Amacandelo aphambili e-Multilayer FPC PCB

Iibhodi zesekethe eziguquguqukayo eziguquguqukayo ezininzi (ii-FPC PCB) zizinto ezibalulekileyo ezisetyenziswa kwiintlobo ngeentlobo zezixhobo zombane, ukusuka kwii-smartphones kunye neetafile ukuya kwizixhobo zonyango kunye neenkqubo zeemoto. Le teknoloji iphucukileyo inika ukuguquguquka okukhulu, ukuqina kunye nokuhanjiswa komqondiso okusebenzayo, okwenza ukuba ifuneke kakhulu kwihlabathi lanamhlanje elikhawulezayo ledijithali.Kule posi yebhlog, siza kuxoxa ngezinto eziphambili ezenza i-FPC ye-multilayer kunye nokubaluleka kwayo kwizicelo ze-elektroniki.

1. Isubstrate ethambileyo:

I-substrate eguquguqukayo sisiseko se-FPC ye-multilayer PCB.Inika ukuguquguquka okuyimfuneko kunye nokunyaniseka komatshini ukumelana nokugoba, ukugoba kunye nokujija ngaphandle kokubeka esichengeni ukusebenza kwe-elektroniki. Ngokuqhelekileyo, izixhobo ze-polyimide okanye i-polyester zisetyenziswa njengesiseko se-substrate ngenxa yokuzinza kwazo okuphezulu kwe-thermal, ukugquma kombane, kunye nokukwazi ukuphatha ukunyakaza okuguquguqukayo.

2. Umaleko oqhubayo:

Iileya eziqhubayo zezona nxalenye zibalulekileyo ze-FPC ye-PCB ezininzi kuba ziququzelela ukuhamba kwemiqondiso yombane kwisekethe.Ezi maleko zidla ngokwenziwa ngobhedu, olune-conductivity egqwesileyo yombane kunye nokumelana nomhlwa. I-foil yobhedu i-laminated kwi-substrate eguquguqukayo usebenzisa i-adhesive, kunye nenkqubo yokudibanisa elandelayo iyenziwa ukudala iphethini yesekethe efunekayo.

3. Umaleko wokugquma:

Iinsulating layers, ezaziwa ngokuba ziileyile ze-dielectric, zibekwe phakathi kweeleyile zokuqhuba ukuthintela iibhulukhwe ezimfutshane zombane kunye nokubonelela ngokuzihlukanisa.Zenziwe ngezinto ezahlukeneyo ezifana ne-epoxy, i-polyimide okanye imaski ye-solder, kwaye zinamandla aphezulu e-dielectric kunye nokuzinza kwe-thermal. Ezi maleko zidlala indima ebalulekileyo ekugcineni imfezeko yomqondiso kunye nokuthintela ukuphambana phakathi kwemikhondo ekufutshane yokuqhuba.

4. Imaski yesoda:

Imaski yeSolder ngumaleko okhuselayo osetyenziswa kumaleko okuqhuba kunye ne-insulating othintela iisekethe ezimfutshane ngexesha le-soldering kwaye ikhusela umkhondo wobhedu kwizinto zokusingqongileyo ezinjengothuli, ukufuma kunye ne-oxidation.Ngokuqhelekileyo ziluhlaza ngombala kodwa zingeza neminye imibala efana nebomvu, eluhlaza okwesibhakabhaka okanye emnyama.

5. Ukwaleka:

I-Coverlay, ekwabizwa ngokuba yifilimu yokugquma okanye ifilimu yokugquma, ngumaleko okhuselayo osetyenziswa kumphezulu ongaphandle we-FPC PCB enemigangatho emininzi.Inika i-insulation eyongezelelweyo, ukukhuselwa komatshini kunye nokuchasana nomswakama kunye nezinye izinto ezingcolileyo. Ii-Coverlays zihlala zinemingxuma yokubeka izinto kunye nokuvumela ukufikelela lula kwiipads.

6. Ukufakwa kobhedu:

I-Copper plating yinkqubo yokufaka i-electroplating umaleko obhityileyo wobhedu kwi-conductive layer.Le nkqubo inceda ekuphuculeni ukuhanjiswa kombane, i-impedance esezantsi, kunye nokuphucula imfezeko yolwakhiwo lwee-PCBs ze-FPC ezininzi. I-Copper plating iphinda iququzelele umkhondo we-pitch-pitch ye-high-density circuits.

7. Ngendlela:

Indlela yokudlula ngumngxuma omncinci ogrunjwayo ngokusebenzisa umaleko oqhubayo we-FPC we-multi-layer ye-FPC, edibanisa umaleko omnye okanye ngaphezulu kunye.Bavumela uqhagamshelo oluthe nkqo kunye nokwenza umzila wesiginali phakathi kweengqimba ezahlukeneyo zesekethe. I-Vias idla ngokuzaliswa ngobhedu okanye i-condutive paste ukuqinisekisa uqhagamshelo lombane oluthembekileyo.

8. Iipadi zecandelo:

Iipadi zecandelo ziindawo ezikwi-PCB ye-FPC eninzi eyenzelwe ukudibanisa amacandelo e-elektroniki anje ngeeresidi, ii-capacitors, iisekethe ezidibeneyo, kunye nezihlanganisi.Ezi pads ngokuqhelekileyo zenziwe ngobhedu kwaye zidibaniswe kwiindlela ezihamba phambili ezithintekayo usebenzisa i-solder okanye i-adhesive conductive.

Isishwankathelo:

Ibhodi yesekethe eprintiweyo eninzi (FPC PCB) sisakhiwo esintsonkothileyo esinamacandelo amaninzi asisiseko.I-flexible substrates, i-conductive layers, i-insulating layers, iimaski ze-solder, ii-overlays, i-copper plating, i-vias kunye neepads zecandelo zisebenza kunye ukubonelela ngoqhagamshelwano oluyimfuneko lombane, ukuguquguquka komatshini kunye nokuqina okufunwa zizixhobo zombane zanamhlanje. Ukuqonda la macandelo aphambili kunceda kuyilo kunye nokuveliswa kwee-PCB ze-FPC ezikumgangatho ophezulu ezihlangabezana neemfuno ezingqongqo kumashishini ahlukeneyo.