Itekhnoloji yokuvelisa ezahlukeneyo ze-HDI zobuchwepheshe bePCB

Intshayelelo:

Iteknoloji ye-PCB ye-high-density interconnect (HDI) iguqule ishishini lombane ngokwenza ukuba kusebenze ngakumbi kwizixhobo ezincinci, ezikhaphukhaphu. Ezi PCB zihambele phambili ziyilelwe ukomeleza umgangatho wophawu, ukunciphisa uphazamiseko lwengxolo kunye nokukhuthaza ukwenziwa kweminiaturization. Kule post yebhlog, siza kuphonononga iindlela ezahlukeneyo zokuvelisa ezisetyenziselwa ukuvelisa ii-PCB zetekhnoloji ye-HDI. Ngokuqonda ezi nkqubo zintsonkothileyo, uya kufumana ukuqonda kwihlabathi elintsonkothileyo lokwenziwa kwebhodi yesekethe eprintiweyo kunye nokuba linegalelo njani ekuphuhliseni ubuchwephesha bale mihla.

1. I-Laser Direct Imaging (LDI) :

I-Laser Direct Imaging (LDI) bubuchwephesha obudumileyo obusetyenziselwa ukwenza iiPCBs ngobuchwepheshe beHDI. Ithatha indawo yeenkqubo ze-photolithography zendabuko kwaye ibonelela ngezakhono ezichanekileyo zokulinganisa. I-LDI isebenzisa i-laser ukubonisa ngokuthe ngqo i-photoresist ngaphandle kwesidingo semaski okanye i-stencil. Oku kwenza abavelisi bafezekise ubungakanani beempawu ezincinci, ukuxinana kwesekethe ephezulu, kunye nobhaliso oluchanekileyo.

Ukongeza, i-LDI ivumela ukudalwa kweesekethe ze-fine-pitch, ukunciphisa isithuba phakathi kweengoma kunye nokuphucula imfezeko yomqondiso jikelele. Ikwavumela iimicrovias ezichanekileyo, ezibaluleke kakhulu kwiiPCB zobuchwepheshe beHDI. IiMicrovias zisetyenziselwa ukudibanisa iileya ezahlukeneyo zePCB, ngaloo ndlela zikhulisa ubuninzi beendlela kunye nokuphucula ukusebenza.

2. Ulwakhiwo olulandelelanayo (SBU):

Indibano elandelelanayo (i-SBU) yenye iteknoloji ebalulekileyo yokuvelisa esetyenziswa ngokubanzi kwimveliso ye-PCB ye-HDI iteknoloji. I-SBU ibandakanya ulwakhiwo-ngoluhlu lwe-PCB, evumela ukubalwa komaleko ophezulu kunye nemilinganiselo emincinci. Itekhnoloji isebenzisa iileya ezininzi ezipakishweyo ezicekethekileyo, nganye inonxibelelwano kunye nee-vias zayo.

Ii-SBUs zinceda ukudibanisa iisekethe ezintsonkothileyo zibe zizinto ezincinci, zizenze zilungele izixhobo zombane ezihlangeneyo. Inkqubo ibandakanya ukusebenzisa i-insulating dielectric layer kwaye emva koko udale i-circuitry efunekayo ngokusebenzisa iinkqubo ezifana ne-additive plating, i-etching kunye ne-drilling. Ii-Vias zenziwa ngokugrumba i-laser, ukugrumba ngoomatshini okanye kusetyenziswa inkqubo yeplasma.

Ngethuba lenkqubo ye-SBU, iqela lokuvelisa kufuneka ligcine ulawulo oluqinileyo lomgangatho ukuqinisekisa ukulungelelaniswa okufanelekileyo kunye nokubhaliswa kweeleyile ezininzi. I-Laser drilling isoloko isetyenziselwa ukudala i-microvias encinci ye-diameter, ngokwandisa ukuthembeka kunye nokusebenza kwee-PCB zeteknoloji ze-HDI.

3. Itekhnoloji yokwenziwa kweHybrid:

Njengoko itekhnoloji iqhubeka nokuvela, itekhnoloji yokuvelisa i-hybrid iye yaba sisisombululo esithandwayo kwiiPCB zobuchwepheshe be-HDI. Obu buchwepheshe budibanisa iinkqubo zemveli kunye nezihambele phambili zokuphucula ukuguquguquka, ukuphucula ukusebenza kakuhle kwemveliso kunye nokwandisa ukusetyenziswa kobutyebi.

Enye indlela yokudibanisa kukudibanisa iteknoloji ye-LDI kunye ne-SBU ukudala iinkqubo zokuvelisa eziphucukileyo. I-LDI isetyenziselwa ipateni echanekileyo kunye neesekethe ze-fine-pitch, ngelixa i-SBU ibonelela ngolwakhiwo oluyimfuneko kunye nolwakhiwo kunye nokuhlanganiswa kweesekethe ezinzima. Le ndibaniselwano iqinisekisa ukuveliswa ngempumelelo kwee-PCB ezixineneyo, ezisebenza kakhulu.

Ukongeza, ukudityaniswa kwetekhnoloji yoshicilelo ye-3D kunye neenkqubo zokwenziwa kwe-PCB zemveli ziququzelela ukuveliswa kweemilo ezintsonkothileyo kunye nezakhiwo zomgodi ngaphakathi kweePCB zobuchwepheshe be-HDI. Oku kuvumela ulawulo olungcono lwe-thermal, ukunciphisa ubunzima kunye nokuphucula ukuzinza komatshini.

Isiphelo:

Itekhnoloji yokuvelisa esetyenziswa kwiiPCB zeTekhnoloji zeHDI idlala indima ebalulekileyo ekuqhubeni izinto ezintsha kunye nokudala izixhobo zombane eziphambili. Ukucinga ngokuthe ngqo kweLaser, ukwakheka okulandelelanayo kunye neteknoloji yokuvelisa i-hybrid ibonelela ngeenzuzo ezizodwa ezityhala imida ye-miniaturization, imfezeko yomqondiso kunye noxinzelelo lwesekethe. Ngokuqhubela phambili okuqhubekayo kobuchwepheshe, uphuhliso lobugcisa obutsha bokuvelisa kuya kuphucula ngakumbi amandla e-HDI teknoloji PCB kunye nokukhuthaza inkqubela phambili eqhubekayo yoshishino lwe-elektroniki.