Isixhobo soNyango se-Infrared Analyzer
Iimfuno zobugcisa | ||||||
Uhlobo lwemveliso | Ibhodi ye-Pcb yeSekethe ye-Flex emacala amabini | |||||
Inani lomaleko | 2 Iileya | |||||
Ububanzi bomgca kunye nesithuba somgca | 0.12/0.1mm | |||||
Ubukhulu bebhodi | 0.15mm | |||||
Ukutyeba kobhedu | 18um | |||||
Ubuncinane boMvula | 0.15mm | |||||
I-Flame Retardant | 94V0 | |||||
Unyango loMphezulu | Ukuntywiliselwa kweGolide | |||||
Umbala weMaski yeSolder | Lubhelu | |||||
Ukuqina | PIFR4 | |||||
Isicelo | Isixhobo soNyango | |||||
Isixhobo sosetyenziso | I-Infrared Analyzer |
Isifundo: Isixhobo sonyango somhlalutyi we-infrared 2-layer flexible PCB board
Yazisa:
Iibhodi ezi-2 ze-PCB eziguquguqukayokuhlalutyi lwezixhobo zonyango lwe-infrared zizinto ezibalulekileyo ekusebenzeni ngokubanzi kunye nokusebenza kwesixhobo.Olu hlalutyo lwemeko luya kugxininisa kwimiba yobugcisa bemveliso, kubandakanywa ububanzi bomgca kunye nesithuba, ubukhulu bebhodi, ubukhulu bobhedu, i-aperture encinci, i-flame retardant grade, unyango lomphezulu, umbala we-solder mask, ukuqina, njl. kunye nezixhobo.
Uhlobo lwemveliso:
Ibhodi ye-PCB ene-2-layer eguquguqukayoLe mveliso yibhodi ye-PCB ene-2-layer flexible.Ezi phaneli zenzelwe ukuba zibe khaphukhaphu kwaye ziguquguquke, zizenze zilungele izicelo apho iipaneli kufuneka zihambelane nemo ethile okanye zingene kwiindawo ezixineneyo.
Iinkcukacha zobugcisa:
Ububanzi bomgca kunye nesithuba:Ububanzi bomgca webhodi yePCB kunye nemilinganiselo yendawo ibalulekile ekuqinisekiseni intembeko yomqondiso efanelekileyo kunye nokuthembeka.Kulo mzekelo, ububanzi bomgca ngu-0.12mm kunye nomgca we-0.1mm, ukuqinisekisa ukuchaneka kokudluliselwa kwesignali.
Ubukhulu bebhodi:I-0.15mm ubukhulu bebhodi bumisela ukuguquguquka ngokubanzi kunye nokuqina kwe-PCB.Oku kuqwalasela kubalulekile ukuqinisekisa ukuba ibhodi inokumelana noxinzelelo oluhambelana nokugoba okanye ukugoba ngaphandle kokuchaphazela ukusebenza kwayo.
Ukutyeba kobhedu:Ubungqingqwa be-18um bobhedu bubonelela nge-conductivity efunekayo ukuhambisa imiqondiso kwiPCB.Olu ngqingqwa lukhethwe ngononophelo ukulungelelanisa i-conductivity kunye nokuguquguquka kwebhodi ngokubanzi.
Ubuncinci bedayamitha yomngxuma:Ubuncinane bomngxuma wedayamitha eyi-0.15mm ibhekisa kubungakanani bomngxuma obuncinane obunokugrunjwa kwiPCB.Oku kuchanekileyo kubalulekile ukulungiselela amacandelo kunye nokuqinisekisa uqhagamshelwano olufanelekileyo.
Ukusilela komlilo:Ibanga elibuyisela idangatye lifikelela kwi-94V0, libonisa ukuba izinto zePCB zinokumelana nomlilo ophezulu kwaye zizicima.Oku kubalulekile kwingqwalasela yokhuseleko, ngakumbi kwiinkqubo zezixhobo zonyango.
Unyango lomphezulu:Unyango lwegolide oluntywilisiweyo lune-conductivity egqwesileyo kunye nokuxhathisa umhlwa.Iqinisekisa uqhagamshelo oluthembekileyo kunye nokuzinza kwexesha elide lePCB.
Imibala Yemaski yeSolder:Umbala ophuzi wokumelana ne-welding ibonisa izinto ezithile okanye iingubo ezisetyenziselwa inkqubo ye-welding.Umbala omthubi unokukhethwa ngenxa yezizathu zobuhle okanye ukwahlula indawo ethile kwi-PCB.
Ukuqina:PCBs ziyilwe kunye bhetyebhetye engqondweni kwaye indibaniselwano yemathiriyeli ingasetyenziselwa ukufikelela ukuqina olufunekayo.Kule meko, izinto ezifana ne-PI (Polyimide) kunye ne-FR4 (i-Flame Retardant 4) ingasetyenziselwa ukubonelela ngebhalansi efunekayo phakathi kokuguquguquka kunye nokuqina.
Usetyenziso kunye neZixhobo:Ibhodi ye-PCB eguquguqukayo e-2 eyenzelwe ngokukodwa izixhobo zonyango zomhlalutyi we-infrared.Ezi zixhobo zisebenzisa itekhnoloji ye-infrared ukuhlalutya kunye nokulinganisa iiparamitha ezahlukeneyo kwiisampulu zonyango.I-PCB eguquguqukayo yenza isixhobo sihlangane, sikhaphukhaphu kwaye siyilwe ngokwe-ergonomically kuzo zombini izicelo zonyango eziphathwayo nezimileyo.
Ixesha lokuposa: Sep-07-2023
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