Intshayelelo: Imingeni yobuGcisa kwi-Automotive Electronics kunyeIinguqulelo zeCapel

Njengoko ukuqhuba ngokuzimela kuguqukela kwi-L5 kunye neenkqubo zolawulo lwebhetri yemoto (EV) (BMS) zifuna ukuxinana kwamandla aphezulu kunye nokhuseleko, itekhnoloji ye-PCB yemveli iyasokola ukulungisa imiba ebalulekileyo:

• Imingcipheko yokubaleka kweThermal: Ii-chipsets zeECU zidlula ukusetyenziswa kwamandla e-80W, kunye namaqondo okushisa asekhaya afikelela kwi-150 ° C
• Imida yokuDityaniswa kwe-3D: I-BMS idinga i-256+ iziteshi zesignali ngaphakathi kwe-0.6mm ubukhulu bebhodi
• IiFayile zokungcangcazela: Iinzwa ezizimeleyo kufuneka zimelane ne-20G yothuso lomatshini
• Iimfuno zeMiniaturization: Abalawuli be-LiDAR bafuna i-0.03mm yobubanzi bokulandelela kunye ne-32-layer stacking

I-Capel Technology, isebenzise iminyaka eyi-15 ye-R & D, izisa isisombululo sokuguqula ukudibanisaPCBs conductivity ephezulu thermal(2.0W/mK),iiPCBs ezinobushushu obuphezulu(-55°C~260°C), kwaye32- umalekoI-HDI yangcwatywa/yimfama ngeteknoloji(0.075mm microvias).

ICandelo loku-1: Utshintsho loLawulo lwe-Thermal kwii-ECU zokuZiqhuba ngokuZimela

1.1 Imingeni ye-Thermal ye-ECU

• Ubuninzi bobushushu be-chipset yeNvidia Orin: 120W/cm²
• Iisubstrates eziqhelekileyo ze-FR-4 (0.3W/mK) zibangela i-35% ye-chip junction yeqondo lobushushu eligqithileyo
• I-62% yeentsilelo ze-ECU zivela kwi-thermal stress-induced solder fatigue

1.2 ITekhnoloji yeCapel's Thermal Optimization

Izinto ezintsha ezintsha:

• I-Nano-alumina eyomeleziweyo ye-polyimide substrates (2.0±0.2W/mK i-thermal conductivity)
• Iintsika zobhedu ze-3D (i-400% yokwandisa indawo yokulahla ubushushu)

Inkqubo yokuPhumelela:

• I-Laser Direct Structuring (LDS) kwiindlela eziphuculweyo ze-thermal
• Ukupakishwa kweHybrid: 0.15mm ubhedu obuninzi obubhityileyo + 2oz umaleko wobhedu onzima

Uthelekiso lweNtsebenzo:

Icandelo 2: I-BMS Wiring Revolution ene-32-Layer HDI Technology

2.1 Amanqaku eentlungu zoShishino kuYilo lwe-BMS

• Iiplatifti ze-800V zifuna i-256+ iitshaneli zokubeka iliso ze-cell voltage
• Uyilo oluqhelekileyo lugqithisa umda wendawo nge-200% kunye ne-15% ye-impedance engafanelekanga

2.2 Izisombululo ze-Capel's High-Density Interconnect

Ubunjineli bokuGcina:

• 1+N+1 naluphi na umaleko HDI isakhiwo (32 umaleko ku 0.035mm ubukhulu)
• ± i-5% yolawulo lwe-impedance eyahlukileyo (i-10Gbps izibonakaliso zesantya esiphezulu)

Iteknoloji yeMicrovia:

• 0.075mm laser-blind vias (12:1 ispect ratio)
• <5% platting void rate (IPC-6012B Class 3 iyahambelana)

Iziphumo zeBenchmark:

Icandelo lesi-3: Ukuthembeka Okugqithisileyo kokusiNgqongileyo-Izisombululo eziQinisekisiweyo ze-MIL-SPEC

3.1 Ukusebenza kweMathiriyeli yobushushu obuphezulu

• I-Glass Transition Temp (Tg): 280°C (IPC-TM-650 2.4.24C)
• Ukushisa kwe-Decomposition (Td): 385 ° C (5% ilahleko yobunzima)
• Ukusinda kweThermal Shock: Imijikelo eyi-1,000 (-55°C↔260°C)

3.2 IiTekhnoloji zoKhuseleko loBunini

• I-Plasma-grafted polymer coating (1,000h ukuxhathisa isitshizi setyuwa)
• I-3D EMI ekhusela imingxuma (60dB attenuation @10GHz)

Icandelo lesi-4: I-Case Study - Intsebenziswano ne-Global Top 3 EV OEM

4.1 800V BMS Control Module

• Umngeni: Hlanganisa i-512-channel AFE kwi-85 × 60mm indawo
• Isisombululo:
  1. I-PCB enamaleko angama-20 eqinile (i-3mm bend radius)
  2. Uthungelwano lwesivamvo sobushushu esilungisiweyo (0.03mm umkhondo wobubanzi bomkhondo)
  3. Indawo yokupholisa intsimbi engundoqo (0.15°C·cm²/W ukumelana nobushushu)

4.2 I-L4 i-Autonomous Domain Controller

• Iziphumo:
  • Ukucuthwa kwamandla ngama-40% (72W → 43W)
  • I-66% yokunciphisa ubungakanani vs. Uyilo oluqhelekileyo
  • Isiqinisekiso sokhuseleko se-ASIL-D esisebenzayo

Icandelo lesi-5: Iziqinisekiso kunye noQinisekiso loMgangatho

Inkqubo yomgangatho weCapel idlula imigangatho yemoto:

• Isiqinisekiso se-MIL-SPEC: Iyahambelana ne-GJB 9001C-2017
• Ukuthotyelwa kwezeMoto: IATF 16949: 2016 + AEC-Q200 ukuqinisekiswa
• UVavanyo lokuthembeka:
  • 1,000h HAST (130°C/85% RH)
  • I-50G yothuso lomatshini (MIL-STD-883H)

Isiphelo: Next-Gen PCB Technology Roadmap

UCapel unguvulindlela:

• Izinto ezizinzisiweyo zokwenziwa (30% ugcino lwendawo)
• I-Optoelectronic hybrid PCBs (0.2dB/cm ilahleko @850nm)
• Iinkqubo zeDFM eziqhutywa yi-AI (i-15% yokuphucula isivuno)

Qhagamshelana neqela lethu lobunjinelinamhlanje ukuhlanganisana ukuphuhlisa izisombululo zePCB ezilungelelanisiweyo kuhlobo lwakho olulandelayo lweemoto ze-elektroniki.