Kweli nqaku libanzi, siphengulula kwihlabathi le-4-layer PCB stackups, esikukhokela kwezona buchule boyilo bugqwesileyo kunye noqwalaselo.
Intshayelelo :
Kwihlabathi le-PCB (ibhodi yesekethe eprintiweyo) uyilo, ukufezekisa i-stackup efanelekileyo kubalulekile ekuqinisekiseni ukusebenza okungaguqukiyo kunye nokusebenza okuthembekileyo. Ukuhlangabezana neemfuno ezihlala zisanda zezixhobo ze-elektroniki zale mihla, ezinje ngesantya esikhawulezayo, ingxinano ephezulu, kunye nokuphazamiseka kophawu olucuthiweyo, i-PCB ecwangciswe kakuhle enemigangatho emi-4 ibalulekile. Eli nqaku lisebenza njengesikhokelo esibanzi sokukunceda uqonde imiba ephambili kunye nengqwalasela ebandakanyekayo ekufezekiseni uthotho lwe-PCB ene-4-layer. Ke, masijonge kwihlabathi le-PCB egciniweyo kwaye sityhile iimfihlo kuyilo oluyimpumelelo!
umxholo:
1. Qonda iziseko ze-4-layer PCB stacking :
-I-PCB Stackup: Yintoni kwaye kutheni ibalulekile?
-Iingqwalasela eziphambili kuyilo lwesitaki esi-4.
- Ukubaluleka kolungelelwaniso olululo.
- Imiqondiso kunye nokuhanjiswa kweeleyile: iindima kunye neendawo.
- Izinto ezichaphazela ukukhethwa kwezinto ezingundoqo zangaphakathi kunye ne-prepreg.
Ugcino lwePCB:Ugcino lwePCB lubhekisa kulungiselelo kunye noqwalaselo lweeleya ezahlukeneyo kwibhodi yesekethe eprintiweyo. Ibandakanya ukubeka iileya ze-conductive, insulating, kunye ne-signal distribution layers ngendlela ethile ukuze kuphunyezwe umbane ofunekayo kunye nokusebenza kwe-PCB. I-PCB stackup ibalulekile kuba imisela imfezeko yomqondiso, ukuhanjiswa kwamandla, ulawulo lwe-thermal kunye nokusebenza ngokubanzi kwe-PCB.
Iingqwalasela ezingundoqo kuYilo lweSitaki esi-4:
Xa uyila i-4-layer PCB stack-up, eminye imiba ephambili ibandakanya:
Ingqibelelo yoMqondiso:
Ukubeka iileya zesignali ngokusondeleyo omnye komnye ngelixa ugcina amandla kunye neenqwelomoya zomhlaba ezikufutshane kuphucula imfezeko yesignali ngokunciphisa i-impedance phakathi kweempawu zomqondiso kunye neenqwelo-moya zokubhekisela.
Amandla kunye noKwabiwa komhlaba:
Ukusasazwa ngokufanelekileyo kunye nokubekwa kwamandla kunye neenqwelo-moya zomhlaba zibalulekile ekuhanjisweni kwamandla okusebenzayo kunye nokunciphisa ingxolo. Kubalulekile ukunikela ingqalelo kubunzima kunye nesithuba phakathi kwamandla kunye neenqwelomoya zomhlaba ukunciphisa i-impedance.
Ulawulo lobushushu:
Ukubekwa kwe-thermal vias kunye ne-heat sinks kunye nokusasazwa kweenqwelomoya zokushisa kufuneka kuthathelwe ingqalelo ukuze kuqinisekiswe ukutshatyalaliswa kobushushu obusebenzayo kunye nokuthintela ukushisa.
Ukubekwa kwecandelo kunye nokuqhubekeka:
Ingqwalasela enononophelo kufuneka inikwe ekubekweni kwecandelo kunye nendlela yokuqinisekisa umzila wesignali ngeyona ndlela kwaye uthintele ukuphazamiseka komqondiso.
Ukubaluleka koLungiselelo olululo loMaleko:Ukucwangciswa komaleko kwisitaki se-PCB kubalulekile ekugcineni imfezeko yomqondiso, ukunciphisa ukuphazamiseka kwe-electromagnetic interference (EMI), kunye nokulawula ukuhanjiswa kwamandla. Ukubekwa kakuhle komaleko kuqinisekisa i-impedance elawulwayo, kunciphisa i-crosstalk, kunye nokuphucula ukusebenza ngokubanzi koyilo lwePCB.
Iimpawu kunye neeleya zokuhambisa:Iimpawu zihlala zihanjiswa kumaleko emiqondiso aphezulu nasezantsi, ngelixa amandla kunye neenqwelomoya zomhlaba zingaphakathi. Uluhlu lokusabalalisa lusebenza njengamandla kunye nendiza yomhlaba kwaye inika indlela ephantsi ye-impedance yamandla kunye nokudibanisa komhlaba, ukunciphisa ukuhla kwamandla kunye ne-EMI.
Izinto ezichaphazela uNdoqo kunye noKhetho lwaPhambili lweMathiriyeli:Ukukhethwa kwezinto eziphambili kunye ne-prepreg ye-PCB egciniweyo ixhomekeke kwizinto ezifana neemfuno zokusebenza kombane, uqwalaselo lolawulo lwe-thermal, ukwenziwa, kunye neendleko. Ezinye izinto ezibalulekileyo ekufuneka ziqwalaselwe ziquka i-dielectric constant (Dk), i-dielectric factor (Df), iqondo lokushisa lokutshintsha kweglasi (Tg), ubukhulu, kunye nokuhambelana neenkqubo zokuvelisa ezifana ne-lamination kunye nokugaya. Ukukhetha ngononophelo kwezi mathiriyeli kuqinisekisa iimpawu ezifunwayo zombane kunye noomatshini bePCB.
2. Ubuchwephesha bogcino lwe-PCB yomaleko-4:
- Ukubekwa kwecandelo ngononophelo kunye nomkhondo womzila wamandla asebenzayo kunye nemfezeko yomqondiso.
- Indima yeenqwelo-moya zomhlaba kunye namandla ekunciphiseni ingxolo kunye nokwandisa ukunyaniseka komqondiso.
- Qinisekisa ubukhulu obufanelekileyo kunye ne-dielectric engaguqukiyo yomaleko ngamnye.
-Thatha ithuba lolawulo lwe-impedance kuyilo olukwisantya esiphezulu.
-Ukuqwalaselwa kwe-Thermal kunye nokulawulwa kwe-thermal kwi-stacks ye-multilayer.
Obu buchule bunceda ukufezekisa ugcino lwe-PCB enemigangatho emi-4:
Ukubekwa kwecandelo ngononophelo kunye nomkhondo womzila:Amandla asebenzayo kunye nemfezeko yomqondiso inokufezekiswa ngokubekwa kwecandelo ngononophelo kunye nokulandela umkhondo. Amaqela anxulumeneyo kunye nokuqinisekisa unxibelelwano olufutshane, oluthe ngqo phakathi kwabo. Nciphisa ubude bomkhondo kwaye uphephe ukuwela imikhondo ebuthathaka. Sebenzisa izithuba ezifanelekileyo kwaye ugcine iimpawu ezinovakalelo kude nemithombo yengxolo.
IiPlanethi ezisemhlabeni kunye nezaMandla:Iinqwelomoya eziphantsi komhlaba nezamandla zidlala indima ebalulekileyo ekunciphiseni ingxolo nokwandisa imfezeko yomqondiso. Sebenzisa umhlaba ozinikeleyo kunye neenqwelomoya zamandla ukubonelela ngenqwelomoya ezinzileyo kunye nokunciphisa ukuphazamiseka kwe-electromagnetic (EMI). Qinisekisa uqhagamshelo olululo kwezi nqwelomoya ukuze kugcinwe indlela ephantsi ye-impedance yembuyekezo yangoku.
Khangela ubukhulu obufanelekileyo bomaleko kunye ne-dielectric engaguqukiyo:Ubuninzi kunye ne-dielectric eqhubekayo yomaleko ngamnye kwi-stack ichaphazela ukusabalalisa umqondiso kunye nokulawula i-impedance. Qinisekisa ixabiso elifunekayo le-impedance kwaye ukhethe ubukhulu obufanelekileyo kunye ne-dielectric engaguqukiyo kwinqanaba ngalinye ngokufanelekileyo. Ukuphonononga izikhokelo zoyilo lwePCB kwaye uqwalasele ubuninzi bomqondiso kunye neemfuno zentambo yothumelo.
Indlela eLawulwayo yokuKhubazeka:Ukulawulwa kwe-impedance routing kubalulekile kuyilo lwesantya esiphezulu ukunciphisa ukubonakalisa umqondiso, ukugcina imfezeko yomqondiso, kunye nokuthintela iimpazamo zedatha. Misela amaxabiso afunekayo okumelana neempawu ezibalulekileyo kunye nokusetyenziswa kobuchule bokulawulwa kwe-impedance obufana nokwahlukana kwesibini, umgca we-strip okanye umzila we-microstrip, kunye ne-impedance vias elawulwayo.
Iingqwalasela kunye noLawulo lweThermal:Ulawulo lobushushu lubalulekile kwiimfumba zePCB ezininzi. Ukutshatyalaliswa kokushisa okufanelekileyo kuqinisekisa ukuba amacandelo asebenza ngaphakathi kwemida yawo yokushisa kwaye agweme umonakalo onokwenzeka. Qwalasela ukongeza vias thermal ukudlulisa ubushushu kwiinqwelomoya emhlabeni lwangaphakathi okanye pads thermal, sebenzisa vias thermal kufutshane amacandelo amandla aphezulu, kwaye udibanise ne izitsi ubushushu okanye ugalela ubhedu ukusasazwa ngcono ubushushu.
Ngokusebenzisa obu buchule, unokuqinisekisa ukuhanjiswa kwamandla okusebenzayo, ukunciphisa ingxolo, ukugcina imfezeko yomqondiso, kunye nokwandisa ulawulo lwe-thermal kwi-4-layer PCB stackup.
3. Yilwa ingqwalasela yokwenza i-PCB ene-4-layer:
-Ibhalansi yokwenziwa kwezinto kunye nobunzima boyilo.
-UYilo lweZenzo zokuSebenza (DFM) eziBalaseleyo.
- Ngokusetyenziswa kohlobo kunye nokuqwalaselwa koyilo.
- Imithetho yokuyila isithuba, ukulandelela ububanzi, kunye nococeko.
-Sebenzisa nomvelisi we-PCB ukufezekisa ugcino olululo.
Ukulungelelanisa ukuVeliswa kunye nokuNxina koYilo:Xa uyila i-PCB ene-4-layer, kubalulekile ukubetha ibhalansi phakathi kobunzima boyilo kunye nokulula ukwenza. Uyilo oluntsonkothileyo lunokunyusa iindleko zokwenziwa kunye neempazamo ezinokwenzeka. Ukwenziwa lula uyilo ngokulungiselela ukubekwa kwecandelo, ukulungelelanisa umzila wesiginali, kunye nokusetyenziswa kwemithetho yoyilo esemgangathweni kunokuphucula ukwenziwa.
UYilo lweZenzo zoKwenziwa (DFM) eziNgcono:Dibanisa iingqwalaselo ze-DFM kuyilo lokuqinisekisa ukwenziwa ngokufanelekileyo nokungenazimpazamo. Oku kuquka ukulandela imithetho yoyilo yomgangatho woshishino, ukukhetha imathiriyeli efanelekileyo kunye nobukhulu, kuthathelwa ingqalelo imiqobo yokuvelisa efana nobubanzi bomkhondo obuncinane kunye nesithuba, kunye nokuphepha iimilo ezintsonkothileyo okanye iimpawu ezinokongeza kubuntsonkotha bokuvelisa.
NgeNgcaciso yoHlobo kunye noLwayo:Ukukhetha okufanelekileyo ngohlobo kunye noyilo lwayo lubalulekile kwi-PCB ene-4. Vias, vias imfama, kwaye wangcwatywa vias ngamnye ukuba iingenelo kunye nemida. Ukuqwalasela ngononophelo ukusetyenziswa kwazo ngokusekelwe kuyilo oluntsonkothileyo kunye noxinaniso, kwaye uqinisekise ucoceko olululo kunye nezithuba ezijikeleze i-pass ukunqanda ukuphazamiseka komqondiso kunye nokudibanisa kombane.
Imithetho yoYilo yeSithuba, ukulandelela Ububanzi, kunye nokuCoca:Landela imithetho yoyilo ecetyiswayo yesithuba, ukulandelela ububanzi, kunye nococeko olunikezelwe ngumvelisi wePCB. Le mithetho iqinisekisa ukuba uyilo lunokwenziwa ngaphandle kweengxaki, ezifana neefutshane zombane okanye ukuthotywa komqondiso. Ukugcina isithuba esaneleyo phakathi komkhondo kunye namacandelo, ukugcina ukucoceka okufanelekileyo kwiindawo eziphezulu zombane, kunye nokusetyenziswa kobubanzi obufanelekileyo bokulandelela umthamo ofunekayo wangoku zizinto zonke ezibalulekileyo.
Sebenza kunye nomvelisi we-PCB ukulungiselela ukupakishwa okufanelekileyo:Sebenza kunye nomvelisi we-PCB ukumisela ugcino olulolona lwe-4-layer PCB. Izinto ekufuneka ziqwalaselwe ziquka iileya zobhedu, ukhetho lwemathiriyeli ye-dielectric kunye nokubekwa, ulawulo olunqwenelekayo lwe-impedance, kunye neemfuno zemfezeko yomqondiso. Ngokusebenza ngokusondeleyo nabavelisi, unokuqinisekisa ukuba uyilo lwePCB lulungelelaniswa namandla abo kunye neenkqubo zokuvelisa, okukhokelela kwimveliso esebenzayo nenexabiso eliphantsi.
Lilonke, ukuyila i-PCB ene-4-layer ifuna ukuqondwa ngokucokisekileyo kwe-manufacturability, ukubambelela kwezona zenzo zigqwesileyo ze-DFM, ukuqwalaselwa ngononophelo ngohlobo kunye noyilo, ukuthotyelwa kwemithetho yoyilo, kunye nentsebenziswano nomenzi we-PCB ukuphumeza ukupakishwa okufanelekileyo. Ngokuqwalasela ezi zinto, unokuphucula ukwenziwa, ukuthembeka, kunye nokusebenza koyilo lwePCB yakho.
4. Izinto eziluncedo kunye nezithintelo ze-4-layer PCB stackup:
- Ukwandisa ingqibelelo yesignali, kunciphisa ingxolo kunye nokunciphisa iziphumo ze-EMI.
- Ukuphuculwa kwamandla okuphumeza uyilo olunesantya esiphezulu.
-Ithuba lokonga isithuba se-electronics compact.
- Ukulinganiselwa okunokwenzeka kunye nemingeni yokuphumeza i-4-layer stack.
Izinto eziluncedo kwi-4-layer PCB stackup:
Ukwandiswa kweMbonakaliso yoMqondiso:
Umhlaba owongezelelweyo kunye neenqwelomoya zamandla kwi-4-layer stack zinceda ukunciphisa ingxolo yesignali kunye nokuqinisekisa ingqibelelo yesignali engcono yoyilo lwesantya esiphezulu. Inqwelomoya ephantsi isebenza njengenqwelomoya ethembekileyo, ukunciphisa i-signal crosstalk kunye nokuphucula ulawulo lwe-impedance.
Ingxolo eyehlisiwe kunye nempembelelo ye-EMI:
Ubukho bomhlaba kunye neenqwelomoya zamandla kwi-4-layer stack kunceda ukunciphisa ukuphazamiseka kwe-electromagnetic interference (EMI) ngokubonelela ngokhuselo kunye nokuphuculwa komgangatho wesignali. Oku kubonelela ngokunciphisa ingxolo engcono kwaye iqinisekisa ukuhanjiswa kwesignali ecacileyo.
Ukonyuka kwamandla okuphumeza uyilo olukwisantya esiphezulu:
Ngomaleko ongezelelweyo, abaqulunqi baneendlela ezininzi zokukhetha iindlela. Oku kuvumela uyilo oluntsonkothileyo olunesantya esiphezulu kunye neemfuno ezilawulwayo zokuthintela, ukunciphisa ukuncipha komqondiso kunye nokuphumeza ukusebenza okuthembekileyo kumaza aphezulu.
Inzuzo yokugcina indawo:
I-4-layer stacking ivumela ukuba kuqulunqwe ngakumbi kunye noyilo olusebenzayo. Ibonelela ngeendlela ezongezelelweyo zomzila kunye nokunciphisa imfuno yoqhagamshelwano olubanzi phakathi kwamacandelo, okukhokelela kwifom encinci yenkqubo ye-elektroniki ngokubanzi. Oku kuluncedo ngakumbi kwizinto zombane eziphathwayo okanye iiPCB ezixineneyo.
Unyino kunye nemiceli mngeni yokuphumeza i-4-layer stack:
Iindleko:
Ukuphumeza i-4-layer stackup kwandisa ixabiso elipheleleyo le-PCB xa kuthelekiswa ne-2-layer stackup. Iindleko ziphenjelelwa zizinto ezifana nenani leeleya, ukuntsokotha koyilo, kunye nenkqubo yokuvelisa efunekayo. Iimaleko ezongezelelweyo zifuna imathiriyeli eyongezelelweyo, iindlela ezichaneke ngakumbi zokuyila, kunye nesakhono sokuhamba phambili.
Ukuntsonkotha koYilo:
Ukuyila i-4-layer PCB kufuna ucwangciso olunenyameko kune-2-layer PCB. Iileyiti ezongezelelweyo zinika imingeni ekubekweni kwecandelo, kwindlela kunye nangocwangciso. Abaqulunqi kufuneka baqwalasele ngononophelo imfezeko yomqondiso, ulawulo lwe-impedance, kunye nokuhanjiswa kwamandla, okunokuba nzima ngakumbi kwaye kudle ixesha.
Unyino lwemveliso:
Ukuvelisa ii-PCB ezinomaleko-4 kufuna iinkqubo zokuvelisa eziphucukileyo kunye nobuchule. Abavelisi kufuneka bakwazi ukulungelelanisa ngokuchanekileyo kunye ne-laminate layers, ukulawula ubukhulu boluhlu ngalunye, kunye nokuqinisekisa ukulungelelaniswa okufanelekileyo kwe-drilled kunye ne-vias. Ayingabo bonke abavelisi bePCB abakwaziyo ukuvelisa ngokufanelekileyo iibhodi ezine-4.
Ingxolo kunye nokuphazamiseka:
Ngelixa i-4-layer stack-up inceda ukunciphisa ingxolo kunye ne-EMI, uyilo olungonelanga okanye ubuchule bokucwangcisa kusenokubangela ingxolo kunye nemiba yokuphazamiseka. Ukupakishwa komaleko okwenziwa ngokungafanelekanga okanye ukumiselwa komhlaba okungonelanga kunokukhokelela ekudibaneni okungeyonjongo kunye nokunciphisa umqondiso. Oku kufuna ukucwangciswa ngononophelo kunye nokuqwalaselwa koyilo loyilo kunye nokubekwa kwendiza yomhlaba.
Ulawulo lobushushu:
Ubukho bemigangatho eyongezelelweyo buchaphazela ukutshatyalaliswa kobushushu kunye nokulawulwa kwe-thermal. Uyilo oluxineneyo olunesithuba esilinganiselweyo phakathi kweeleya kunokukhokelela ekwandeni kokumelana nobushushu kunye nokwanda kobushushu. Oku kufuna ingqalelo ngononophelo lobeko lwecandelo, vias thermal, kunye noyilo thermal jikelele ukuphepha imiba ezishushu.
Kubalulekile ukuba abaqulunqi bavavanye ngononophelo iimfuno zabo, beqwalasela iingenelo kunye nemida ye-PCB ene-4-layer stackup, ukwenzela ukuba benze isigqibo esinolwazi malunga ne-stackup engcono yoyilo lwabo oluthile.
Isishwankathelo,ukufezekisa ugcino lwe-PCB ene-4-layer ibalulekile ekuqinisekiseni uyilo oluthembekileyo nolusebenza kakhulu lwe-elektroniki. Ngokuqonda iziseko, ukuqwalasela ubuchule bokuyila, kunye nokusebenzisana nabavelisi be-PCB, abayili banokuthatha ithuba lokusasazwa kwamandla okusebenzayo, imfezeko yomqondiso, kunye nokunciphisa iziphumo ze-EMI. Kufuneka kukhunjulwe ukuba uyilo oluyimpumelelo lwe-4-layer stack lufuna indlela enonophelo kunye nokuqwalaselwa kokubekwa kwecandelo, umzila, ulawulo lwe-thermal kunye nokwenziwa. Ke thatha ulwazi olunikiweyo kwesi sikhokelo kwaye uqalise uhambo lwakho lokufezekisa eyona 4-layer PCB stack kwiprojekthi yakho elandelayo!
Ixesha lokuposa: Aug-18-2023
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