nybjtp

I-PCB ye-HDI enemigangatho emininzi iguqula unxibelelwano lwe-elektroniki

Intshayelelo iphonononga ukuba ukuvela kwee-PCBs ze-HDI ezininzi ziluguqule njani ushishino lonxibelelwano lwe-elektroniki.

kunye nenkqubela phambili eyenziweyo.

Kwinkalo ekhawulezayo yonxibelelwano lwe-elektroniki, ukusungula izinto ezintsha ngundoqo wokuhlala uphambili. Ukuvela kwe-multilayer high-density interconnect (HDI) iibhodi zeesekethe eziprintiweyo (PCBs) ziguqule ishishini, zibonelela ngeenzuzo ezininzi kunye nobuchule obungenakulinganiswa neebhodi zeesekethe zendabuko. Ukusuka kwizixhobo ze-IoT ukuya kwiziseko ezingundoqo ze-5G, ii-PCB ze-HDI ezinamanqwanqwa amaninzi zidlala indima ephambili ekubumbeni ikamva lonxibelelwano lwe-elektroniki.

Yintoni iI-multilayer HDI PCB? Ityhila ubuchwephesha obuntsonkothileyo kunye noyilo oluphambili lwee-PCB ze-HDI ezininzi kunye nolwazo oluthile

Ukufaneleka kwezicelo ze-elektroniki ezisebenza kakhulu.

Ii-PCB ze-Multilayer HDI ziibhodi zesekethe eziphucukileyo ezibonisa iileya ezininzi zobhedu oluqhubayo, oludla ngokufakwa phakathi kweeleya ze-insulating substrate material. Ezi bhodi zesekethe ezintsonkothileyo zenzelwe usetyenziso oluphezulu lwe-elektroniki, ngakumbi kwinkalo yonxibelelwano lwe-elektroniki.

IiNgcaciso eziPhambili kunye noKuqulunqwa kwezinto :Uphononongo lweenkcukacha ezichanekileyo kunye nokwakheka kwemathiriyeli okwenziwayo

multilayer HDI PCBs isisombululo esifanelekileyo kunxibelelwano elektroniki.

I-Multilayer HDI PCBs ezisetyenziswa kunxibelelwano lwe-elektroniki ngokuqhelekileyo zisebenzisa i-polyimide (PI) okanye i-FR4 njengesiseko sezinto, kunye nomaleko wobhedu kunye ne-adhesive ukuqinisekisa ukuzinza kunye nokusebenza. Ububanzi bomgca we-0.1mm kunye nesithuba sibonelela ngokuchaneka okungenakulinganiswa kunye nokuthembeka koyilo lweesekethe eziyinkimbinkimbi. Ngobukhulu bebhodi obuyi-0.45mm +/- 0.03mm, ezi PCB zibonelela ngolungelelwaniso olugqibeleleyo phakathi kokuqina kunye nokuqina, okubenza ukuba balungele izixhobo zonxibelelwano ezixineneyo.

Ubuncinci be-0.1 mm bokungena buqaqambisa ngakumbi ubunakho bokuvelisa obuphezulu bee-HDI PCBs ezinomaleko amaninzi, okuvumela ukudityaniswa kwezinto ezipakishwe ngokuxineneyo. Ubukho bee-vias ezingaboniyo kunye nezingcwatywayo (L1-L2, L3-L4, L2-L3) kunye nokuzaliswa komngxuma ocwecwe akuncedi kuphela ukudityaniswa okuntsonkothileyo kodwa kukhulisa ukuthembeka komqondiso jikelele kunye nokuthembeka kwebhodi.

Unyango lwakumphezulu – iGame Changer ibalaselisa ukubaluleka kokuntywiliselwa kwegolide ye-nickel engena-electroless (ENIG) kunye nefuthe layo ekugqithiseni umqondiso kunye nesakhono sokwamkela kwii-elektroniki zonxibelelwano.

I-Electroless Nickel Immersion Gold (ENIG) yonyango lomphezulu kuluhlu lobuninzi be-2-3uin ibonelela ngengubo yokukhusela ekhuselayo eqinisekisa ukuthengiswa okugqwesileyo kunye nokuxhathisa ukubola. Olu nyango lomphezulu lubaluleke kakhulu kwinkalo yonxibelelwano lwe-elektroniki. Ukusebenza kwePCB kuchaphazela ngqo ukuhanjiswa komqondiso kunye nesakhono sokufumana isixhobo.

Izicelo kuNxibelelwano lwe-Electronics zibonelela ngokujonga nzulu kwiinkqubo ezahlukeneyo ze-HDI PCBs ze-HDI kwi-5G.

iziseko zophuhliso, izixhobo ze-IoT nezinto ezinxitywayo, izixhobo zokunxibelelana ngomnxeba, kunye neenkqubo zonxibelelwano lweemoto.

Omnye weyona miba imangalisayo yee-PCBs zeHDI ezininzi kusetyenziso lwazo olwahlukeneyo kunxibelelwano lwe-elektroniki. Ezi PCB zingumqolo wezixhobo ezahlukeneyo kunye neenkqubo, zidlala indima ephambili ekuququzeleleni uqhagamshelwano olungenamthungo kunye nokusebenza. Makhe sihlolisise ezinye zezicelo eziphambili apho ii-PCB zeHDI ezininzi zihlengahlengisa ubume bonxibelelwano lwe-elektroniki.

HDI Second-Order 8 Layer Automotive PCB

I-Revolutionary Impact ichaza indlela ii-PCBs ze-HDI ezininzi eziyilungisa ngayo imbonakalo yonxibelelwano lwe-elektroniki, ibonelela

ukuguquguquka koyilo olungenakulinganiswa, ukunyusa ukuthembeka kwesignali kunye nokuthembeka, kunye nokuqhuba i-revolution ye-5G.

I-evolution ye-5G iteknoloji ichaze kwakhona iimfuno zeziseko zonxibelelwano, ezifuna isantya esiphezulu sokuhanjiswa kwedatha kunye nokusebenza okuphezulu. I-Multi-layer HDI PCB ibonelela ngeqonga elifanelekileyo lokuhlanganiswa okuxineneyo kwamacandelo kunye nokuhanjiswa komqondiso wesantya esiphezulu, okubaluleke kakhulu ukuvumela ukuthunyelwa kweziseko zophuhliso ze-5G. Ukukwazi kwabo ukuxhasa i-high-frequency kunye ne-high-speed signals kubenza babaluleke kakhulu ekwenzeni izikhululo ze-5G, i-antennas kunye nezinye izinto ezibalulekileyo.

Izixhobo ze-IoT kunye nezinto ezinokunxitywa

Ukwanda kwezixhobo ze-Intanethi yeZinto (IoT) kunye nezinto ezinxitywayo zifuna izinto ezixineneyo kodwa ezinamandla ze-elektroniki. Ii-PCB ze-Multilayer HDI ziyi-catalyst ye-innovation kule ntsimi, iququzelela ukuphuhliswa kwezixhobo ze-IoT eziphambili kunye nezinto ezinxitywayo kunye nezinto zabo ezidibeneyo kunye noqhagamshelwano oluphezulu. Ukusuka kwizixhobo ezihlakaniphile zasekhaya ukuya kwiimonitha zempilo ezinxitywayo, ezi PCBs zinceda ukuzisa ubomi bekamva lonxibelelwano lombane.

Izixhobo zonxibelelwano

Kwicandelo lezonxibelelwano apho ukuthembeka kunye nokusebenza akunakuphazamiseka, i-multi-layer HDI PCB iba sisisombululo sokuzikhethela. Ngokwenza udibaniso olungenamthungo lweeprothokholi zonxibelelwano ezintsonkothileyo, ukusetyenzwa komqondiso kunye nolawulo lwesekethe yolawulo lwamandla, ezi PCB zenza isiseko sezixhobo zonxibelelwano ezisebenza kakhulu. Nokuba yi-router, imodem okanye iseva yonxibelelwano, ii-PCBs zeHDI ezinamanqwanqwa amaninzi zenza umqolo kula macandelo abalulekileyo.

Inkqubo yonxibelelwano lweemoto

Njengoko umzi-mveliso weemoto utyhutyha uguquko lweparadigm ukuya kwizithuthi ezidityanisiweyo nezizimeleyo, imfuno yeenkqubo zonxibelelwano ezomeleleyo nezithembekileyo iye yanda. iiPCB ezininzi ze-HDI zibalulekile ekuqondeni umbono weenkqubo zeemoto eziqhagamshelweyo, ukuququzelela ukuphunyezwa kweenkqubo zoncedo lwabaqhubi (ADAS), unxibelelwano lwesithuthi ukuya kwisithuthi (V2V) kunye neenkqubo zolwazi lwe-infotainment yemoto. Uqhagamshelo olunoxinaniso oluphezulu kunye neenyawo ezihlangeneyo ezibonelelwa zezi PCBs zinceda ukuhlangabezana nesithuba esingqongqo kunye neemfuno zokusebenza kwee-automotive communications electronics.

Impembelelo yenguqu

Ukuvela kwe-multi-layer HDI PCB kuzise utshintsho kwi-paradigm kuyilo, ukuveliswa kunye nokusebenza konxibelelwano lwe-elektroniki. Ukukwazi kwabo ukuxhasa uyilo oluntsonkothileyo, imiqondiso yesantya esiphezulu kunye nemiba yefom ebambeneyo ivula amathuba angapheliyo, ivumela abaqulunqi kunye neenjineli ukuba batyhale imida yokuqamba izinto ezintsha. Indima yale PCB ihlanganisa izicelo ezahlukeneyo ezifana neziseko ze-5G, izixhobo ze-IoT, ezonxibelelwano kunye neenkqubo zemoto, kwaye ibe yinxalenye ebalulekileyo ekubunjweni kwexesha elizayo lonxibelelwano lwe-elektroniki.

Utshintsho loYilo oluguquguqukayo luchaza ukuba iteknoloji ye-HDI PCB yabaninzi ibakhulula njani abayili kwimida ye

ii-PCB zemveli, ezivumela ukuba zenze izixhobo zonxibelelwano zesizukulwana esilandelayo ezineempawu eziphuculweyo kunye nesakhono.

Itekhnoloji yesekethe ye-multi-layer HDI ikhulula abayili kwimithintelo yeePCB zemveli, ukubonelela ngokuguquguquka koyilo olungenakulinganiswa kunye nenkululeko. Ukukwazi ukudibanisa iileya ezininzi zetrayisi zokuqhuba kunye ne-vias kwindawo ehlangeneyo ayinciphisi nje i-PCB yonyawo jikelele kodwa ikwavula indlela yoyilo oluntsonkothileyo, olusebenza kakhulu lwesekethe. Olu tshintsho lutsha loyilo luququzelela uphuhliso lwezixhobo zonxibelelwano zesizukulwana esilandelayo, ukuvumela iimpawu ezininzi kunye nokusebenza ukuba kupakishwe kwizinto ezincinci, ezisebenza ngokufanelekileyo.

Ukwandiswa koMbonakaliso weMfezeko kunye nokuthembeka kuphonononga indima ebalulekileyo yee-PCB ze-HDI ezininzi ekuboneleleni ngophawu oluphezulu.

imfezeko kunye nokunciphisa ilahleko yesiginali, i-crosstalk, kunye ne-impedance mismatches kunxibelelwano lwe-elektroniki.

Kwinkalo yonxibelelwano lwe-elektroniki, imfezeko yomqondiso ibaluleke kakhulu. Ii-PCB ze-Multilayer HDI zenzelwe ukubonelela ngengqibelelo yomqondiso ophezulu ngokunciphisa ilahleko yesiginali, i-crosstalk kunye ne-impedance mismatch. Ukudityaniswa kwee-vias ezingaboniyo kunye nokungcwatywa, kunye nobubanzi belayini obuchanekileyo kunye nesithuba, kuqinisekisa ukuba imiqondiso enesantya esiphezulu idlula kwi-PCB ngokugqwetheka okuncinci, iqinisekisa unxibelelwano oluthembekileyo nakwizicelo ezinzima kakhulu. Eli nqanaba lengqibelelo yomqondiso kunye nokuthembeka kuqinisa i-multilayer HDI iibhodi zeesekethe eziprintiweyo njengezitshixo kunxibelelwano lwe-elektroniki lwanamhlanje.

Ukuqhuba i-5G Revolution kuveza indima ebalulekileyo yee-PCBs ze-HDI ezininzi ekuxhaseni inethiwekhi ye-5G enesantya esiphezulu, esezantsi.

kunye nokusasazwa kweziseko zophuhliso.

4 Umaleko woNxibelelwano Electronic Gear HDI Blind Buired Flex-Rigid Pcb

Ukuthunyelwa kweteknoloji ye-5G kuxhomekeke ekufumanekeni kweziseko zonxibelelwano ezisebenza kakhulu. Ii-PCB ze-Multilayer HDI ziye zaba ngumqolo weziseko ze-5G kwaye zidlala indima ephambili ekuvumeleni ukuthunyelwa kwe-high-speed, i-low-latency networks. Ukukwazi kwabo ukuxhasa ukuhlanganiswa okuxineneyo kwamacandelo, izibonakaliso eziphezulu ze-frequency kunye ne-complex interconnects iququzelela ukuphuhliswa kwezikhululo zesiseko se-5G, i-antennas kunye nezinye izinto eziphambili ezenza ilitye lembombo lonxibelelwano lwe-5G. Ngaphandle kwezakhono ezinikezelwa ngamabhodi eesekethe ze-multilayer HDI, ukuqonda amandla e-5G kuya kuhlala kuyinyani ekude.

Multilayer HDI PCB Production Process

Iingcinga zokuGqibela, ezibonisa ifuthe lenguquko yee-PCBs zeHDI ezinamanqwanqwa amaninzi kunye nendima yazo ehlala ihleli ekubumbeni ikamva le-HDI.

uqhagamshelwano kunye nonxibelelwano kwixesha ledijithali.

Uphuhliso lobuchwepheshe bonxibelelwano lwe-elektroniki luthungelane ngokuntsonkothileyo kunye nokuqhubela phambili kobugcisa be-HDI PCB enamaleko amaninzi. Ayizizo kuphela ezi PCB ezichaza kwakhona into enokwenzeka kuyilo, uqhagamshelo kunye nokusebenza, zikwavula indlela yetekhnoloji yokuguqula efana ne-5G, i-IoT kunye neemoto ezixhunyiwe. Njengoko imfuno ye-compact, ukusebenza okuphezulu konxibelelwano lwe-elektroniki kuqhubeka nokunyuka, ii-PCBs ze-HDI ezininzi zihlala ziphambili ekuqhubeni izinto ezintsha kunye nokuqhuba amaza alandelayo okuqhubela phambili ebaleni. Impembelelo yabo yenguqu kunxibelelwano lwe-elektroniki ayinakuphikiswa, kwaye indima yabo ekubumbeni ikamva loqhagamshelwano kunye nonxibelelwano iya kuqhubeka iminyaka ezayo.


Ixesha lokuposa: Jan-25-2024
  • Ngaphambili:
  • Okulandelayo:

  • Emva