Iibhodi zeSekethe eziyi-12 eziguquguqukayo zeHDI umngxuma oyimfama wePCB wokuntywiliselwa kweGolide

Iibhodi zeSekethe eziyi-12 eziguquguqukayo eziguquguqukayo HDI Umngxuma oyimfama wePCB wokuntywiliselwa kweGolide oFanelekileyo

Inkcazelo emfutshane:

Uhlobo lweMveliso: Iibhodi zeSekethe eziguquguqukayo eziyi-12
Ububanzi bomgca kunye nesithuba somgca: 0.1mm/0.1mm
Ubukhulu bebhodi: 1.6mm
Ubuncinane boMvula: 0.1mm
Ukutyeba kobhedu:18um,35um
Unyango loMphezulu:Igolide yokuntywiliselwa
Inkqubo eyodwa:HDI Blind Hole
Inkonzo yaseCapel:Uodolo lwePcb yesiNtu,Ukwenziwa kwePcb,Ukwenziwa kweMultilayer Pcb Manufacturing,Umvelisi wePcb yeCeramic,Fast Turn Custom Pcb,Hdi Pcb Prototype,Inkonzo zeNdibano zePcb
Ishishini esiliSebenzayo:Isixhobo soNyango, i-IOT, iTUT, i-UAV, i-Aviation, izithuthi, ezoNxibelelwano, uMthengi we-Electronics, uMkhosi, iAerospace, uLawulo lwezoShishino, ubukrelekrele bokwenziwa, i-EV, njl.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Iibhodi zeSekethe eziguquguqukayo zeCapel's 12 ye-HDI Umngxuma oyimfama we-PCB yokuntywiliselwa kweGolide

Ibonelela ngeZisombululo ezithembekileyo kubathengi bethu

-UCapel uneminyaka eyi-15 yamava obugcisa obuchwephesha-

Xa uthetha ngeebhodi zesekethe eziphambili, umntu akanakungazihoyi izibonelelo ezininzi ezinikezelwa ngamabhodi esekethe e-12-layer rigid-flex. Ezi bhodi ze-cutting-edge zibonisa i-high-density interconnect (HDI) i-vias eyimfama kunye nokugqiba igolide entywiliweyo, ezenza zilungele usetyenziso oluhlukeneyo.

Ibhodi yesekethe ye-12-layer rigid-flex ithatha i-design-effective stacked design, ine-flexibility egqwesileyo, kwaye ifanelekile kwizixhobo ze-elektroniki ezinzima. Ukudityaniswa kwemigangatho eqinile kunye neguquguqukayo ivumela ukudityaniswa ngokufanelekileyo kunye nokusetyenziswa kwendawo, ukuqinisekisa ukuba ezi bhodi zinokuhlangabezana neemfuno ezifunekayo ze-electronics zanamhlanje.

Enye yeenzuzo eziphambili ze-12-layer rigid-flex circuit boards kukukwazi ukuhlalisa i-vias eyimfama. I-vias eyimfama ngamalungu adityanisiweyo adibanisa iileya ezahlukeneyo zebhodi yesekethe. Ngokusebenzisa ii-vias ezingaboniyo, ukudityaniswa kombane kunokuhanjiswa ukusuka kumaleko angaphakathi ukuya kumaleko angaphandle, ukwandisa ukusebenza kunye nokusebenza kwebhodi.

Ezi bhodi zenziwe kusetyenziswa iteknoloji yanamhlanje kunye nezixhobo ezihamba phambili kwishishini. Ububanzi bomgca kunye nomgca womgca wenzelwe ukuchaneka kwe-0.1mm / 0.1mm, ukuqinisekisa ukunyaniseka kwesibonakaliso esiphezulu kunye nokunciphisa umngcipheko wokuphazamiseka komqondiso. Ubunzima bebhodi bugcinwe kwi-1.6mm, ukuphumeza ukulingana okugqibeleleyo phakathi kokuguquguquka kunye nokuqina.

Iibhodi zeSekethe eziguquguqukayo ezili-12 eziguquguqukayo HDI Umngxuma oyimfama wePCB wokuntywiliselwa kweGolide

Ukuqinisekisa umgangatho ophezulu womgangatho, ibhodi yesekethe ye-12-layer rigid-flex ingena kwinkqubo ekhethekileyo ebizwa ngokuba yi-immersion gold surface treatment. Olu nyango alugcini nje ukwandisa ukubonakala kwebhodi ngokubanzi, kodwa lubonelela ngokhuseleko oluphezulu kwi-oxidation kunye nokubola. Ukucwiliswa kwegolide yonyango yongeza ingqimba yokuthembeka kwibhodi yesekethe, iqinisekisa ubomi obude kunye nokusebenza okuzinzile.

Ukongeza, ezi bhodi zifumaneka kwiinketho ezahlukeneyo zobunzima bobhedu, kubandakanya i-18um kunye ne-35um. Ubunzima bobhedu bumisela umthamo wangoku wokuthwala kunye nokutshatyalaliswa kobushushu bebhodi. Ngokunikezela ngeendlela ezininzi zobunzima bobhedu, abavelisi babonelela abathengi ngokuguquguquka kokukhetha eyona ndlela ifanelekileyo kwisicelo sabo esithile.

Ibhodi yesekethe ye-12-layer rigid idlula kwinkqubo ekhethekileyo ebizwa ngokuba yi-high-density interconnect (HDI). I-HDI inceda ukwandisa amandla okuhamba kwezi bhodi, okukhokelela ekunyukeni koxinzelelo lwesekethe kunye nokuhanjiswa komqondiso ophuculweyo. Le nkqubo ekhethekileyo iqinisekisa ukuba ezi bhodi zihlangabezana neemfuno ezifunekayo zezicelo eziphezulu zokusebenza.

Ukongeza kwiinzuzo zabo zobugcisa, ezi bhodi nazo zihambelana nokusingqongileyo. Zenziwa kwizinto ezingenazo izinto ezinobungozi kwaye zithobela imigangatho yemo engqongileyo yamazwe ngamazwe. Ngokukhetha ibhodi yesekethe ye-12-layer rigid-flex, abathengi abakhethi kuphela iteknoloji yokusika, kodwa banegalelo kwikamva elizinzileyo.

Ukushwankathela, ibhodi yesekethe ye-12-layer-rigid-flex usebenzisa iteknoloji ye-HDI yokungaboni kunye nonyango lwegolide lokuntywiliselwa yinto entsha ephawulekayo kwibala leebhodi zesekethe eziphambili. Ububhetyebhetye bayo obukhethekileyo, uyilo oluchanekileyo kunye nobuchwephesha bobugcisa buyenza ibe lolona khetho lubalaseleyo kwizicelo ezahlukeneyo. Ebonisa imfezeko yomqondiso ophezulu, amandla omzila oxinana kakhulu kunye nenkqubo yokwenziwa kwemvelo ehambelana nokusingqongileyo, ezi bhodi zibubungqina benkqubela phambili yobuchwepheshe kunye nokuzinza.

I-Capel Flexible PCB kunye neRigid-Flex PCB yeNkqubo yokukwazi

Udidi	Inkqubo Yamandla	Udidi	Inkqubo Yamandla
Uhlobo lweMveliso	Umaleko omnye FPC / Umaleko kabini FPC Ii-Multi-layer FPC / Aluminium PCBs I-Rigid-Flex PCB	ILayers Number	1-30 umaleko FPC 2-32 umaleko Rigid-FlexPCB 1-60 iileya Rigid PCB Iibhodi zeHDI
Ubungakanani obukhulu bokuVeliswa	Umaleko omnye FPC 4000mm Imigangatho ephindwe kabini FPC 1200mm Imigangatho emininzi yeFPC 750mm I-Rigid-Flex PCB 750mm	I-Insulating Layer Ukutyeba	27.5um / 37.5/ 50um / 65/ 75um / 100um / 125um/150um
Ukutyeba kweBhodi	I-FPC 0.06mm - 0.4mm I-Rigid-Flex PCB 0.25 - 6.0mm	Ukunyamezela kwe-PTH Ubungakanani	±0.075mm
Umphezulu Gqiba	Ukuntywiliselwa kweGolide / ukuntywiliselwa ISilivere/uKutyalwa ngeGolide/uKutyathwa kweTin/OSP	Stiffener	FR4 / PI / PET / SUS / PSA / Alu
Ubungakanani beSemicircle Orifice	Ubuncinci 0.4mm	Min Line Isithuba/ ububanzi	0.045mm/0.045mm
Ukutyeba Ukunyamezela	±0.03mm	Impedance	50Ω-120Ω
Ukutyeba kweFoil yobhedu	9um/12um/18um/35um/70um/100um	Impedance Iyalawulwa Ukunyamezelana	±10%
Ukunyamezela kwe-NPTH Ubungakanani	±0.05mm	Ububanzi beMin Flush	0.80mm
Min Via Hole	0.1mm	Phumeza Umgangatho	GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III

ICapel yenza iBhodi yeSekethe eFlexileyo ngeminyaka eyi-15 yamava ngobungcali bethu

Iileyiti ezi-2 ezinamacala amabini eFpc Pcb + Icwecwe leNickel elicocekileyo elifakwe kwibhetri yaMandla amatsha

Iileya ezi-2 ezinamacala amabini Fpc Pcb

I-4-imigangatho ye-Rigid-Flex PCB

8 umaleko HDI PCBs

Uvavanyo kunye nezixhobo zokuHlola

Uvavanyo lweMicroscope

Ukuhlolwa kwe-AOI

Uvavanyo lwe-2D

Uvavanyo lwe-Impedans

Uvavanyo lweRoHS

Flying Probe

Umvavanyi othe tye

Ukugoba iTeste

Inkonzo yePCB eyenziwe ngokwezifiso yaseCapel kunye neminyaka eyi-15 yamava

Ukuba neefektri ezi-3 zeFlexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
IiNjineli ezingama-300+ zibonelela ngenkxaso yobuchwephesha yokuthengisa kwangaphambili kunye nasemva kokuthengisa kwi-Intanethi;
1-30 umaleko FPC, 2-32 umaleko Rigid-FlexPCB, 1-60 umaleko Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCB, Single-sided PCB, Iibhodi zeSekethe ezinamacala amabini, iibhodi eziHollow, Rogers PCB, rf PCB, Metal Core PCB, Iibhodi zeNkqubo eziZodwa, iCeramic PCB, iAluminium PCB , I-SMT & PTH Assembly, PCB Prototype Service.
Ukubonelela ngenkonzo ye-PCB yePrototyping yeeyure ezingama-24,Iibhetshi ezincinci zeebhodi zesekethe ziya kuhanjiswa ngeentsuku ze-5-7, iMisa yeMveliso yeebhodi zePCB iya kuhanjiswa kwiiveki ezi-2-3;
Amashishini esiwasebenzelayo: Izixhobo zonyango, i-IOT, iTUT, i-UAV, i-Aviation, i-Automotive, i-Telecommunications, i-Electronics yabathengi, i-Military, i-Aerospace, i-Industrial Control, i-Artificial Intelligence, i-EV, njl.
Isakhono sethu seMveliso:
Umthamo wemveliso we-FPC kunye neRigid-Flex PCB unokufikelela ngaphezulu kwe-150000sqm ngenyanga,
Umthamo wemveliso wePCB unokufikelela kwi-80000sqm ngenyanga,
PCB Ukuhlanganisa umthamo kumacandelo 150,000,000 ngenyanga.