.

4. Extrusion:

Ukubunjwa kwe-Extrusion kusetyenziselwa ikakhulu ukwenza ii-substrates zebhodi yesekethe ye-ceramic ezineemilo ezinqamlezileyo ezinqamlezileyo, ezinjengeityhubhu okanye iisilinda. Inkqubo ibandakanya ukunyanzelisa i-plasticized ceramic slurry ngokusebenzisa isikhunta esinesimo esifunwayo. Intlama ke iyasikwa ibe ngobude obufunekayo kwaye yomiswe ukuze kususwe nakuphi na ukufuma okushiyekileyo okanye isinyibilikisi. Amalungu aluhlaza okomileyo agxothwa ukuze afumane i-substrate yokugqibela ye-ceramic. I-Extrusion yenza ukuveliswa okuqhubekayo kwee-substrates ezinemilinganiselo ehambelanayo.

5. Ushicilelo lwe-3D:

Ngokufika kwetekhnoloji eyongezelelweyo yokuvelisa, ushicilelo lwe-3D luba yindlela esebenzayo yokubumba i-substrates yebhodi yesekethe yeceramic. Kwi-ceramic 3D yoshicilelo, i-ceramic powder ixutywe kunye ne-binder ukwenza i-paste eprintiweyo. I-slurry ifakwe umaleko ngokomaleko, ngokulandela uyilo oluveliswe yikhompyuter. Emva kokushicilela, iindawo eziluhlaza zifakwe emanzini ukuze zisuse i-binder kwaye zidibanise iincinci ze-ceramic kunye nokwenza i-substrate eqinile. Ushicilelo lwe-3D lunikeza ukuguquguquka okukhulu koyilo kwaye kunokuvelisa ama-substrates anzima kunye alungelelanisiweyo.

Kufuphi

Ukubunjwa kwee-substrates zebhodi yesekethe ye-ceramic kunokugqitywa ngeendlela ezahlukeneyo ezifana nokubumba, ukubunjwa kwetape, ukubunjwa kwenaliti, i-extrusion kunye ne-3D yokushicilela. Indlela nganye ineengenelo zayo, kwaye ukhetho lusekwe kwizinto ezifana nemilo efunwayo, i-throughput, ukuntsonkotha, kunye neendleko. Ukukhethwa kwendlela yokubumba ekugqibeleni kugqiba umgangatho kunye nokusebenza kwe-substrate ye-ceramic, okwenza kube yinyathelo elibalulekileyo kwinkqubo yokuvelisa isixhobo sombane.