Imiba ye-flatness kunye nobungakanani bolawulo kwi-2-layer PCB stack-ups

Wamkelekile kwiblogi kaCapel, apho sixoxa ngazo zonke izinto ezinxulumene nokuveliswa kwePCB. Kweli nqaku, siza kujongana nemingeni eqhelekileyo kwi-2-layer PCB yokwakhiwa kwe-stackup kunye nokubonelela ngezisombululo zokujongana ne-flatness kunye nemiba yokulawula ubungakanani.I-Capel ibe ngumvelisi ohamba phambili we-Rigid-Flex PCB, i-Flexible PCB, kunye ne-HDI PCB ukususela ngo-2009. izisombululo.

Ukucabayinkalo ebalulekileyo ekufuneka iqwalaselwe xa usebenza ne-PCB stackups njengoko ichaphazela ngokuthe ngqo ukusebenza ngokubanzi kunye nokuthembeka kwemveliso yokugqibela. I-PCB ethe tyaba egqibeleleyo ibalulekile ekudibaneni kakuhle, ukubekwa kwecandelo ngokuchanekileyo, kunye nokulahla ubushushu obusebenzayo. Nakuphi na ukuphambuka kwi-flatness kunokukhokelela ekubunjweni kokubambisana kwe-solder, ukungahambi kakuhle kwecandelo, okanye uxinzelelo kwibhodi yesekethe engakhokelela kwiifutshane zombane okanye ukuvula.

Ulawulo lomgangathoyenye into ebalulekileyo kuyilo lwePCB, njengoko iqinisekisa ukuba ibhodi iya kungena ngokuchanekileyo ngaphakathi kwendawo ebiyelweyo. Ulawulo oluchanekileyo lwe-dimensional luvumela i-PCB ukuba idityaniswe ngaphandle komthungo kwimveliso yokugqibela, inqanda ukuphazamisana namanye amacandelo okanye izinto zesakhiwo.

Makhe sihlolisise izisombululo ezisebenzayo zokoyisa ukuba tyaba kunye nemiba yolawulo lwe-dimensional kwi-2-layer PCB stackups.

1. Ukukhethwa kwezinto:
Ukukhetha izinto ezifanelekileyo sisiseko se-PCB ethe tyaba. Khetha i-laminates ezikumgangatho ophezulu kunye nozinzo olubalaseleyo lwe-dimensional. Cinga ukusebenzisa i-CTE ephantsi (i-coefficient of thermal expansion) izinto ezifana ne-FR-4, ezinciphisa umngcipheko wokulwa ngenxa yokuguquguquka kweqondo lokushisa ngexesha lokuvelisa okanye ukusetyenziswa.

2. Ulandelelwano oluchanekileyo lokupakishwa:
Ukucwangciswa kweengqimba kwi-stack kunokuchaphazela kakhulu ukucaca. Qinisekisa ukuba iileya zilungelelaniswe kakuhle kwaye izinto eziphambili kunye ne-prepreg zisasazwa ngokulinganayo. Ukulinganisa ukuhanjiswa kweeleyile zobhedu ngaphakathi kwesitaki nako kukhuthaza ukwandiswa kwe-thermal efanayo, ngaloo ndlela kuncitshiswe amandla okulwa.

3. Ukulawulwa kwendlela yokuthintela:
Ukuphumeza umkhondo olawulwayo we-impedance akubalulekanga kuphela kwimfezeko yomqondiso kodwa kunceda nokugcina flatness. Sebenzisa iindlela ezilawulwa yi-impedance ukunqanda ukuguquguquka okugqithisileyo kubunzima bobhedu kwibhodi yonke, enokubangela ukugoba okanye ukugoba.

4. I-Vias kwaye ifakwe kwimingxuma:
Ubukho be-vias kunye ne-plad ngokusebenzisa imingxuma (PTH) inokwazisa iindawo zoxinzelelo kunye nokuchaphazela ukucaca. Kuphephe ukubeka ii-vias okanye ii-PTHs kwiindawo apho zinokubeka esichengeni isidima sebhodi. Endaweni yoko, cinga ukusebenzisa ii-vias ezingaboniyo okanye ezingcwatywe ukunciphisa nakuphi na ukungqubana okunokubakho okubangelwa kukwemba okanye iinkqubo zokucwenga.

5. Ulawulo lobushushu:
Ukuqinisekisa ukuchithwa kobushushu okusebenzayo kubalulekile ukugcina ukucaba. Thermal vias zisetyenziselwa ukususa ubushushu kude kwiindawo ezishushu kwibhodi yesekethe. Ukongeza, cinga ukusebenzisa inqwelomoya yobhedu okanye i-heat sink ukuze uchithe ubushushu ngokufanelekileyo. Ulawulo olwaneleyo lwe-thermal aluthinteli kuphela ukulwa, kodwa luphakamisa ukuthembeka okupheleleyo kwe-PCB.

6. Inkqubo yokwenziwa echanekileyo:
Sebenza kunye nomvelisi ohloniphekileyo njengoCapel onamava amaninzi ekuveliseni ii-PCB ezikumgangatho ophezulu. Ubuchule bokuvelisa obuphezulu, kubandakanywa ukuchaneka kokuchaneka, ukulawulwa kwe-lamination kunye noxinzelelo lwe-multi-layer, zibaluleke kakhulu ekufezekiseni ukucaca kunye nolawulo lwe-dimensional.

7. Amanyathelo olawulo lomgangatho:
Amanyathelo okulawula umgangatho angqongqo aphunyezwa kuyo yonke inkqubo yokuvelisa. Oku kuquka ukuhlolwa rhoqo, ubuchule bemetroloji ephucukileyo kunye nokuthotyelwa kwemigangatho yoshishino. Ulawulo olusebenzayo lomgangatho luqinisekisa ukuba ukutyeba kunye neemfuneko zolawulo lwe-dimensional zihlala zihlangatyezwa.

Isishwankathelo,ukutyeba kunye nolawulo lwe-dimensional lubaluleke kakhulu kwimpumelelo ye-2-layer PCB stackup. Ngokukhetha ngokucokisekileyo izinto eziphathekayo, ngokulandela ulandelelwano oluchanekileyo lokupakisha, ukuphumeza umzila olawulwayo we-impedance, ukulawula ukushisa ngokufanelekileyo, kunye nokusebenza nomenzi onamava afana neCapel, unokuyoyisa le mingeni kwaye ufezekise ukusebenza kwe-PCB ephezulu. Sukulalanisa kumgangatho we-PCB – thembela uCapel ukuba ahlangabezane nazo zonke iimfuno zakho zePCB.