Ukubamba iiMpawu zeDijithali eziPhakamileyo ze-HDI PCB yePrototyping

Yazisa:

Wamkelekile kwiblogi kaCapel, apho injongo yethu kukubonelela ngesikhokelo esibanzi kwiprototyping HDI PCBs usebenzisa imiqondiso yedijithali enesantya esiphezulu. Ngeminyaka eyi-15 yamava okuvelisa ibhodi yesekethe, iqela lethu elizinikeleyo leengcali linokukunceda ukuba ujonge ubunzima beprototyping kunye nemveliso. Sinikezela ngeenkonzo zobugcisa zangaphambili kunye nasemva kokuthengisa ukuze siqinisekise ukwaneliseka okupheleleyo kwabathengi.Kweli nqaku, siza kuphonononga ubunzima be-HDI PCB prototyping, siqaqambise ukubaluleka kwemiqondiso yedijithali enesantya esiphezulu, kwaye sinikezele ngezimvo ezixabisekileyo ukukunceda ukuba ugqwese endle.

Icandelo 1: Ukuqonda iiMpembelelo ze-HDI PCB Prototyping

Ukufezekisa ukusebenza kakuhle kunye nokusebenza, kubalulekile ukuqonda ukubaluleka kweprototyping ye-HDI PCB kwizicelo zedijithali ezikhawulezayo. I-High-density interconnect (HDI) ii-PCB zenzelwe ukwamkela iileya ezininzi kunye neesekethe eziyinkimbinkimbi, ngaloo ndlela ziphucula imfezeko yomqondiso, ukunciphisa ukuphazamiseka, kunye nokuphucula ukusebenza kombane. Ezi zakhiwo ziba zibaluleke ngakumbi xa kusetyenzwa ngesantya esiphezulu imiqondiso yedijithali, apho nokuba i-impedance encinci engalunganga okanye ukugqwethwa komqondiso kunokukhokelela kurhwaphilizo lwedatha okanye ilahleko.

Icandelo lesi-2: Iingqwalasela eziphambili zePrototyping HDI PCBs

2.1 Uyilo lokuVeliswa (DfM)
Uyilo lokuVeliswa (DfM) ludlala indima ebalulekileyo kwiprototyping ye-HDI PCB. Ukusebenza ngokusondeleyo nabaqulunqi bebhodi ngexesha lenqanaba lokuqala lokucinga kuvumela ukudityaniswa okungenamthungo kweenkcukacha zoyilo kunye nobuchule bokuvelisa. Ngokubandakanya imigaqo ye-DfM efana nokwandisa ububanzi bomkhondo, ukukhetha imathiriyeli efanelekileyo, kunye nokuqwalasela ukubekwa kwecandelo, unokunciphisa imiceli mngeni yokuvelisa kunye nokunciphisa iindleko zizonke.

2.2 Ukukhetha izinto eziphathekayo
Ukukhetha izixhobo ezichanekileyo zeprototypes ze-HDI PCB kubalulekile ekufezekiseni ukusebenza kombane kunye nokuthembeka. Izixhobo ezine-dielectric ephantsi rhoqo, iipropathi ezilawulwayo zokuthintela, kunye neempawu ezibalaseleyo zokusasaza umqondiso kufuneka zifunwe. Ukongeza, cinga ukusebenzisa i-laminates ezikhethekileyo ezinesantya esiphezulu ukulawula ngokuqinileyo imfezeko yesiginali kunye nokunciphisa ukulahleka komqondiso.

2.3 Uyilo olugciniweyo kunye nokuthembeka komqondiso
Uyilo oluchanekileyo lwe-stackup lunokuchaphazela kakhulu imfezeko yomqondiso kunye nokusebenza ngokubanzi. Ukubekwa komaleko, ubukhulu bobhedu, kunye nobungqingqwa be-dielectric kufuneka kucwangciswe ngononophelo ukunciphisa i-crosstalk, ukulahleka komqondiso, kunye nokuphazamiseka kombane. Ukusebenzisa itekhnoloji yokulawula i-impedance elawulwayo ngelixa ibambelela kwimigangatho yoshishino inceda ukugcina imfezeko yomqondiso kunye nokunciphisa ukubonakaliswa.

Icandelo 3: HDI PCB Prototyping Technology

3.1 I-Microhole laser drilling
IiMicrovias zibaluleke kakhulu ekufezekiseni ukuxinana okuphezulu kweesekethe kwii-HDI PCBs kwaye zinokudalwa ngokufanelekileyo kusetyenziswa itekhnoloji yokomba yelaser. Ukugrunjwa kweLaser kuvumela ulawulo oluchanekileyo lobungakanani, ubungakanani bomlinganiso kunye nobukhulu bepad, ukuqinisekisa uqhagamshelo oluthembekileyo nakwizinto ezincinci. Ukusebenza kunye nomenzi we-PCB onamava afana neCapel iqinisekisa ukuphunyezwa okuchanekileyo kwenkqubo enzima yokugaya i-laser.
3.2 Lamination ngokulandelelanayo
I-lamination elandelelanayo yitekhnoloji ephambili esetyenziswa kwinkqubo yeprototyping ye-HDI PCB kwaye ibandakanya ukwahlula iileya ezininzi kunye. Oku kuvumela umzila ongqongqo, ubude obuncitshisiweyo bonxibelelwano, kunye nokunciphisa iiparadisi. Ngokusebenzisa itekhnoloji entsha ye-lamination efana ne-Build-Up Process (BUP), unokufezekisa uxinaniso oluphezulu ngaphandle kokubeka esichengeni intembeko yesignali.

Icandelo lesi-4: IiNdlela eziNgcono zokuSebenza eziPhakamileyo zeDijithali yeMfezeko yoMbonakaliso

4.1 Ukulawulwa kwe-impedance kunye nohlalutyo lwemfezeko yomqondiso
Ukuphumeza iindlela zokulawula i-impedance ezifana ne-impedance traces elawulwayo kunye nokulinganisa i-impedance kubalulekile ekugcineni imfezeko yomqondiso kuyilo lwedijithali olunesantya esiphezulu. Izixhobo zokulinganisa ezikwinqanaba eliphezulu zinokukunceda uhlalutye imiba yemfezeko yomqondiso, uchonge utshintsho olunokubakho lwe-impedance, kunye nokwandisa uyilo lwePCB ngokufanelekileyo.

4.2 Izikhokelo zoYilo lweSidima soMqondiso
Ukulandela izikhokelo zoyilo olukumgangatho ophezulu kushishino lwemiqondiso yedijithali enesantya esiphezulu kunokuphucula ukusebenza ngokubanzi kweprototype yakho ye-HDI PCB. Ezinye iindlela zokuzigcina engqondweni kukunciphisa ukungaqhubeki, ukulungisa iindlela zokubuya, kunye nokunciphisa inani lee-vias kwiindawo ezinesantya esiphezulu. Ukusebenza nophando lwethu olunamava kunye neqela lophuhliso kunokukunceda ukuba uthobele ezi zikhokelo ngokufanelekileyo.

Ukuququmbela:

Iprototyping HDI PCBs usebenzisa imiqondiso yedijithali enesantya esiphezulu kufuna ingqalelo ecokisekileyo kwiinkcukacha.Ngokusebenzisa ubuchule kunye namava eCapel, unokulungelelanisa iinkqubo, ukunciphisa umngcipheko wemveliso kwaye uzuze iziphumo eziphezulu. Ingaba ufuna iprototyping ngokukhawuleza okanye ukuveliswa kwevolumu, izixhobo zethu zokuvelisa ibhodi yesekethe zinokuhlangabezana neemfuno zakho. Qhagamshelana neqela lethu lobuchwephesha namhlanje ukuze ufumane umda wokukhuphisana kwihlabathi elikhawulezayo lokwenziwa kweempawu zedijithali ze-HDI PCB.